JPS60121751A - 半導体装置の製法 - Google Patents

半導体装置の製法

Info

Publication number
JPS60121751A
JPS60121751A JP59152897A JP15289784A JPS60121751A JP S60121751 A JPS60121751 A JP S60121751A JP 59152897 A JP59152897 A JP 59152897A JP 15289784 A JP15289784 A JP 15289784A JP S60121751 A JPS60121751 A JP S60121751A
Authority
JP
Japan
Prior art keywords
lead frame
piece
buffer
lead
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59152897A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242388B2 (2
Inventor
Hidetoshi Mochizuki
秀俊 望月
Keizo Otsuki
大槻　桂三
Akira Suzuki
明 鈴木
Yoshio Adachi
足達　嘉雄
Hideki Kosaka
小坂　秀樹
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59152897A priority Critical patent/JPS60121751A/ja
Publication of JPS60121751A publication Critical patent/JPS60121751A/ja
Publication of JPS6242388B2 publication Critical patent/JPS6242388B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59152897A 1984-07-25 1984-07-25 半導体装置の製法 Granted JPS60121751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59152897A JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59152897A JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9360378A Division JPS5521124A (en) 1978-08-02 1978-08-02 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP62080913A Division JPS62282455A (ja) 1987-04-03 1987-04-03 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS60121751A true JPS60121751A (ja) 1985-06-29
JPS6242388B2 JPS6242388B2 (2) 1987-09-08

Family

ID=15550519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59152897A Granted JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS60121751A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282455A (ja) * 1987-04-03 1987-12-08 Hitachi Ltd 半導体装置の製法
US5677571A (en) * 1991-11-12 1997-10-14 Kabushiki Kaisha Toshiba Semiconductor package having reinforced lead pins
US5793100A (en) * 1995-02-02 1998-08-11 Mitsubishi Denki Kabushiki Kaisha Lead frame for semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294074A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5381073A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Oroduction of resin seal type semiconductor device and lead frame used the same
JPS6217381A (ja) * 1985-07-12 1987-01-26 Sanyo Electric Co Ltd 高圧用圧縮機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294074A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5381073A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Oroduction of resin seal type semiconductor device and lead frame used the same
JPS6217381A (ja) * 1985-07-12 1987-01-26 Sanyo Electric Co Ltd 高圧用圧縮機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282455A (ja) * 1987-04-03 1987-12-08 Hitachi Ltd 半導体装置の製法
US5677571A (en) * 1991-11-12 1997-10-14 Kabushiki Kaisha Toshiba Semiconductor package having reinforced lead pins
US5793100A (en) * 1995-02-02 1998-08-11 Mitsubishi Denki Kabushiki Kaisha Lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS6242388B2 (2) 1987-09-08

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