JPS6034031A - Device for measuring semiconductor element - Google Patents

Abstract

PURPOSE:To enable to attain sure measurement of a semiconductor element without applying damage to the element by a method wherein the semiconductor element intending to perform measurement is slipped in up-and-down shoots built in with a heater, the element is stopped when it reaches the central part of the shoots, and measurement is performed. CONSTITUTION:An element 1 intending to perform measurement is slipped in a pit between inclined up-and-down shoots 5, 4 built in with a heater, and the element 1 is stopped when it reaches a measuring part consisting of a first and a second guides constructing the shoots. Namely, the projecting parts 3 of leads 2 projecting from the element 1 are pressed down by stoppers 8, the element 1 is pinched by guides 6, 7 to press down the leands 2 by a gate type lead press 13, and the element 1 is fixed at first according to a spring 14 provided inside of the press 13. Then the stoppers 8 are removed to expose the edge parts of the leads 2, the press 13 is descended moreover, the projecting parts 3 are pinched by the press 13 and contacts 9 surrounding the element 1, and the prescribed measurement is performed. After then, the element 1 is made to be in a free condition, and discharged from the other edges of the shoots 4, 5.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for continuously measuring the electrical performance of a semiconductor device. Semiconductor devices (hereinafter simply referred to as devices) such as ICs and LS11 VLSIs are heated to a constant temperature and their electrical performance is measured and inspected, but the temperature must be constant and the type of device must be checked. In some cases, it takes time to measure, so we set up multiple measurement positions, automatically send the element to these positions, wait at that position in a heated state if necessary, and measure immediately when the conditions for starting measurement are met. It is desirable to send out the elements after completion.

In order to meet this objective, the present invention provides an adjustment device that is accurately positioned at the measurement position, stands by while maintaining the temperature if necessary, and reliably connects the measurement terminal to the lead at the time of measurement. It is. The device in question here is shown enlarged in Figure 1, but it is very small and has a large number of short leads 2 lined up on both the left and right sides of the main body, and the ends of the leads are generally flat with protrusions 3 on the left and right sides. This is called a pack type.

The conventional measuring device is called a DIP type, and has a long lead extending downward, and electrode contact is made by inserting this lead into a socket. However, in the flat punk type, the reed is very short,
Particularly in the case of small-sized devices, the spacing between the leads is narrow, making it difficult to insert them into sockets, and therefore, the conventional insertion method cannot be used for handling in measuring devices.

It is desirable that the measurement unit of the present invention be installed at a plurality of locations as described above. For this purpose, it is necessary to provide a plurality of measuring positions on the chute through which the element passes, or to form a chute in multiple rows, and to set one or more measuring positions on the chute. The mechanism of the present invention is provided at each measuring point (1).
'Good L), so I will explain one of them.

In FIG. 2, the element 1 falls under its own weight between the top of the first chute 4 and the second chute 5 in the direction of the arrow. The lower surface of the second chute 5 is provided with a recess into which the upper part of the element 1 is inserted. A heating beater 5 is placed inside each of the first and second chutes. The measurement section is provided in a guide section that is continuous with the first and second chutes, and the first guide 6 and second guide 7 that constitute this section are separate from the fixed first and second chutes 4.5. It is set up in il). As shown in Fig. 2, the first and second chutes may be inclined to allow the elements to fall under their own weight, or may be upright, or may be horizontal and feed the elements using pressurized air, etc. For convenience of explanation, a horizontal state will be explained below as an example.

In FIG. 3, the outline of the mechanism at the measurement position will first be explained. In FIG. A, the element 1 is fed with its upper part placed in a recess above the first guide 6 and below the second guide 7. In case B, the element stopper 8 is provided at a downstream position of the flow of elements, and it is lowered so that the lower end of the stopper touches the side surface of the protruding part 3 of the element lead 2 (the side surface of the most advanced lead of the advancing element). When hit, the element stops with respect to the lead. In other words, Figure A shows the device in a stopped state. Until the element stops and the mechanism moves to the next state, there is a slight gap between the lower surface of the upper second guide 7 and the upper surface of the element 1, allowing the element to slide. At a position below the protrusion 3 of the lead 2 of the element 1, a contact 9 elastically protruding upward is vertically erected on an insulating plate in accordance with the position of each lead. The contactor 9 protrudes into the fourth small cylinder 11 so as to be elastically downwardly movable. Directly above the protruding portion 3 of the lead 2, a lead presser 13 made of an insulating material is provided to cover the second guide 7 in a gate shape. In FIG. 3A, the element stopper 8 is located in front of the most advanced lead 2, and the lead presser 13 is located above the lead 2, and is not on the same plane as the element stopper 8.

FIG. 3B shows the device in a standby state. Here, the first guide 6
does not move, and only the second guide 7 descends to sandwich the element between them. Like the first and second chutes, the first and second guides have heaters 6' and 7' inside, respectively.
In this state, the element continues to be heated. A spring 14 is placed between the lead presser 13 and the second guide 7, and the element 1 is placed between the first guide 6 and the second guide 7.
It is clamped by a light pressure force using only the spring force.

Next, the measurement state shown in FIG. 3C is reached. In other words, only the 2nd Mp's functional arm f lead persimmon (13) has descended to the point where its lower end touches the protrusion 3 of the lead 2. At this time, the lowering of the lead presser 13 directly hits the a'!2 guide 7. Since the element 1 is configured so as not to have any influence, the element 1 is still clamped between the first guide 6 and the second guide 7 only by the pressing force of the spring 14.Next, while maintaining the clamped state, The lead presser 13 and the first guide 6 are lowered simultaneously while maintaining their mutual positional relationship, and the protruding portion 3 of the lead 2 is pressed against the contact 9 by the lead presser 13, and complete contact is made and measurement is performed. Then, when the measurement is completed, the state returns to the state shown in Fig. 3A, and the element stopper 8 also rises, and the element becomes free and is carried out in the direction of the arrow in Fig. 2.The above operation is usually continuous. I will do it, but
If necessary, it is also possible to temporarily stand by in state B and shift to state C after a predetermined period of time.

Each of the above-mentioned parts has a lever structure, as shown in Fig. 5.6. That is, the lever 7a of the second guide 7, the lever 8a of the element stopper 8, the lever 13 of the lead presser 13
a is 11 on one axis 2o! ＋ Supported enough to work.

In addition, FIG. 6 shows each lever 7a, 8a, 1 shown in the 5th section.
38, only the first guide 6 and its lever 6a are shown. Here, the element moves in the direction of the arrow in FIG. 5.6, that is, from the left to the right in the figure. The center position in FIG. 6 where the contacts 9 are lined up is the measurement position, and the element 1 is positioned at this position by the element stopper 8 as shown by the dotted line.

The structure of the element stopper 8 will be explained with reference to FIG. The stopper lever 8a has an L-shape, is supported by a shaft 20, is pivotable by a cylinder 21 and a spring 22, and is adjusted by a stopper 23 so that the lower end of the element stopper contacts the lead of the element. Then, when the rod of the cylinder 21 is retracted, the lever 8a is rotated counterclockwise by the spring 22, hits the stopper 23, and assumes a lowered position so that the tip of the element stopper 8 hits the lead of the element and stops it. Conversely, by operating the fringe 21, the element stopper is raised and released from contact with the lead. Note that since the intervals between the leads of the element are made accurately, by regulating the position of the lead at the tip, the positions of all the leads can be accurately positioned with respect to each contact.

This is a drive device that drives the circle 1 indicated by a dashed line on the lever 13a of the reed presser in FIG. 5, the first and second guides 6.7, and the reed presser 13, and is indicated by 24.25 in FIG. be. Note that FIG. 8 shows a cross section parallel to the axis 2o at the center of the cylinder in FIG.

In FIGS. 8 to 10, a cylinder 24 is attached to a fixed plate 15, and a cylinder 25 with a very short stroke is integrally attached thereon with their axes overlapping each other. An intermediate member 27 is attached to the lower part of the rod 26 of the lower cylinder 24, and a first contact member 28 is provided at the lower end of the rod 26.

The first contact member 28 is connected to the lever 13 of the lead presser 13.
It faces a with a slight gap. Intermediate member 27
is provided with an upwardly facing second contact member 29, which
It hits the lever 7a of the guide 7 from below. In other words, the second contact member 29 of the intermediate member 27 supports the lever 7a of the second guide from below in the state shown in FIG.
As shown in FIG. 3A, the space between the element 1 and the first guide 6 is widened so that the element 1 can be carried in or taken out.

When pressurized air is fed into the upper cylinder 25, the shaft thereof is slightly lowered, thereby lowering the rod 26 until just before the first contact member 28 at its tip contacts the lead presser/<-13a. And this causes rod 2
The intermediate member 27 connected to the contact member 6 also lowers slightly, so that the lever 7a supported by the second contact member 29
is also released, and the second guide 7 is lowered by the biasing force of the spring 14, and the element 1 is moved between it and the first guide 6. That is, as shown in FIG. 9, the lever of the first guide 6
5a is suspended by the spring 31 between it and the fixed plate 15, so the element 1 (,) is connected to the upper and lower first and second
It is clamped between the guides 6 and 7 by the biasing force of the spring ring 14. This state is the standby state shown in FIG. 3B.

Next, when the lower cylinder 24 is actuated, the rod 26 descends, and the first contact member 28 at its tip contacts the lead presser lever 13a, and the lead presser lever 13a is moved to the stopper 32 fixed to the first guide lever 6a. lower it until it hits. As the parallel rod 26 continues to descend, the first guide lever 6a descends integrally with the lead presser lever 13a. The second guide 7 then follows the first guide 6 while holding the element 1 between them. The protrusion 3 of the lead of the element is the contact 9I.
and is pressed from above by the lead presser 13, resulting in the measurement state shown in FIG. 3C.

When the pressurized air in the upper and lower cylinders 24.25 is discharged upon completion of the measurement, the rod 26 is raised by the spring inside the cylinder 24, and the first and second contact members 28.
29 rises. Therefore, in FIG. 10, when the second contact member 29 is raised, the lever 7a of the second guide is pushed up and the lead presser 13 is raised by the spring 14.
As a result, the first guide 6 is also pulled up by the spring 31 and rises to the level of the first chute 4 shown in FIG. This raised position is regulated by a stash bar 35. On the other hand, the raised position of the second guide 7 is regulated by a stopper 30 provided on the fixed plate 15, widening the space between the first and second guides, allowing the measured elements to be freely carried out and new elements to be accepted. Possible.

In the above explanation Z, as an example of the drive mechanism, a two-stage cylinder is used for the standby state, or if there is no need for standby, one cylinder is used, and the operations of A, B, and C in Fig. 3 are performed continuously. Of course, it is also possible to measure the element by doing so. J, instead of a two-stage cylinder as the drive source,
It also comes with the use of a cam mechanism, etc. Furthermore, conventionally known methods can be used for the heating method and the necessary heat insulation treatment. In order to actually send in the element for measurement, a method for detecting whether or not the element has entered the measurement position is required, and a known method can be used for this as well.

With the mechanism described above, it has become possible to measure and inspect flat pack type elements efficiently and reliably without damaging the elements.

[Brief explanation of the drawing]

FIG. 1 is an enlarged front view of a semiconductor device to which the present invention is applied;
Fig. 2 is an explanatory diagram showing an overview of element transportation and measurement positions, Fig. 3 is a schematic explanatory diagram of functions in the present invention, Fig. 4 is a cross-sectional view of the elastic contact, and Fig. 5 is a plan view of the measuring section. , Figure 6 is a plan view of the first guide in the measuring section (Fig.
Figure 8 is a cross-sectional view of Figure 5 along ■-■, and Figure 9 is
The figures are a sectional view of IX-■ in Figure 5, and 1.1 in Figure 10. FIG. 5 is a sectional view taken along line XX in FIG. 1: Element 2: Lead 3: Lead protrusion 6.7; First and second guide 8: Element stopper 9: Contact 21.2
4.25 Niji cylinder 27: Intermediate member 28.29: First
, 2nd Contact Member Patent Applicant Co., Ltd. Tokyo Seimitsu Da Figure 7 Figure 6 Figure 2 λγ Procedural Amendment (Method) January 3, 1988 Patent Application No. 144176 2 Title of Invention Relationship with the Case of Person Who Corrects Semiconductor Element Measuring Apparatus 3 Patent Applicant 1 Principal 〆粂”蔀＼W!'T'tjMf Item 7 No. 1 Name 〆kei ``i-hot'' Co., Ltd. November 1988 29th (shipping date) Drawings subject to 5 amendments Contents of 6 amendments

Claims (1)

[Claims] (1) A second guide having a recess for guiding the element inside, a first guide provided opposite to this and allowing the element to pass therebetween, and first and second guides. An element stopper that stops the element entering between the guides at its leads, an elastic contact provided at a position facing each lead of the stopped element, and an element stopper that stops the element entering between the first and second guides. A lead presser that presses the protruding portion of the lead of the element toward the contact from both sides of the second guide when clamped, an intermediate member that directly restricts the second guide and the lead presser, and a drive source that connects the intermediate member. and A. A receiving state of the element in which the element stopper is actuated when the second guide is provided with a gap through which the element can pass with respect to the first guide, and B. The element is held between the first and second guides. , the lead and the elastic contactor L t+ fi+
+, #m44-1m r, Yu 1 Yu 1% 1J
A measuring device for a semiconductor device, characterized in that a lead presser is moved close to a contact at 3Rr to obtain a measurement state in which a protrusion of a lead of the device is pressed against a contact with the lead presser. (2. In the description of claim 1, the device for measuring a semiconductor device is held by the pressure of a spring when the second guide pinches the device. (3) In the description of claim 1, A semiconductor device measuring device that uses a two-stage movement structure as a drive source for first and second guiding and lead holding operations to hold the device in a standby state.