JPS5887355U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5887355U
JPS5887355U JP1981183043U JP18304381U JPS5887355U JP S5887355 U JPS5887355 U JP S5887355U JP 1981183043 U JP1981183043 U JP 1981183043U JP 18304381 U JP18304381 U JP 18304381U JP S5887355 U JPS5887355 U JP S5887355U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
resin
recorded
semiconductor device
metal coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981183043U
Other languages
English (en)
Inventor
松島　政数
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981183043U priority Critical patent/JPS5887355U/ja
Publication of JPS5887355U publication Critical patent/JPS5887355U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは従来の半導体装置の平面図および断
面図、第２図ａ、　　ｂは本考案の一実施例を示す平面
図および断面図、−第３図は本考案の他の実施例を示す
断面図である。 １・・・樹脂、２・・・半導体素子、３・・・金属被膜
、４・・・外部リード、５・・・半導体素子載置部、６
・・・結線ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止形半導体装置において、封止樹脂表面に金属被
    膜を設けたことを特徴とする半導体装置。
JP1981183043U 1981-12-09 1981-12-09 半導体装置 Pending JPS5887355U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981183043U JPS5887355U (ja) 1981-12-09 1981-12-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981183043U JPS5887355U (ja) 1981-12-09 1981-12-09 半導体装置

Publications (1)

Publication Number Publication Date
JPS5887355U true JPS5887355U (ja) 1983-06-14

Family

ID=29981952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981183043U Pending JPS5887355U (ja) 1981-12-09 1981-12-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5887355U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (ja) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp 薄型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (ja) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp 薄型半導体装置

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