JPS5952566A - Application of viscous substance - Google Patents
Application of viscous substanceInfo
- Publication number
- JPS5952566A JPS5952566A JP57163004A JP16300482A JPS5952566A JP S5952566 A JPS5952566 A JP S5952566A JP 57163004 A JP57163004 A JP 57163004A JP 16300482 A JP16300482 A JP 16300482A JP S5952566 A JPS5952566 A JP S5952566A
- Authority
- JP
- Japan
- Prior art keywords
- viscous substance
- pins
- viscous
- coated
- engraved plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、クリーム状ハンダ等の粘性物彊の塗出方法に
関し、その目的とするところは、プリント基板等の被塗
出物体に段差のある個所への塗出と多数個所への同時塗
出とを可能にすることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for applying a viscous substance such as creamy solder, and its purpose is to apply a viscous substance such as a printed circuit board to a place where there is a step on an object to be applied, such as a printed circuit board. The purpose is to enable simultaneous application to multiple locations.
従来の塗出方法は、第４図に示すように、円筒容器０１
）の中にクリーム状ハンダから成る粘性物質（３７）を
充填し、その上部からピストン（３３）で押え利ける。The conventional coating method uses a cylindrical container 01 as shown in FIG.
) is filled with a viscous substance (37) consisting of creamy solder, and is pressed down from above with a piston (33).
円筒容器（’Ｉ１１の上部には押えカバーＣ１４１を取
りつけ、その中心に圧縮空気価）の通気穴Ｃ’ｔ！ｌ）
を設け、エアーホース（３国と接続する。該ピストン（
３１１１に対し７上方向から圧縮空気を流入制御するこ
とに依り、円筒容器０１）の下部に取り付けだノズルＣ
Ｉ渇より粘性物質４３８＋が塗出される。この塗出器を
よ、プリント基板等の被塗出物体の必要個所毎に移動し
て塗出される。Ventilation hole C't of the cylindrical container (with the presser cover C141 attached to the top of 'I11 and the compressed air value in the center)! l)
and connect the air hose (3 countries) with the piston (
Nozzle C is installed at the bottom of the cylindrical container 01) by controlling the inflow of compressed air from above to 3111.
A viscous substance 438+ is applied due to dryness. This applicator moves the object to be coated, such as a printed circuit board, to each necessary location.
しかし、前記従来例の塗出器は、円筒容器（３１）に充
填された粘体物質０７）の交換に時間を多く要する。However, in the conventional applicator, it takes a lot of time to replace the viscous substance 07) filled in the cylindrical container (31).
また、粘体物質Ｑ７）への気泡混入に依る後ダレが起る
。多数個所への同時塗出が困難等の種々の欠点があった
。また、従来の印刷方法について第５図によシ説明する
。本体ペース（４１）上に左右に平行移動する構造を有
するスライドベット（４力があり、該ベラ） （４２１
の中央にはプリント基板等の被印刷物（４：９を保持す
るためのペットの窪み（４４）を設け、該窪み（４４）
に平面形状の被印刷物（４：９をセットする。印刷を行
う場合、スライドベット（４２１はエアーシリンダー（
４（ルに依シ図面上右方向に移動させる。この時、製版
（２）上にはクリーム状ハンダから成る粘性物質（１＋
）を酢蛸しておき、エアーシリンダー（７）に依シス夛
しッパー（９）を下げる。この時１．製版（２）とスク
レッパー（９）どの間隔Ｎ： ０．５〜ＩＷ程度にする
。ヌ、スキージ（３）のエアーシリンダー（６）に依り
上方に上げておく、スキージ（３）及びスクレッパー（
９）を増り伺けた取伺板（５）をエアーシリンダー（８
）で図面上左方向に移動すると、製Ｗ（２）上には粘性
物質（１１υが一定の厚みでコーティングされる。ぞし
２て取付板（５）が最も左へ行った状卯でスクレッパ−
（９）ｔまエアーシリンダー（７）で上昇し、スキージ
（３）をエアーシリンダー（６）で下げる。この時、ス
キージ（３）は、製版（２）に対して１〜３Ｋｙの圧力
をかけ、前記取付板（５）をシリンター（８）に依り右
方向に移動する。取付板（５）が最も右へ移動した状態
でスキージ（３７をシリンダー（６）で上昇する。スラ
イドペラ）＋４２１ｉ、Ｊニジリンダ−（仙に依り左方
向に移動する（元の位置に戻す）。In addition, after-sagging occurs due to air bubbles being mixed into the viscous substance Q7). There were various drawbacks such as difficulty in coating multiple areas at the same time. Further, a conventional printing method will be explained with reference to FIG. Slide bed (421
A pet depression (44) is provided in the center to hold a printed circuit board (4:9 ratio), and the depression (44)
Set a flat printing material (4:9 ratio) on the slide bed (421 is an air cylinder (4:9).
4 (depending on the plate). At this time, a viscous substance (1+) consisting of creamy solder is placed on the plate (2).
) and then lower the air cylinder (7) to the air cylinder (9). At this time 1. What distance N between the plate making (2) and the scraper (9) should be approximately 0.5 to IW. Raise the squeegee (3) and scraper (3) upwards using the air cylinder (6) of the squeegee (3).
9) was added to the air cylinder (8).
) to the left in the drawing, a viscous substance (11υ) is coated on the W (2) with a constant thickness. −
(9) Go up with the air cylinder (7) until t, then lower the squeegee (3) with the air cylinder (6). At this time, the squeegee (3) applies a pressure of 1 to 3 Ky to the plate making (2), and the mounting plate (5) is moved to the right by the cylinder (8). With the mounting plate (5) moved to the farthest right, raise the squeegee (37) with the cylinder (6). Slide propeller)
その結果、前記被印刷物（４３１上には製版（２）に形
成された穴形状（パターン形状）に対応した粘性物質Ｏ
ｆ）が印刷形成される。As a result, a viscous substance O corresponding to the hole shape (pattern shape) formed on the printing plate (2) is formed on the printing substrate (431).
f) is printed.
しかし、前記従来例の印刷方法には、被印刷物が平面形
状である場合は良いが、プリント基板上に種々の個別部
品が形成されていたり、まだは、プリント基板が枠体に
組込１れているように、被印刷物に高低段差がある場合
は印刷ｔ：１．不ηＪ能である等の欠点があった。However, although the conventional printing method described above is suitable when the substrate to be printed has a planar shape, there are cases where various individual parts are formed on the printed circuit board, or where the printed circuit board is not yet assembled into the frame. As shown in the figure, if there is a height difference in the printing material, printing t: 1. It had drawbacks such as poor performance.
本発明は」−記欠点を解消したもので、以ド、その一実
施例を図面により説明する。The present invention solves the above-mentioned drawbacks, and one embodiment thereof will be described below with reference to the drawings.
第１図は本発明の粘性物質の塗出方法の要部概略正面図
、第２図は同製版の斜視図、第３図は粘性物質を被塗出
物体に塗出する説明図であり、ここで、これ胡の図面に
よって、本発明の全体的な構成、並びに動作を説明する
と、第２図第３図において、製版枠（１）に取り伺けだ
板状の製版（２）は穴（２ａ）を有する構造であシ、紋
穴（２ａ）に粘性物質ｔｌｔｌ＋を予め充填しておき、
紋穴（２ａ）上部に対応させて押出しビン０４を配置し
、紋穴（２ａ）下部に被塗出物体θｔを配設した構造で
ある。次に第１図に依りその動作を説明する。なお、本
発明における粘性物質とは、例えばクリーム状ハンダ、
パテ状の接着剤及びグリース等□である。FIG. 1 is a schematic front view of the main part of the method for applying a viscous substance of the present invention, FIG. 2 is a perspective view of the same plate making, and FIG. 3 is an explanatory diagram of applying the viscous substance to an object. Here, the overall structure and operation of the present invention will be explained with reference to the drawings. In Fig. 2, Fig. (2a), the hole (2a) is filled with a viscous substance tltl+ in advance,
The extrusion bottle 04 is arranged in correspondence with the upper part of the pattern hole (2a), and the object to be coated θt is arranged in the lower part of the pattern hole (2a). Next, the operation will be explained with reference to FIG. Note that the viscous substance in the present invention includes, for example, creamy solder,
Putty adhesive, grease, etc. □.
先ず、製版（２）の穴（２ａ）に粘性物質（Ｉｌｌ）を
充填する方法に１゛、通當使用されているスクリーン印
刷法と同じである。製版（２）に粘性□物質（１（ｌを
充緬ず名前に、予めスライドプレー１−″（団結シリン
クー（＋３に依り図面」１左へＩｌｌかしておく。そこ
で、前述の印刷方法で示しだ様に、スキージ（３）及び
スクレッパー（９）を１０いて製版（２）の穴（２ａ）
に粘性物ｆ（ｆｌａｔを充崩し、その後、スライドプレ
ート（１１）をシリンダー（１２１に依り元へ戻す。First, the method of filling the holes (2a) of the plate (2) with the viscous substance (Ill) is the same as the commonly used screen printing method. In the plate making (2), fill the viscous □ substance (1 (l) with the name and slide the slide play 1-'' (unity silicone (+3) according to the drawing) in advance to the left. Therefore, using the printing method described above, As shown, use the squeegee (3) and scraper (9) to the hole (2a) of the plate making (2).
The viscous material f (flat) is filled and collapsed, and then the slide plate (11) is returned to its original position by the cylinder (121).
次に、製版（２口重部にはビンブロック（１１が配植さ
れ、該ピンブロック０５１には前記′製版（２）の穴（
２ａ）に対応した複数本の押出１７ビン（１４）が各々
バネ（１３１によシ移動司能に保持されてい暮。そ１７
て、該ビルブロック（＋５１がアクチェータ（１６タに
依り下降し、ＩＩ′Ｊ版（２）の穴（２ａ）に充填した
粘性物＊Ｏ（１＋は押出しビン０４）によシ押出され、
該押出しビン（（滲の先端部に付石する。更に、押出し
ビン０滲を下降さぜると、表面に個別部品（２２）を有
するプリント基板（ａ）を枠体Ｑ漕に絹込んだものから
成る被塗出物体（２）の、塗出必要な部分の先ず高位置
ａｌｌに成る押出しビン（１４）が当たる。また、更に
押出し２ピン（１４）を下降させると、次には塗出必要
な部分である低位ｆｆｆ （Ｌｌに他の押出しビン（１
４）が当たる。この時、高位ＩＦｆＱＩ）に当った押出
［７ビン（１４）は前ｈ「：バネ（１３）の弾圧力に抗
してピンブロック（【５１内にその移動距離だり移動す
るようになっている。押出しビン０１１）の肖った個所
は粘性物質Ｏ＠が付着する。なお、第１図において、（
１７）は位置決め板、（＋８１は位置決めブロック、（
２１１は枠体（Ｊ：ｌｉに取り伺けた支切り板である。Next, a bottle block (11) is placed in the plate-making (two-mouthed part), and the pin block 051 is filled with the holes (
A plurality of extrusion bottles (14) corresponding to 2a) are each movably held by a spring (131).
Then, the building block (+51 is lowered by the actuator (16) and extruded by the viscous material *O (1+ is the extrusion bottle 04) filled in the hole (2a) of the II'J version (2),
A stone is attached to the tip of the extrusion bottle.Furthermore, when the extrusion bottle 0 is lowered, the printed circuit board (a) having the individual parts (22) on the surface is inserted into the frame Q column. The part of the object (2) to be coated that needs to be coated is first hit by the extrusion bottle (14) which is located at a high position.Furthermore, when the two extrusion pins (14) are lowered further, the part that needs to be coated is hit. The lower fff (Ll) is the part that needs to be removed from the other extrusion bin (1
4) is correct. At this time, the extrusion [7 bottle (14) that hit the high-level IFfQI] resists the elastic force of the spring (13) and moves within the pin block ([51]). The viscous substance O@ adheres to the part where the extrusion bottle 011) is exposed.In addition, in Fig. 1, (
17) is the positioning plate, (+81 is the positioning block, (
Reference numeral 211 is a support plate that can be accessed from the frame body (J:li).
斜上のように、本発明は、所定の個所に初数の穴（２ａ
）を設りだ製版（２）の紋穴（２ａ）に、粘性物η（ｌ
Ｏ）を充」ノＱｊ、、前記穴（２ａ）に対応１．た位置
に移ＩＩＩ可能な押出しビン０４）を有するピンブロッ
ク（１５）を押し下り°ることに依り、′該押出１〜ビ
ン（１４）の先端部に前記粘性物質Ｃｌ１１を刺着させ
、更に、押出ｉピンＯａを押し下げて粘性物質０１υを
被塗出物体θ引で付着するものであり、被塗出物体（１
！陣に高低の段差がある個所へも線用が行え、且つ、多
数個所へ同時に検出が可能である。また、粘性物質（１
０）の交換も容易に行える等の顕著な効果を奏する。As shown above, the present invention provides an initial number of holes (2a
) is placed in the hole (2a) of the plate making (2), and the viscous material η(l
1) corresponding to the hole (2a). By pushing down the pin block (15) having the extrusion bottle 04) which can be moved to the position of , the extrusion i-pin Oa is pushed down to attach the viscous substance 01υ to the object to be coated by pulling θ, and the object to be coated (1
! Lines can be applied to areas where there are differences in height and height, and multiple areas can be detected at the same time. In addition, viscous substances (1
0) can be easily replaced.
第１図は本発明の粘性物質の塗出方法に係る塗出装置全
体を示す俄部概略正面図、第２図は同装置に使用する製
版の斜視図、第３図は粘性物ａを被塗出物体に塗出する
説明図、第４図は従来の塗出方法に係る円筒容器の断面
図、第５図は従来の印刷方法に係るスクリーン印刷機を
示す概略正面図である。
（２）製版、（２ａ）製版（２）の穴、（則粘性物贋、
（１３）バネ、（１４）押出しビン、（１５１ピンブロ
ツク、（１９）被塗出物体
第１図
３５５−
第２図FIG. 1 is a schematic front view of the entire coating device according to the viscous substance coating method of the present invention, FIG. 2 is a perspective view of a plate making device used in the device, and FIG. FIG. 4 is a cross-sectional view of a cylindrical container according to a conventional coating method, and FIG. 5 is a schematic front view showing a screen printing machine according to a conventional printing method. (2) Plate making, (2a) Plate making (2) hole, (rule viscous material counterfeiting,
(13) Spring, (14) Extrusion bottle, (151 pin block, (19) Object to be coated.
Claims (1)
を充填し、前記穴に対応した位置に移動可能な押出しピ
ンを有するピンブロックを押し下げることに依り、該押
出しビンの先端部に前記粘性物質を付着させ、更に前記
押出ｌ−ビンを押し下げて、前記粘性物質を被塗出物体
に付着することを特徴とする粘性物質の塗出方法。By filling the holes of a plate-making plate with a plurality of holes at predetermined locations with a viscous substance and pushing down a pin block having an extrusion pin that is movable to a position corresponding to the hole, the tip of the extrusion bottle is A method for applying a viscous substance, characterized in that the viscous substance is applied to an object to be coated by further pressing down the extrusion l-bottle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163004A JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163004A JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5952566A true JPS5952566A (en) | 1984-03-27 |
| JPH033542B2 JPH033542B2 (en) | 1991-01-18 |
Family
ID=15765361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57163004A Granted JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952566A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223193A (en) * | 1984-03-06 | 1985-11-07 | ノ−ザン・テレコム・リミテツド | Device and method for coating solder paste on circuit board |
| EP1328009A3 (en) * | 2002-01-15 | 2005-08-03 | Robert Bosch Gmbh | Apparatus for mounting an element on a substrate |
| CN110899892A (en) * | 2019-12-16 | 2020-03-24 | 王强 | Electrical component pin positioning and welding integrated machine for assembling circuit board |
-
1982
- 1982-09-18 JP JP57163004A patent/JPS5952566A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223193A (en) * | 1984-03-06 | 1985-11-07 | ノ−ザン・テレコム・リミテツド | Device and method for coating solder paste on circuit board |
| EP1328009A3 (en) * | 2002-01-15 | 2005-08-03 | Robert Bosch Gmbh | Apparatus for mounting an element on a substrate |
| CN110899892A (en) * | 2019-12-16 | 2020-03-24 | 王强 | Electrical component pin positioning and welding integrated machine for assembling circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH033542B2 (en) | 1991-01-18 |
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