JPS6066037U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS6066037U
JPS6066037U JP1983158834U JP15883483U JPS6066037U JP S6066037 U JPS6066037 U JP S6066037U JP 1983158834 U JP1983158834 U JP 1983158834U JP 15883483 U JP15883483 U JP 15883483U JP S6066037 U JPS6066037 U JP S6066037U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
concave cross
section
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983158834U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314466Y2 (mo
Inventor
古里　広浩
弘 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1983158834U priority Critical patent/JPS6066037U/ja
Publication of JPS6066037U publication Critical patent/JPS6066037U/ja
Application granted granted Critical
Publication of JPS6314466Y2 publication Critical patent/JPS6314466Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983158834U 1983-10-14 1983-10-14 樹脂封止型半導体装置 Granted JPS6066037U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983158834U JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983158834U JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6066037U true JPS6066037U (ja) 1985-05-10
JPS6314466Y2 JPS6314466Y2 (mo) 1988-04-22

Family

ID=30349807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983158834U Granted JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6066037U (mo)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111943U (ja) * 1982-01-27 1983-07-30 新電元工業株式会社 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111943U (ja) * 1982-01-27 1983-07-30 新電元工業株式会社 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS6314466Y2 (mo) 1988-04-22

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