JPS5929036U - Ｌｓｉのチツプ実装構造 - Google Patents

Ｌｓｉのチツプ実装構造

Info

Publication number
JPS5929036U
JPS5929036U JP1982124763U JP12476382U JPS5929036U JP S5929036 U JPS5929036 U JP S5929036U JP 1982124763 U JP1982124763 U JP 1982124763U JP 12476382 U JP12476382 U JP 12476382U JP S5929036 U JPS5929036 U JP S5929036U
Authority
JP
Japan
Prior art keywords
chip
mounting structure
chip mounting
pad
lsi chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982124763U
Other languages
English (en)
Inventor
本田　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982124763U priority Critical patent/JPS5929036U/ja
Publication of JPS5929036U publication Critical patent/JPS5929036U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のＬＳＩチップ実装構造を示す斜視図、第
２図、第３図はそれぞれ本考案の実施例の構成要素であ
るベースチップを示す斜視図、第４図は本考案の実施例
のＬＳＩチップ実装構造を示す　　゛斜視図、第５図は
第４図のＸ−Ｘ断面を示す断面図である。 尚、図において、１・・・・・・チップ、２．３２・・
・・・・ケース、３．１２・・・・・・外部接続パッド
、４．３４・・・・・・ケースパッド、５．３５・・・
・・・ワイヤ、１０・・・・・・ベースチップ、１１．
２１・・・・・・チップ相互接続パッド、２０・・・・
・・サブチップである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外部接続パッドとチップ相互接続パッドを持つベースチ
    ップと、チップ相互接続パッドをもつサブチップを、該
    チップ相互接続パッドが接続するように一体化して、ケ
    ースに収納し、該ケースのケースパッドと該ベースチッ
    プの該外部接続パッドをワイヤで結線した事を特徴とす
    るＬＳＩのチップ実装構造。
JP1982124763U 1982-08-18 1982-08-18 Ｌｓｉのチツプ実装構造 Pending JPS5929036U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982124763U JPS5929036U (ja) 1982-08-18 1982-08-18 Ｌｓｉのチツプ実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982124763U JPS5929036U (ja) 1982-08-18 1982-08-18 Ｌｓｉのチツプ実装構造

Publications (1)

Publication Number Publication Date
JPS5929036U true JPS5929036U (ja) 1984-02-23

Family

ID=30284288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982124763U Pending JPS5929036U (ja) 1982-08-18 1982-08-18 Ｌｓｉのチツプ実装構造

Country Status (1)

Country Link
JP (1) JPS5929036U (ja)

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