JPS61101040A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS61101040A
JPS61101040A JP59222098A JP22209884A JPS61101040A JP S61101040 A JPS61101040 A JP S61101040A JP 59222098 A JP59222098 A JP 59222098A JP 22209884 A JP22209884 A JP 22209884A JP S61101040 A JPS61101040 A JP S61101040A
Authority
JP
Japan
Prior art keywords
bonding
wire
lead
gas
location
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59222098A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0586857B2 (mo
Inventor
Michio Okamoto
道夫 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59222098A priority Critical patent/JPS61101040A/ja
Publication of JPS61101040A publication Critical patent/JPS61101040A/ja
Publication of JPH0586857B2 publication Critical patent/JPH0586857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01571—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07118—Means for cleaning, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59222098A 1984-10-24 1984-10-24 ボンデイング装置 Granted JPS61101040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59222098A JPS61101040A (ja) 1984-10-24 1984-10-24 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59222098A JPS61101040A (ja) 1984-10-24 1984-10-24 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61101040A true JPS61101040A (ja) 1986-05-19
JPH0586857B2 JPH0586857B2 (mo) 1993-12-14

Family

ID=16777101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59222098A Granted JPS61101040A (ja) 1984-10-24 1984-10-24 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61101040A (mo)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106942A (ja) * 1988-10-17 1990-04-19 Nec Corp 半導体装置の製造方法
JPH0383347A (ja) * 1989-08-28 1991-04-09 Sumitomo Electric Ind Ltd 集積回路装置およびその製造方法
US5433371A (en) * 1992-10-15 1995-07-18 Matsushita Electric Industrial Co., Ltd. Wire bonding apparatus and method
KR20010068777A (ko) * 2000-01-10 2001-07-23 박종섭 시시디 패키지 제조용 이물 제거 시스템
JP2003039728A (ja) * 2001-07-31 2003-02-13 Sanyo Electric Co Ltd 回路ユニット及びそれを備える光プリントヘッド
JP2008034735A (ja) * 2006-07-31 2008-02-14 Shinkawa Ltd ボンディング装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53141574A (en) * 1977-05-16 1978-12-09 Nec Corp Manufacture of semiconductor device
JPS5713747A (en) * 1980-06-27 1982-01-23 Mitsubishi Electric Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53141574A (en) * 1977-05-16 1978-12-09 Nec Corp Manufacture of semiconductor device
JPS5713747A (en) * 1980-06-27 1982-01-23 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106942A (ja) * 1988-10-17 1990-04-19 Nec Corp 半導体装置の製造方法
JPH0383347A (ja) * 1989-08-28 1991-04-09 Sumitomo Electric Ind Ltd 集積回路装置およびその製造方法
US5433371A (en) * 1992-10-15 1995-07-18 Matsushita Electric Industrial Co., Ltd. Wire bonding apparatus and method
KR20010068777A (ko) * 2000-01-10 2001-07-23 박종섭 시시디 패키지 제조용 이물 제거 시스템
JP2003039728A (ja) * 2001-07-31 2003-02-13 Sanyo Electric Co Ltd 回路ユニット及びそれを備える光プリントヘッド
JP2008034735A (ja) * 2006-07-31 2008-02-14 Shinkawa Ltd ボンディング装置

Also Published As

Publication number Publication date
JPH0586857B2 (mo) 1993-12-14

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