JPS6112700Y2 - - Google Patents

Info

Publication number
JPS6112700Y2
JPS6112700Y2 JP1979174839U JP17483979U JPS6112700Y2 JP S6112700 Y2 JPS6112700 Y2 JP S6112700Y2 JP 1979174839 U JP1979174839 U JP 1979174839U JP 17483979 U JP17483979 U JP 17483979U JP S6112700 Y2 JPS6112700 Y2 JP S6112700Y2
Authority
JP
Japan
Prior art keywords
thin film
resin
hybrid
silicone resin
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979174839U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5694044U (sr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979174839U priority Critical patent/JPS6112700Y2/ja
Publication of JPS5694044U publication Critical patent/JPS5694044U/ja
Application granted granted Critical
Publication of JPS6112700Y2 publication Critical patent/JPS6112700Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1979174839U 1979-12-19 1979-12-19 Expired JPS6112700Y2 (sr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979174839U JPS6112700Y2 (sr) 1979-12-19 1979-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979174839U JPS6112700Y2 (sr) 1979-12-19 1979-12-19

Publications (2)

Publication Number Publication Date
JPS5694044U JPS5694044U (sr) 1981-07-25
JPS6112700Y2 true JPS6112700Y2 (sr) 1986-04-19

Family

ID=29685553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979174839U Expired JPS6112700Y2 (sr) 1979-12-19 1979-12-19

Country Status (1)

Country Link
JP (1) JPS6112700Y2 (sr)

Also Published As

Publication number Publication date
JPS5694044U (sr) 1981-07-25

Similar Documents

Publication Publication Date Title
JP3409957B2 (ja) 半導体ユニット及びその形成方法
JPH0584661B2 (sr)
EP0361283A2 (en) Resin-sealed type semiconductor device and method for manufacturing the same
JPH02125454A (ja) 樹脂封止型半導体装置
JPS5850021B2 (ja) 半導体装置の製法
JPH0142356Y2 (sr)
JP2965496B2 (ja) 半導体ユニット及び半導体素子の実装方法
JPS59763Y2 (ja) 混成集積回路
JPH085550Y2 (ja) 半導体装置
JPH05315396A (ja) 半導体装置の封止方法と封止構造
JPS6334281Y2 (sr)
JPH0567069B2 (sr)
JPS6119154A (ja) 樹脂封止型半導体装置
JPH0422131A (ja) 半導体装置の製造方法
JPS635238Y2 (sr)
JPS58182854A (ja) レジン封止型半導体装置およびその製造方法
JPH0525182B2 (sr)
JPS6236287Y2 (sr)
JPH08115947A (ja) 半導体装置の接合構造
JPS6336686Y2 (sr)
JPS634350B2 (sr)
JPH08195417A (ja) フィルム基板及び半導体装置
JPH0744199B2 (ja) 半導体装置の実装体およびその実装方法
JPH03270057A (ja) 集積回路装置
JP2721790B2 (ja) 半導体装置の封止方法