JPS6049644U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6049644U
JPS6049644U JP1983141292U JP14129283U JPS6049644U JP S6049644 U JPS6049644 U JP S6049644U JP 1983141292 U JP1983141292 U JP 1983141292U JP 14129283 U JP14129283 U JP 14129283U JP S6049644 U JPS6049644 U JP S6049644U
Authority
JP
Japan
Prior art keywords
tube
resin
semiconductor equipment
semiconductor device
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983141292U
Other languages
English (en)
Inventor
松村 正己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983141292U priority Critical patent/JPS6049644U/ja
Publication of JPS6049644U publication Critical patent/JPS6049644U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は従来例であるT o −220パツケージの一
般外形図、第2図aは本考案の一実施例にかかる半導体
装置の側面図、同図すは同図aのA−A′における断面
図である。 1.11・・・・・・樹脂部、2,12・・・・・・外
部リード端子、13・・・・・・絶縁性チューブ、14
・・・・・・絶縁性接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を樹脂で封止した樹脂封止形半導体装置の外
    部リード端子の一部もしくは全部に電気絶縁性をもった
    チューブをさし込みかつリード端子根元で前記チューブ
    形成材料と同系統の電気絶縁性物質で前記チューブと前
    記封止樹脂部とを固着させたことを特徴とする半導体装
    置。  。
JP1983141292U 1983-09-12 1983-09-12 半導体装置 Pending JPS6049644U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983141292U JPS6049644U (ja) 1983-09-12 1983-09-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983141292U JPS6049644U (ja) 1983-09-12 1983-09-12 半導体装置

Publications (1)

Publication Number Publication Date
JPS6049644U true JPS6049644U (ja) 1985-04-08

Family

ID=30316055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983141292U Pending JPS6049644U (ja) 1983-09-12 1983-09-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS6049644U (ja)

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