JPS61109152U - - Google Patents

Info

Publication number
JPS61109152U
JPS61109152U JP19423384U JP19423384U JPS61109152U JP S61109152 U JPS61109152 U JP S61109152U JP 19423384 U JP19423384 U JP 19423384U JP 19423384 U JP19423384 U JP 19423384U JP S61109152 U JPS61109152 U JP S61109152U
Authority
JP
Japan
Prior art keywords
pellets
hybrid
wiring board
passive element
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19423384U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19423384U priority Critical patent/JPS61109152U/ja
Publication of JPS61109152U publication Critical patent/JPS61109152U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るハイブリツドＩＣの一実
施例を示す組立分解斜視図、第２図は第１図に示
すハイブリツドＩＣの組立完了平面図、第３図は
第２図のＡ―Ａ線に沿う断面図、第４図はウエー
ハ及び該ウエーハから分割された集合ペレツトの
一例を示す平面図、第５図は集合ペレツトの配線
基板への実装例を示す要部拡大斜視図である。第
６図は従来のハイブリツドＩＣの具体例を示す組
立分解斜視図、第７図は第６図に示すハイブリツ
ドＩＣの組立完了平面図、第８図は第７図のＢ―
Ｂ線の沿う断面図、第９図は微小ペレツトサイズ
の半導体ペレツト或いは受動素子ペレツトの配線
基板への実装例を示す要部拡大斜視図である。 ６……配線基板、７……主面、８……配線パタ
ーン導電パターン、９ａ，９ｂ……半導体ペレツ
ト、１１ａ，１１ｂ……受動素子ペレツト、１２
，１３……集合ペレツト。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁性を有する配線基板に配線パターンを形成
    し、該配線パターン上にペレツトサイズの異なる
    複数の半導体ペレツト及び受動素子ペレツトを含
    む電子部品をマウントしてなるハイブリツドＩＣ
    において、 徴小ペレツトサイズを有する同一種の半導体ペ
    レツト及び受動素子ペレツトを複数個未分割状態
    で集合させた集合ペレツトを、上記配線基板上に
    マウントしたことを特徴とするハイブリツドＩＣ
    。
JP19423384U 1984-12-20 1984-12-20 Pending JPS61109152U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19423384U JPS61109152U (ja) 1984-12-20 1984-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19423384U JPS61109152U (ja) 1984-12-20 1984-12-20

Publications (1)

Publication Number Publication Date
JPS61109152U true JPS61109152U (ja) 1986-07-10

Family

ID=30751679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19423384U Pending JPS61109152U (ja) 1984-12-20 1984-12-20

Country Status (1)

Country Link
JP (1) JPS61109152U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5393787A (en) * 1977-01-27 1978-08-17 Nec Home Electronics Ltd Production of semiconductor
JPS59194233A (ja) * 1983-04-20 1984-11-05 Fujitsu Ltd 仮名漢字変換方式

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5393787A (en) * 1977-01-27 1978-08-17 Nec Home Electronics Ltd Production of semiconductor
JPS59194233A (ja) * 1983-04-20 1984-11-05 Fujitsu Ltd 仮名漢字変換方式

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