JPS599059A - Electrostatic recording head assembly - Google Patents

Abstract

PURPOSE:To effectively connect a head for static electricity recording to its drive circuit by such an arrangement wherein a bonding pad is divided into several blocks and a multi-layer printed ceramic substrate composed of multiple layers, each is expanded for each block, is used. CONSTITUTION:A multilayer printed ceramic substrate B' having bonding pads 14a arranged at the same pitch, 1:1, as that of recording electrodes 11 of a head main body A' is used and those bonding pads 14a are expanded (pitch is expanded) into multiple layers by block, each differs in level from others. In other words, exposed portions 11a (symbol 12 is a dielectric body layer, 13 is a collector electrode) of plural recording electrodes 11 provided on the ceramic substrate 10 of the head main body A' for static electricity recording are electrically connected to corresponding bonding pads 14a of said substrate B' by thin wire of gold of aluminum by using a wire bonding machine, etc. Consequently, the connection of the head to drive circuits can be easily and positively accomplished through expanded terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrostatic recording head assembly used in an electrostatic recording facsimile.

Conventionally, as a head body of an electrostatic recording head assembly, as shown in FIGS.
Recording electrodes 1 arranged in a row are placed in the middle, and collector electrodes 2 are placed on both sides of the recording electrodes 1 arranged in a row.
Type A is known, which has a configuration in which . This electrostatic recording head main body A has a number of insulated copper wires serving as recording electrodes 1 corresponding to the number of pixels of one scanning line (2048 wires for 8 dots/cm in B5 version, 2048 wires for 4 dots/m). 1024
(Books) - Arranged in rows and fixed to each other by gluing them together using a jig.
The mold force is set to
Copper plates that will become the collector electrodes 2 are set at intervals of d2, and then resin is injected into the mold, so that the recording electrode 1 and the collector electrode 2 are on the same surface in order to remove unevenness on the head surface after casting. It is made by cutting and polishing the cut surface.

For this reason, as a copper wire for recording electrodes, the wire diameter is 0.08-0.
An extremely thin one of 1fl is used, for example, a wire diameter sail of 0
For 8 m (80μ), 8 dots/strip is 0.
．． They are arranged at a pitch of 125m.

In order to operate the electrostatic recording head main body A, it is necessary to apply a temporary electric signal such as printing from a drive circuit (not shown) to each electrode [electrode 1]. cannot be guided by the drive circuit 1 and connected directly. This is because the copper wire is thin and is not suitable for work such as routing it over long distances, and also because it is preferable to perform fine soldering work only with a head assembly that does not include a drive circuit.

Therefore, conventionally, as shown in Fig. 3, a head control body was constructed by about four double-sided relay printed circuit boards B and head bodies A and K, and a large number of copper wires were soldered separately to these boards B. Thereafter, connection to a drive circuit was performed via this printed circuit board B. However, when connecting the copper wires to printed circuit board B, it is necessary to separate the copper wires one by one and insert one wire into each through hole on both sides of printed circuit board B, and dip soldering is illegal. Since it is not available, it requires a lot of man-hours, becomes costly, and also causes incorrect wiring. Furthermore, there is a risk of wire breakage during splitting and soldering, and in particular, if a copper wire breaks at the base, it is structurally impossible to regenerate it.

Furthermore, since the printed circuit board B, which has been warped, has problems with surface leakage and withstand voltage, it is not possible to reduce the conductor wiring spacing of the printed circuit board B, resulting in an increase in size.

This invention solves the above-mentioned conventional drawbacks, reduces manual labor, reduces costs, and improves training wiring.
The object of the present invention is to provide an electrostatic recording head assembly that eliminates accidents such as wire breakage and is suitable for downsizing.

Hereinafter, the present invention will be explained in detail with reference to FIGS. 4 to 8.

4 and 5 show the structure of an electrostatic recording head body A' included in the head assembly of the present invention, and in the figures, reference numeral 1
0 is a ceramic substrate, 11 is a recording electrode formed by printing on the ceramic substrate 10, and 12 is a dielectric material that covers the remaining part of the electrode except for the part 11& for electrically connecting the recording electrode 11. Layer 16 is a collector electrode arranged to sandwich recording electrode 11 with ceramic substrate 10 and dielectric layer 12 in between.

FIG. 6 shows a multilayer printed ceramic substrate B' on which the head assembly of the present invention is mounted, and in the figure, reference numeral 14a is arranged with a pitch interval corresponding one-to-one to the pitch interval of the recording electrodes 11 of the head body A'. In the case of a head body of 8 dots/[ for the B5 version, 2048 bands 14a are formed at a pitch interval of 125 n on one side edge of the ceramic substrate B' with bonding pads made of has been done. The pads 14a are divided into 8 blocks, for example, and 254 pads per block are distributed to each layer of the multilayer printed ceramic substrate B'. The distributed pads 14a are spread on each layer of the ceramic substrate B', and the pitch interval is widened.

In addition, in the deployment section where the pad 14a of 14b is deployed,
A step is provided between each layer and the developed portion 14b of each layer is exposed to the surface so that lead wires can be soldered when connecting to a drive circuit.

Electrical connection between the recording electrode 11 of the head body A' and the bonding pad 14a of the multilayer printed ceramic substrate B' is performed by bonding the exposed end portion 11a of the recording electrode 11 to the bonding pad 14a. . For example, electrical connections are made automatically by bonding thin gold or aluminum wires 15 using a semiconductor wire bonding machine as shown in FIG.

In addition, when using the semiconductor wire bonding machine as described above, both the head body and the multilayer printed ceramic substrate B' are adhesively fixed to the support base 16 as shown in FIG. It is recommended to perform mutual positioning using

The above-mentioned bonding machine can be either a thermocompression type or an ultrasonic type, but depending on the structure of the support 16 and the type of adhesive used, an ultrasonic type or a combined ultrasonic and thermocompression type can be selected. Good choice.

After wire bonding, silicone gel may be applied to the wire to protect it and prevent it from breaking due to vibration.

If a dielectric material made of crystalline glass and having a low dielectric constant is used as the material for the multilayer printed ceramic substrate B', it is possible to increase the withstand voltage and also make it resistant to moisture. In particular, if a protective film made of amorphous glass is printed and fired on this dielectric layer, further moisture resistance can be obtained.

As described above, this invention is developed by dividing a head body with recording electrodes formed on a ceramic substrate, bonding pads provided at a pitch corresponding to the pitch of the recording electrodes, and dividing these pads into blocks. Since the electrostatic recording head assembly is composed of a multilayer printed ceramic substrate having a developed part, it is possible to automatically make electrical connections by bonding wires to recording electrodes and bonding pads. Work man-hours are shortened, productivity is increased, and costs are thereby reduced.

In addition, by providing the expanded portion, the pitch interval is widened, making it easier to solder when connecting to the drive circuit, and improving the line-to-line withstand voltage of the band for soldering. .

Furthermore, since the connection between the head body and the multilayer printed ceramic substrate is made by wire bonding, if a short circuit or disconnection is found during post-bonding inspection, it can be corrected by corner bonding, and the corner of the defective product can be fixed. Many excellent effects can be obtained if it is easy to convert.

[Brief explanation of drawings]

Figures 1 to 3 show conventional examples of electrostatic recording heads, with Figure 1 being a front view of the head body, Figure 2 being a top view of the head body, and Figure 3 being a side view of the head assembly. . 4 to 8 show embodiments of the present invention, FIG. 4 is a side view of the head body, FIG. 5 is a front view of the head body, FIG. 6 is a plan view of the multilayer printed ceramic substrate, and FIG. This figure is a side view of the head assembly, and FIG. 8 is a side view showing another preferred example of the head assembly. A'... Electrostatic recording head body; W... Multilayer printed ceramic substrate; 10... Ceramic substrate; 11... Recording electrode; 14a... Bonding pad; 14b...
Development part: 15...Thin line. Procedure Senichi i! 4: (Method) 111'i November 1957 24L1 1; Director of the Office of Public Defender 1 Kazuo Wakasugi 1 Middle fi・") Omoteno, 111"+! 1157Xl Patent lα1 No. 1181
No. 69 No. 2 Invention 6 Title Electrostatic recording head compaction; 3
'fl Among those who do old F ('l and ``1tjll type patent applicant (t'□...
:1 1”u” 2-9-13 Nakame-ten, Meguro-ku, Tokyo
″;, (n1 (God (230) Stanley Electric Co., Ltd. 4
Agent 〒105 Fill in the copies of the “application,” “specification,” and “drawings” (no changes in content) as shown in the attached documents. 9 List of Attached Documents (1) Request 1 copy (2) Specification 1 copy (3) Drawings 1 copy Shield゛ll Sleeve Original (spontaneous) 1985 5J 90 'A1'::' + Mr. Kazuo Wakasugi, Commissioner of the Agency] Display of small f'l 11i'i (o 57 i I Patent Application No. 11816
No. 9 No. 2 Name of the invention PM recording head assembly 3 Relationship with the person who knows how to compensate f'l Patent applicant Ir゛'1;1 2-9-13 Nakameguro, Meguro-ku, Tokyo
No. 1 Te 1 "";,:, ('r Yamatsu (230) Stanley Electric Co., Ltd., 1 Agent), in the specification attached to "Number (85th edition)" on page 2, line 6. Correct the number (for the 84th edition) to "For the JB5th edition" on page 5, line 5 of the same book.
Corrected to ``for edition''. (3) In the same book, page 5, line 9, "254 books in 11 blocks" is corrected to "256 books in 1 block."

Claims (1)

[Claims] An electrostatic recording head body having a plurality of recording electrodes formed at pitch intervals on a ceramic substrate, and a bonding head body provided corresponding to the pitch interval of the recording electrodes.
A multilayer printed ceramic substrate having a pad and a developed part for connecting lead wires in which the bonding pad is divided into blocks and each block is developed in multiple layers, and the recording electrode and the bonding pad correspond to each other. An electrostatic recording head assembly that is electrically connected by wire bonding using thin gold or aluminum wires.