JPS60180150A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60180150A
JPS60180150A JP59034463A JP3446384A JPS60180150A JP S60180150 A JPS60180150 A JP S60180150A JP 59034463 A JP59034463 A JP 59034463A JP 3446384 A JP3446384 A JP 3446384A JP S60180150 A JPS60180150 A JP S60180150A
Authority
JP
Japan
Prior art keywords
metal
radiation
semiconductor substrate
plastic material
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59034463A
Other languages
English (en)
Inventor
Tsutomu Yamaguchi
力 山口
Tadashi Matsumoto
忠 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP59034463A priority Critical patent/JPS60180150A/ja
Publication of JPS60180150A publication Critical patent/JPS60180150A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、放射線環境において、半導体の特性劣化を低
減させた半導体装置に関するものである。
（従来技術） 従来のこの種の装置は、セラミックまたはプラスチック
材料をパッケージ材料に使用していた。
第１図にセラミックパッケージを用いた例を示す。
半導体基板１が実装されているセラミツクツくツケージ
２は、セラミックパッケージと熱膨張係数のはげ等しい
金属３により気密封止されている。
このような装置を放射線環境で使用すると、電子や陽子
等の放射線がパッケージを透過して、半導体基板にいた
り、その特性劣化やあるいは故障を発生させる。また、
照射放射線の最大飛程より薄い金属３に、放射線を照射
すると、その放射線が金属に入射する前に持っていたエ
ネルギよシも低エネルギの放射線が多数再放射され、特
性劣化が加速される。また、最大飛程よシ厚い金属では
放射線のシールド効果が期待できる反面、制動放射によ
る放射線で特性劣化や、半導体装置が大幅に重量増加す
る欠点を有している。
一方、第２図に示すプラスチック材料１２を封止材料と
する半導体材料１１では、照射放射線よシ低エネルギの
放射線の再放出や制動放射による放射線はほとんど発生
しないが、放射線に対するシールド効果が期待できない
ため、同様に特性劣化はまぬがれない欠点を有している
。
本発明はこれらの欠点を除去するために提案されたもの
で、放射線の半導体基板への侵入を減少させ、特性劣化
や故障の発生を抑えた半導体装置を提供することを目的
とする。
（発明の構成） 上記の目的を達成するため、本発明は半導体基板の周囲
をプラスチック材料からなる封止材料で櫟い、かつその
外側の少くとも一部を金属で覆い、該金属をアースする
ことを特徴とする半導体装置を発明の要旨とするもので
ある。
次に本発明の実施例を添附図面について説明する。なお
実施例は一つの例示であって、本発明の精神を逸脱しな
い範囲で、種々の変更あるいは改良を行いうろことは云
うまでも々い。
第３図は、本発明の一実施例であって、図中２１は半導
体基板、２２はプラスチック材料、２３は金属で、アー
ス線２５により半導体装置のアースに接続されている。
２４はリード線、２５はアース線を示す。なお金属２３
としては例えばアルミニウム、プラスチック材料２２と
して例えばエポキシ樹脂を用いている。
スタティックメモリに第３図の構造を適用し、放射線を
照射した結果を第１表に示す。この実施第　１　表 例では、金属として厚さ０．５鮎のアルミニウムを使用
した例であシ、照射放射線の最大飛程の半分以下である
にもかかわらず、従来装置の高々２０チの重量増加であ
シ、かつ特性劣化が従来装置の」−以下と極めて大きく
減少している。さらに、Ｏ シールド効果を高めるために、金属の厚さを増すことも
さしつかえない。
また第４図は本発明の他の実施例を示すもので、図にお
いて３１は半導体基板、３２はプラスチック、３３は金
属、３４は空間、３５はアース線、３６はリード線を示
す。図に示すようにプラスチック材料と、半導体基板と
の間に空間３４をもうけると、放射線によシブラスチッ
ク材料が帯電しても、直接半導体基板と接していないた
め、特性劣化がさらに発生しにくくなる。なお金属とし
てはプラスチック材料の外側の一部または全部を覆って
もよい。
（発明の効果） 以上、説明したように本発明によれば、半導体基板の表
面上に空間を有するか、もしくは々い場合でも、その周
囲をプラスチック材料からなる封止材料で覆い、かつそ
の外側の一部または全体を金属で゛覆い、これをアース
した構造の半導体装置であるため、放射線による特性劣
化を低減させる利点がある。
【図面の簡単な説明】
第１図、第２図は従来の半導体装置の断面図、第３図及
び第４図は本発明装置の一実施例の断面図を示す。 １．１１．２１．３１・・・半導体基板、２・・・セラ
ミック材料、１２　．２２．３２・・・プラスチック材
料、３，２３．３３・・・金属、４．３４・・・空間、
２５゜（５） ３５・・・アース線、２４　．３６・・・リード線特許
出願人 （６） 第１図 第３図 第４図

Claims (2)

    【特許請求の範囲】
  1. （１）半導体基板の周囲をプラスチック材料からなる封
    止材料で覆い、かつその外側の少くとも一部を金属で覆
    い、該金属をアースすることを特徴とする半導体装置。
  2. （２）半導体基板表面とプラスチック材料との間に空間
    を有することを特徴とする特許請求の範囲第１項記載の
    半導体装置。
JP59034463A 1984-02-27 1984-02-27 半導体装置 Pending JPS60180150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59034463A JPS60180150A (ja) 1984-02-27 1984-02-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59034463A JPS60180150A (ja) 1984-02-27 1984-02-27 半導体装置

Publications (1)

Publication Number Publication Date
JPS60180150A true JPS60180150A (ja) 1985-09-13

Family

ID=12414940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59034463A Pending JPS60180150A (ja) 1984-02-27 1984-02-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS60180150A (ja)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5394014A (en) * 1990-11-28 1995-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device improved in light shielding property and light shielding package
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
WO1996022669A3 (en) * 1995-01-13 1996-09-26 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
DE4143494C2 (de) * 1990-11-28 1998-05-14 Mitsubishi Electric Corp Halbleitereinrichtung insb. für eine Chipkarte mit Abschirmung gegenüber Lichteinwirkung und damit verbundene Fehlfunktionen
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6144108A (en) * 1996-02-22 2000-11-07 Nitto Denko Corporation Semiconductor device and method of fabricating the same
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6326687B1 (en) * 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049123A (en) * 1990-08-01 2000-04-11 Staktek Corporation Ultra high density integrated circuit packages
US5566051A (en) * 1990-08-01 1996-10-15 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US6168970B1 (en) 1990-08-01 2001-01-02 Staktek Group L.P. Ultra high density integrated circuit packages
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5543664A (en) * 1990-08-01 1996-08-06 Staktek Corporation Ultra high density integrated circuit package
US5550711A (en) * 1990-08-01 1996-08-27 Staktek Corporation Ultra high density integrated circuit packages
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
DE4143494C2 (de) * 1990-11-28 1998-05-14 Mitsubishi Electric Corp Halbleitereinrichtung insb. für eine Chipkarte mit Abschirmung gegenüber Lichteinwirkung und damit verbundene Fehlfunktionen
US5394014A (en) * 1990-11-28 1995-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device improved in light shielding property and light shielding package
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5631193A (en) * 1992-12-11 1997-05-20 Staktek Corporation High density lead-on-package fabrication method
US5843807A (en) * 1993-03-29 1998-12-01 Staktek Corporation Method of manufacturing an ultra-high density warp-resistant memory module
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5828125A (en) * 1993-03-29 1998-10-27 Staktek Corporation Ultra-high density warp-resistant memory module
US5581121A (en) * 1993-03-29 1996-12-03 Staktek Corporation Warp-resistant ultra-thin integrated circuit package
US5864175A (en) * 1993-03-29 1999-01-26 Staktek Corporation Wrap-resistant ultra-thin integrated circuit package fabrication method
US5895232A (en) * 1993-03-29 1999-04-20 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US6194247B1 (en) 1993-03-29 2001-02-27 Staktek Group L.P. Warp-resistent ultra-thin integrated circuit package fabrication method
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6858795B2 (en) 1993-06-18 2005-02-22 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5635754A (en) * 1994-04-01 1997-06-03 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
WO1996022669A3 (en) * 1995-01-13 1996-09-26 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6144108A (en) * 1996-02-22 2000-11-07 Nitto Denko Corporation Semiconductor device and method of fabricating the same
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6190939B1 (en) 1997-03-12 2001-02-20 Staktek Group L.P. Method of manufacturing a warp resistant thermally conductive circuit package
US6518098B2 (en) 1998-09-01 2003-02-11 Micron Technology, Inc. IC package with dual heat spreaders
US6326687B1 (en) * 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6765291B2 (en) 1998-09-01 2004-07-20 Micron Technology, Inc. IC package with dual heat spreaders
US6920688B2 (en) 1998-09-01 2005-07-26 Micron Technology, Inc. Method for a semiconductor assembly having a semiconductor die with dual heat spreaders
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6963125B2 (en) 2000-03-08 2005-11-08 Sony Corporation Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

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