JPS6064442A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6064442A
JPS6064442A JP58173541A JP17354183A JPS6064442A JP S6064442 A JPS6064442 A JP S6064442A JP 58173541 A JP58173541 A JP 58173541A JP 17354183 A JP17354183 A JP 17354183A JP S6064442 A JPS6064442 A JP S6064442A
Authority
JP
Japan
Prior art keywords
semiconductor chip
wire
insulating film
bonding
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58173541A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469424B2 (de
Inventor
Toshiyuki Yoda
敏幸 誉田
Junichi Kasai
純一 河西
Katsushi Yoshitoshi
吉利　勝志
Akihiro Kubota
昭弘 窪田
Koichi Kobayashi
幸一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58173541A priority Critical patent/JPS6064442A/ja
Publication of JPS6064442A publication Critical patent/JPS6064442A/ja
Publication of JPH0469424B2 publication Critical patent/JPH0469424B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP58173541A 1983-09-19 1983-09-19 半導体装置 Granted JPS6064442A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58173541A JPS6064442A (ja) 1983-09-19 1983-09-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58173541A JPS6064442A (ja) 1983-09-19 1983-09-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6064442A true JPS6064442A (ja) 1985-04-13
JPH0469424B2 JPH0469424B2 (de) 1992-11-06

Family

ID=15962441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58173541A Granted JPS6064442A (ja) 1983-09-19 1983-09-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6064442A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334803A (en) * 1991-10-30 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of producing the same
US5585667A (en) * 1994-12-23 1996-12-17 National Semiconductor Corporation Lead frame for handling crossing bonding wires
US5710457A (en) * 1994-10-28 1998-01-20 Nec Corporation Semiconductor integrated circuit
JP2008004650A (ja) * 2006-06-21 2008-01-10 Hitachi Ulsi Systems Co Ltd 半導体装置及びその製造方法
JP2016192513A (ja) * 2015-03-31 2016-11-10 株式会社沖データ 半導体装置、半導体素子アレイ装置、及び画像形成装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265868U (de) * 1975-11-11 1977-05-16
JPS5375763A (en) * 1976-12-16 1978-07-05 Nec Corp Manufacture for semiconductor device
JPS5784752U (de) * 1980-11-12 1982-05-25

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265868U (de) * 1975-11-11 1977-05-16
JPS5375763A (en) * 1976-12-16 1978-07-05 Nec Corp Manufacture for semiconductor device
JPS5784752U (de) * 1980-11-12 1982-05-25

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334803A (en) * 1991-10-30 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of producing the same
USRE35496E (en) * 1991-10-30 1997-04-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of producing the same
US5710457A (en) * 1994-10-28 1998-01-20 Nec Corporation Semiconductor integrated circuit
US5585667A (en) * 1994-12-23 1996-12-17 National Semiconductor Corporation Lead frame for handling crossing bonding wires
JP2008004650A (ja) * 2006-06-21 2008-01-10 Hitachi Ulsi Systems Co Ltd 半導体装置及びその製造方法
JP2016192513A (ja) * 2015-03-31 2016-11-10 株式会社沖データ 半導体装置、半導体素子アレイ装置、及び画像形成装置

Also Published As

Publication number Publication date
JPH0469424B2 (de) 1992-11-06

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