JPS599553U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS599553U
JPS599553U JP1982104231U JP10423182U JPS599553U JP S599553 U JPS599553 U JP S599553U JP 1982104231 U JP1982104231 U JP 1982104231U JP 10423182 U JP10423182 U JP 10423182U JP S599553 U JPS599553 U JP S599553U
Authority
JP
Japan
Prior art keywords
resin
semiconductor equipment
heat sink
metal plate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982104231U
Other languages
English (en)
Inventor
隆司 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982104231U priority Critical patent/JPS599553U/ja
Publication of JPS599553U publication Critical patent/JPS599553U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置を示す斜視図、第２図はその
断面図である。第３図は本考案の一実施例を示す斜視図
、第４図はその断面図である。第５図は他の実施例の断
面図である。 １・・・・・・放熱板、２・・・・・・半導体素子、３
・・・・・・外部導出端子、４・・・・・・樹脂、５・
・・・・・金属板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を載置した金属板が放熱板として露出した樹
    脂封止型半導体装置において、樹脂を介して放熱板と相
    対した場所に電気的に絶縁された金属板があり、これら
    が同時に樹脂封止されていることを特徴とする半導体装
    置。
JP1982104231U 1982-07-09 1982-07-09 半導体装置 Pending JPS599553U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982104231U JPS599553U (ja) 1982-07-09 1982-07-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982104231U JPS599553U (ja) 1982-07-09 1982-07-09 半導体装置

Publications (1)

Publication Number Publication Date
JPS599553U true JPS599553U (ja) 1984-01-21

Family

ID=30244827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982104231U Pending JPS599553U (ja) 1982-07-09 1982-07-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS599553U (ja)

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