JPS6066438A - 耐熱樹脂膜の形成方法 - Google Patents
耐熱樹脂膜の形成方法Info
- Publication number
- JPS6066438A JPS6066438A JP58174106A JP17410683A JPS6066438A JP S6066438 A JPS6066438 A JP S6066438A JP 58174106 A JP58174106 A JP 58174106A JP 17410683 A JP17410683 A JP 17410683A JP S6066438 A JPS6066438 A JP S6066438A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- film
- resin film
- silicon
- phosphorus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174106A JPS6066438A (ja) | 1983-09-22 | 1983-09-22 | 耐熱樹脂膜の形成方法 |
| US06/581,365 US4528216A (en) | 1983-02-24 | 1984-02-17 | Process for forming heat-resistant resin films of polyimide and organosilicic reactants |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174106A JPS6066438A (ja) | 1983-09-22 | 1983-09-22 | 耐熱樹脂膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066438A true JPS6066438A (ja) | 1985-04-16 |
| JPH0120532B2 JPH0120532B2 (de) | 1989-04-17 |
Family
ID=15972749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58174106A Granted JPS6066438A (ja) | 1983-02-24 | 1983-09-22 | 耐熱樹脂膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066438A (de) |
-
1983
- 1983-09-22 JP JP58174106A patent/JPS6066438A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0120532B2 (de) | 1989-04-17 |
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