JPS619840U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS619840U
JPS619840U JP1984025548U JP2554884U JPS619840U JP S619840 U JPS619840 U JP S619840U JP 1984025548 U JP1984025548 U JP 1984025548U JP 2554884 U JP2554884 U JP 2554884U JP S619840 U JPS619840 U JP S619840U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
metal plate
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984025548U
Other languages
English (en)
Inventor
進 林
富雄 岡村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1984025548U priority Critical patent/JPS619840U/ja
Publication of JPS619840U publication Critical patent/JPS619840U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 第１図ａ， ｂ， ｃは従来装置の平面図、側面図及び
電気的等価回路図、第２図ａ ｂは本考案の一実施例
を示す平面図、側面区である。 図において１ａ〜１ｄは金属板（リードフレーム）、２
ａ，２ｂは接続子、ｈは孔（穴）、ｇは切欠部、３は封
止樹脂、山〜山は半導体チップである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属板と接続金属板間に半導体チップを接着して所要回
    路体を形改し、これを樹脂封止するようにした樹脂封止
    型半導体装置において、前記接続金属板に孔もしくは切
    欠部を設けたことを特徴とする樹脂封止型半導体装置。
JP1984025548U 1984-02-24 1984-02-24 樹脂封止型半導体装置 Pending JPS619840U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984025548U JPS619840U (ja) 1984-02-24 1984-02-24 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984025548U JPS619840U (ja) 1984-02-24 1984-02-24 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS619840U true JPS619840U (ja) 1986-01-21

Family

ID=30520715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984025548U Pending JPS619840U (ja) 1984-02-24 1984-02-24 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS619840U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011198929A (ja) * 2010-03-18 2011-10-06 Shindengen Electric Mfg Co Ltd 半導体装置の内部接続構造、及び、半導体装置
JP2013131583A (ja) * 2011-12-20 2013-07-04 Shindengen Electric Mfg Co Ltd 半導体装置の製造方法、接続子、半導体装置及び整列治具
JP2018157146A (ja) * 2017-03-21 2018-10-04 住友電気工業株式会社 半導体モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553450A (en) * 1978-10-16 1980-04-18 Hitachi Ltd Semiconductor device with resin enclosure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553450A (en) * 1978-10-16 1980-04-18 Hitachi Ltd Semiconductor device with resin enclosure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011198929A (ja) * 2010-03-18 2011-10-06 Shindengen Electric Mfg Co Ltd 半導体装置の内部接続構造、及び、半導体装置
JP2013131583A (ja) * 2011-12-20 2013-07-04 Shindengen Electric Mfg Co Ltd 半導体装置の製造方法、接続子、半導体装置及び整列治具
JP2018157146A (ja) * 2017-03-21 2018-10-04 住友電気工業株式会社 半導体モジュール

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