JPS596838U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS596838U
JPS596838U JP1982103418U JP10341882U JPS596838U JP S596838 U JPS596838 U JP S596838U JP 1982103418 U JP1982103418 U JP 1982103418U JP 10341882 U JP10341882 U JP 10341882U JP S596838 U JPS596838 U JP S596838U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
resin
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982103418U
Other languages
English (en)
Inventor
井内　隆敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1982103418U priority Critical patent/JPS596838U/ja
Publication of JPS596838U publication Critical patent/JPS596838U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の混成ＩＣの樹脂グイボンド部の構造を示
す断面図、第２図はこの考案の一実施例′を示す断面図
である。 図中、１は基板、２は電極、３はグイボンド用樹脂、４
は半導体チップ、５は押え器、６は環状の堤である。尚
、図中の同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に設けられた、半導体チップを樹脂グイボンドする
    ための電極の用便に、グイボンド用樹脂を透過しない材
    質で構成された環状の堤を設け、゛この堤内に半導体チ
    ップを樹脂グイボンドしたことを特徴とする混成集積回
    路装置。
JP1982103418U 1982-07-06 1982-07-06 混成集積回路装置 Pending JPS596838U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982103418U JPS596838U (ja) 1982-07-06 1982-07-06 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982103418U JPS596838U (ja) 1982-07-06 1982-07-06 混成集積回路装置

Publications (1)

Publication Number Publication Date
JPS596838U true JPS596838U (ja) 1984-01-17

Family

ID=30243306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982103418U Pending JPS596838U (ja) 1982-07-06 1982-07-06 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS596838U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193459A (ja) * 1984-03-15 1985-10-01 伊藤超短波株式会社 治療器
JPS60193460A (ja) * 1984-03-16 1985-10-01 伊藤超短波株式会社 治療器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193459A (ja) * 1984-03-15 1985-10-01 伊藤超短波株式会社 治療器
JPS60193460A (ja) * 1984-03-16 1985-10-01 伊藤超短波株式会社 治療器

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