JPS59500338A - １導体板の両面を電気的に接続する方法 - Google Patents

１導体板の両面を電気的に接続する方法

Info

Publication number
JPS59500338A
JPS59500338A JP58500607A JP50060783A JPS59500338A JP S59500338 A JPS59500338 A JP S59500338A JP 58500607 A JP58500607 A JP 58500607A JP 50060783 A JP50060783 A JP 50060783A JP S59500338 A JPS59500338 A JP S59500338A
Authority
JP
Japan
Prior art keywords
conductor plate
conductive
punch
web
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58500607A
Other languages
English (en)
Japanese (ja)
Inventor
シユタイン・ヘルム−ト
Original Assignee
ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング filed Critical ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Publication of JPS59500338A publication Critical patent/JPS59500338A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP58500607A 1982-03-03 1983-02-05 １導体板の両面を電気的に接続する方法 Pending JPS59500338A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE32075855DK 1982-03-03
DE3207585A DE3207585C2 (de) 1982-03-03 1982-03-03 Verfahren zur Herstellung elektrischer Verbindungen zwischen den beiden Oberflächen einer Leiterplatte
PCT/DE1983/000019 WO1983003182A1 (fr) 1982-03-03 1983-02-05 Procede pour la realisation de connexions electriques entre les deux surfaces d'une plaque de circuits imprimes

Publications (1)

Publication Number Publication Date
JPS59500338A true JPS59500338A (ja) 1984-03-01

Family

ID=6157170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58500607A Pending JPS59500338A (ja) 1982-03-03 1983-02-05 １導体板の両面を電気的に接続する方法

Country Status (5)

Country Link
US (1) US4539747A (fr)
EP (1) EP0102964B1 (fr)
JP (1) JPS59500338A (fr)
DE (2) DE3207585C2 (fr)
WO (1) WO1983003182A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
US6641860B1 (en) 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
EP1558373B1 (fr) 2002-09-09 2006-12-13 International Business Machines Corporation Impression sur un support
GB2409935B (en) * 2004-01-09 2007-02-28 Zarlink Semiconductor Ltd Electronic assembly
US20050195528A1 (en) * 2004-03-05 2005-09-08 Bennin Jeffry S. Coined ground features for integrated lead suspensions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324826A (en) * 1963-01-22 1967-06-13 Rca Corp Apparatus for metallizing a wafer
DE1490473A1 (de) * 1963-10-07 1969-06-04 Siemens Ag Verfahren zum Herstellen von Traegerplaettchen fuer Miniaturbaugruppen und Vorrichtung zur Durchfuehrung dieses Verfahrens
GB1196201A (en) * 1967-09-19 1970-06-24 Tokyo Shibaura Electric Co A method of Printing Electrical Circuits onto Substrates
US3589938A (en) * 1968-07-11 1971-06-29 Western Electric Co Methods for applying liquid to articles without touching the articles
US4289384A (en) * 1979-04-30 1981-09-15 Bell & Howell Company Electrode structures and interconnecting system
DE3145584C2 (de) * 1981-11-17 1984-03-08 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum Durchkontaktieren einer Leiterplatte

Also Published As

Publication number Publication date
DE3207585C2 (de) 1984-03-08
WO1983003182A1 (fr) 1983-09-15
EP0102964A1 (fr) 1984-03-21
DE3207585A1 (de) 1983-09-15
EP0102964B1 (fr) 1986-05-28
US4539747A (en) 1985-09-10
DE3363638D1 (en) 1986-07-03

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