JPS607165A - ボンディングワイヤ - Google Patents

ボンディングワイヤ

Info

Publication number
JPS607165A
JPS607165A JP58114976A JP11497683A JPS607165A JP S607165 A JPS607165 A JP S607165A JP 58114976 A JP58114976 A JP 58114976A JP 11497683 A JP11497683 A JP 11497683A JP S607165 A JPS607165 A JP S607165A
Authority
JP
Japan
Prior art keywords
bonding
wire
less
bonding wire
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58114976A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423826B2 (de
Inventor
Kenichi Sato
謙一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58114976A priority Critical patent/JPS607165A/ja
Publication of JPS607165A publication Critical patent/JPS607165A/ja
Publication of JPH0423826B2 publication Critical patent/JPH0423826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP58114976A 1983-06-24 1983-06-24 ボンディングワイヤ Granted JPS607165A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58114976A JPS607165A (ja) 1983-06-24 1983-06-24 ボンディングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58114976A JPS607165A (ja) 1983-06-24 1983-06-24 ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPS607165A true JPS607165A (ja) 1985-01-14
JPH0423826B2 JPH0423826B2 (de) 1992-04-23

Family

ID=14651279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58114976A Granted JPS607165A (ja) 1983-06-24 1983-06-24 ボンディングワイヤ

Country Status (1)

Country Link
JP (1) JPS607165A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704765A1 (de) 1994-09-12 1996-04-03 Sumitomo Chemical Company, Limited Photoresistzusammensetzung enthaltend eine polyfunktionelle Vinyletherverbindung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164542A (en) * 1981-04-01 1982-10-09 Hitachi Ltd Semiconductor device
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164542A (en) * 1981-04-01 1982-10-09 Hitachi Ltd Semiconductor device
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704765A1 (de) 1994-09-12 1996-04-03 Sumitomo Chemical Company, Limited Photoresistzusammensetzung enthaltend eine polyfunktionelle Vinyletherverbindung

Also Published As

Publication number Publication date
JPH0423826B2 (de) 1992-04-23

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