JPS60229256A - 光メモリ素子の製造方法 - Google Patents

光メモリ素子の製造方法

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Publication number
JPS60229256A
JPS60229256A JP59086699A JP8669984A JPS60229256A JP S60229256 A JPS60229256 A JP S60229256A JP 59086699 A JP59086699 A JP 59086699A JP 8669984 A JP8669984 A JP 8669984A JP S60229256 A JPS60229256 A JP S60229256A
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JP
Japan
Prior art keywords
spacer member
optical memory
adhesive
memory element
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59086699A
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English (en)
Other versions
JPH0359495B2 (ja
Inventor
Kenji Oota
賢司 太田
Akira Takahashi
明 高橋
Hiroyuki Katayama
博之 片山
Junji Hirokane
順司 広兼
Yoshiteru Murakami
善照 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP59086699A priority Critical patent/JPS60229256A/ja
Publication of JPS60229256A publication Critical patent/JPS60229256A/ja
Priority to US07/061,034 priority patent/US4740947A/en
Publication of JPH0359495B2 publication Critical patent/JPH0359495B2/ja
Granted legal-status Critical Current

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    • G—PHYSICS
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    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
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  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〈発明の技術分野〉 本発明は光学的に情報の記録・再生・消去等を行なう光
メモリ素子の製造方法に関するものである。
〈発明の技術的背景とその問題点〉 近年、光メモリ素子は高密度大容量メモリとして注目さ
れており、中でも特に光メモリ円板は磁気テープ等に比
べて情報のアクセスが速いため、特に研究開発が活発に
行なわれている。
従来より提案されている情報の消去も可能な光磁気メモ
リ円板の構造の断面一部拡大図を第５図に示す。
第５図において、１及び５はそれぞれＰＭＭＡ等の樹脂
基板あるいはガラス基板等から成る透明円板であり、２
及び４はそれぞれ単層磁性膜または誘電体膜、磁性膜９
反射膜等より成る多層膜の記録層であり、３は紫外線硬
化剤等の接着剤層である。
このような構成にあっては２枚重ねの円板にすることＫ
より、円板の両面に情報を入れることが出来るため、円
板当りの情報量が２倍になるメリットがあると共Ｋ、透
明円板１及び５としてＰＭＭＡ等の樹脂基板を用いた場
合には基板のそり等の形状変化を抑えることが出来ると
いう利点もある。
しかし、一方円板の回転による振れまわりを低減するた
めに、円板の厚み公差及び接着層３の厚みむら等を厳し
く管理して円板状の光メモリ素子を製作する必要がある
。
〈発明の目的〉 本発明は上記諸点に鑑みて成されたものであり、２枚重
ねの光メモリ素子において接着層の厚みむらを無くする
ことが可能な光メモリ素子の製造方法を提供するこふを
目的とし、この目的を達成するため、本発明の光メモリ
素子の製造方法は第１及び第２の基板上にそれぞれ記録
層を形成する工程と、上記の第１．第２の基板の少くと
も一方の基板の記録層の形成された面に未硬化の接着剤
中にスペーサ部材の混入された紫外線硬化性の接着剤を
塗布する工程と、記録層を挾んで上記の第１及び第２の
基板間に圧力を加えて上記のスペーサ部材で決定される
厚みを出す工程と、紫外線を照射して上記の一接着剤を
硬化せしめる工程とを備えるように構成されている。
〈発明の実施例〉 以下、本発明を図面を参照して詳細に説明する。
第１図は本発明に従って製造された光メモリ素子の一実
施例の構造を示す一部拡大断面図である。
第１図においてｌ及び５はそれぞれＰＭＭＡ等の樹脂基
板あるいはガラス基板等から成る透明円板、２及び４は
それぞれ上記の透明円板１及び５の対向する面上に形成
された単層磁性膜または誘電体膜、、磁性膜９反射膜等
より成る多層膜の記録層％３は紫外線硬化型の接着剤層
であり、この接着剤層３中に本発明の特徴である球状の
スペーサ部材６が散在されている。
上記スペーサ部材６を屈折率が１．４〜１．６程度の透
明体で構成することにより、紫外線硬化型の接、着剤の
屈折率とほぼ同じ値を示すことになり、この結果、この
球状のスペーサ部材６の存在を光学的には検出できなく
なり、見かけ上、第５図に示した従来の接着層のみのも
のと同じになり、かつ接着層の厚みの最小値は、この球
状のスペーサ部材６の直径精度によって正確に設定され
ることになる。
なお、スペーサ部材６の材質としてはガラスあるいはＰ
ＭＭＡ等の樹脂部材等が良く、また大きさは５０〜１０
０μｍの直径であることが望ましい。
次に本発明にしたがって上記第１図に示した光メモリ素
子を作る製造方法について説明すると、その工程は次の
通りである。
■　第１の透明基板ｌ及び第２の透明基板５上にそれぞ
れ磁性膜を含む記録層２及び４を形成する。
なお、この場合光メモリ素子が円板状の場合には円板外
周部には記録層２及び４を形成しないように成す。
■　紫外線硬化型の未硬化の接着剤に上記の球状スペー
サ部材６を体積比１００：　Ｉ　−１０：　Ｉ　（接着
、剤ニスペーサ）で混入させて、よく攪拌する〇■　上
記のスペーサ部材６の入った接着剤中に含まれる気泡を
例えば真空引き等によって抜く。
の工程を経たスペーサ部材６の混入された接着剤３を全
面塗布する。
■　２枚の透明基板１及び５を記録層２．及び４が相対
峙する形で重ねて位置合せを行ない、第２図に示すよう
に押え板７及び８を介して上下面から圧力を加える。こ
のとき圧力を加えるための押え板７は基板１及び５が円
板状の場合には円板直径よりも小さい直径を有する円形
をしているものが望ましい。
■　接着層３′の厚みがスペーサ部材６で決定されるに
充分な圧力を押え板７及び８間に加えた後、紫外線９を
基板ｌの全面に照射する。なお、このとき円板状基板１
及び５は第３図に示すように外周部に記録膜が無く光が
通過する構造に成しており、このような構造により、ス
ペーサの混入された接着層３′のうち光の照射される１
０の部分が硬化接着して、円板状基板１及び５が滑らな
くなる。
以上のようＫして第１図に示した構造の光メモリ素子が
作られることになる。
なお、接着剤として嫌気硬化性のものを使用することＫ
より、時間経過と共に未硬化部分が硬化するために更に
好都合である。
本発明は上記実施例に限定されるものではなく、種々の
変形が可能である。
例えばスペーサ部材６は球形である必要がなく、第４図
に示すように円柱状のスペーサ部材６′を用いることも
可能である。このような円柱状のスペーサ部材６′をガ
ラスで構成した場合には第４図における矢印ａの方向か
ら力を加えても形状が容易に変化しないのに対し、矢印
すのように斜めから力を加えた場合には円柱６′が折れ
てより短い円柱となり、従って適当な圧力を加えること
で最終的には円柱の直径にまで間隔が縮まることになる
。
またＰＭＭＡ等の樹脂材料をスペーサ部材６′として用
いる場合には円柱の高さを長くするととＫより、円柱が
全て第４図に示すように倒れた形となり、最少時隔が容
易に決定されるととＫなる。
また第２図における押え板７は必ずしも円形である必要
はなく、要は円板外周部あるいは内周部に設けられた記
録膜のない透明部分の一部に光が照射され得る形状であ
れば良い。
〈発明の効果〉 以上のように、本発明によれば記録層の形成された基板
間の接着層の厚みを容易にかつ精度良く均一にすること
が可能となり、その結果例えば円板状の光メモリ素子の
振れまわりに対する影響に大幅に低減した光メモリ素子
を容易に製造することが出来る。
【図面の簡単な説明】
第１図は本発明にしたがって製造される光メモリ素子の
一例の構造を示す断面一部拡大図、第２図は本発明の光
メモリ素子の製造方法の一実施例を示す概略図、第３図
は第２図の製造方法によって接着をした場合に硬化する
部分を示す一部拡大断面図、第４図はスペーサ部材の他
の一例を示す図、第５図は従来の光メモリ素子の構造を
示す断面一部拡大図である。 ト・・第１の透明基板、２・・・記録層、８・・接着層
、３′・・・スペーサ部材を含んだ接着層、４・・記録
層、５・・・第２の透明基板、６・・スペーサ部材、７
及び８・・押え板、９・・・紫外線光、１０・・・硬化
部分。

Claims (1)

  1. 【特許請求の範囲】 １、第１及び第２の基板上にそれぞれ記録層を形成する
    工程と、 上記第１．第２の基板の少くとも一方の基板の記録層の
    形成された面に未硬化の接着剤中にスペーサ部材の混入
    された紫外線硬化性の接着剤を塗布する工程と、 記録層を挾んで上記第１及び第２の基板間に圧力を加え
    て上記スペーサ部材で決定される厚みを出す工程と、 紫外線を照射して上記接着剤を硬化せしめる工程と を備えたことを特徴とする光メモリ素子の製造方法。 ２　上記スペーサ部材が透明体で構成きれて成ることを
    特徴とする特許請求の範囲第１項記載の光メモリ素子の
    製造方法。
JP59086699A 1984-04-25 1984-04-26 光メモリ素子の製造方法 Granted JPS60229256A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59086699A JPS60229256A (ja) 1984-04-26 1984-04-26 光メモリ素子の製造方法
US07/061,034 US4740947A (en) 1984-04-25 1987-06-12 Dual surface optical memory disc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59086699A JPS60229256A (ja) 1984-04-26 1984-04-26 光メモリ素子の製造方法

Publications (2)

Publication Number Publication Date
JPS60229256A true JPS60229256A (ja) 1985-11-14
JPH0359495B2 JPH0359495B2 (ja) 1991-09-10

Family

ID=13894190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59086699A Granted JPS60229256A (ja) 1984-04-25 1984-04-26 光メモリ素子の製造方法

Country Status (1)

Country Link
JP (1) JPS60229256A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014149168A (ja) * 2013-01-31 2014-08-21 Fujitsu Ltd 光硬化性樹脂の硬化モニター方法及び光部品接続方法
CN117866571A (zh) * 2023-12-22 2024-04-12 上海回天新材料有限公司 一种磁元件粘结用环氧树脂胶粘剂及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014149168A (ja) * 2013-01-31 2014-08-21 Fujitsu Ltd 光硬化性樹脂の硬化モニター方法及び光部品接続方法
CN117866571A (zh) * 2023-12-22 2024-04-12 上海回天新材料有限公司 一种磁元件粘结用环氧树脂胶粘剂及其制备方法

Also Published As

Publication number Publication date
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