JPS6112875A - Electroless plating bath - Google Patents
Electroless plating bathInfo
- Publication number
- JPS6112875A JPS6112875A JP13163784A JP13163784A JPS6112875A JP S6112875 A JPS6112875 A JP S6112875A JP 13163784 A JP13163784 A JP 13163784A JP 13163784 A JP13163784 A JP 13163784A JP S6112875 A JPS6112875 A JP S6112875A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating bath
- bath
- nickel
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims description 5
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical group OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 claims description 7
- 229910021645 metal ion Inorganic materials 0.000 claims description 7
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical group OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 claims description 6
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 6
- 229910001453 nickel ion Inorganic materials 0.000 claims description 6
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 5
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 239000003002 pH adjusting agent Substances 0.000 claims description 3
- 239000006174 pH buffer Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 36
- 239000000203 mixture Substances 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 6
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 4
- 235000011130 ammonium sulphate Nutrition 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 3
- 229940018557 citraconic acid Drugs 0.000 description 3
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 3
- 229940044175 cobalt sulfate Drugs 0.000 description 3
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- IGOJDKCIHXGPTI-UHFFFAOYSA-N [P].[Co].[Ni] Chemical compound [P].[Co].[Ni] IGOJDKCIHXGPTI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 2
- 239000001433 sodium tartrate Substances 0.000 description 2
- 229960002167 sodium tartrate Drugs 0.000 description 2
- 235000011004 sodium tartrates Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 229910002440 Co–Ni Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 235000009300 Ehretia acuminata Nutrition 0.000 description 1
- 244000046038 Ehretia acuminata Species 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- -1 Organic acid salts Chemical class 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁気ディスク等の磁気記録体に用いられる磁気
記録媒体(磁性膜)を作製するめっき浴に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a plating bath for producing a magnetic recording medium (magnetic film) used in a magnetic recording medium such as a magnetic disk.
高密度磁気起録体として磁気記録媒体をめっき法によシ
形成された磁気ディスクが近年に至シ用いられ始めてい
る。2. Description of the Related Art In recent years, magnetic disks in which magnetic recording media are formed by plating have begun to be used as high-density magnetic recording materials.
しかしながら、従来の磁気記録媒体形成用の無電解めっ
き浴fは錯化剤としてクエン酸塩、酒石rR塩、マロン
酸塩、ビロリン酸塩等が使用されておシ、これらの酸塩
を用いためつき浴は磁気特性の調節のために添加される
ニッケルイオンによシ著しく浴が不安定となり浴分解が
発生し易いと云う問題点を有している。However, in conventional electroless plating baths f for forming magnetic recording media, citrate, tartrate rR salt, malonate, birophosphate, etc. are used as complexing agents. The problem with the accumulating bath is that the nickel ions added to adjust the magnetic properties make the bath extremely unstable, and bath decomposition is likely to occur.
更に無電解めっき法によシ形成される磁性膜の磁気特性
を変化させるためには浴のpT1浴温等のめつき条件を
変える操作を要し、これらの操作はめつき浴の浴分解を
促す原因となシ浴寿命の低下、作業性の低下等の問題を
生起していた0
〔発明の目的〕
本発明の目的は、上述のような従来のめつき浴の問題を
改善して良好な磁気特性を有する磁気記録媒体を安定に
製造できるsi!解めりき浴を提供することにある。Furthermore, in order to change the magnetic properties of the magnetic film formed by electroless plating, it is necessary to change the plating conditions such as the pT1 bath temperature, and these operations promote bath decomposition of the plating bath. [Objective of the Invention] The object of the present invention is to improve the problems of the conventional plating bath as described above and to improve the performance of the plating bath. si! enables stable production of magnetic recording media with magnetic properties. The purpose is to provide a relaxing bath.
本発明の要旨は無電解めり′き浴は、コバルトイオン、
ニッケルイオン、これら金属イオンの還元剤、pH緩衝
剤、pH調節剤を含む水溶液に、前記イオンの錯化剤と
してジグリコール酸基又はシトラコン酸基七台有してな
ることを特徴とする無電解めっき浴に存する。このジグ
リコール酸基又はシトラコン酸基とめつき浴の遊離金属
イオンが鉛体を形成し、めっき液中の金属イオンが水酸
化ニッケル等の浮遊物に変化するのを防止し、浴分解す
るのを防ぎ、めっき浴は女定化する。The gist of the present invention is that the electroless polishing bath contains cobalt ions,
An electroless method characterized in that an aqueous solution containing nickel ions, a reducing agent for these metal ions, a pH buffer, and a pH adjuster has seven diglycolic acid groups or citraconic acid groups as a complexing agent for the ions. Exists in plating bath. This diglycolic acid group or citraconic acid group and free metal ions in the plating bath form a lead body, which prevents metal ions in the plating solution from changing into floating substances such as nickel hydroxide and prevents them from decomposing in the bath. Prevention, plating bath becomes feminine.
本発明において金属イオンとして用いられるコバルトイ
オン、ニッケルイオンとしては、コバルト、ニッケルの
硫酸塩、塩酸塩、酢酸塩などの可溶性塩を無電解めっき
浴中に溶解することによって供給される。Cobalt ions and nickel ions used as metal ions in the present invention are supplied by dissolving soluble salts of cobalt and nickel such as sulfates, hydrochlorides, and acetates in an electroless plating bath.
コバルトイオンの一度は通常0.002〜/m o 1
/ tの範囲が用いられるが、好ましくは、0.0 /
〜0./’! m O1/Lの範囲である。ニッケル
イオンの濃度は通常Q〜θJmO1/lの範囲が用いら
れるが、好ましくはO1θθコ〜0.0 / m01/
lの範囲である。Cobalt ion once is usually 0.002~/m o 1
/t range is used, preferably 0.0/t.
~0. /'! It is in the range of mO1/L. The concentration of nickel ions is usually in the range Q~θJmO1/l, but preferably O1θθko~0.0/m01/l.
The range is 1.
還元剤としては次亜リン酸塩が普通に用いられるが、ヒ
ト2シン塩類ホウ水素化物なども用いることができる。Hypophosphites are commonly used as reducing agents, but borohydrides of human disine salts and the like can also be used.
pH緩衝剤としてはアンモニウム塩、灰酸塩。Ammonium salts and ash salts are used as pH buffers.
有機酸塩などが使用され、通常0゜O/〜2 mol/
lの範囲の繊度が用いられる。Organic acid salts are used, usually 0°O/~2 mol/
A fineness in the range of l is used.
pH調節剤としてはbp”の上昇にはアンモニア、水酸
化ナトリウムなどのアルカリが用いられ、p′IIの降
下には懺酸、塩酸などの酸が用いられる。As a pH adjuster, an alkali such as ammonia or sodium hydroxide is used to increase bp'', and an acid such as phosphoric acid or hydrochloric acid is used to decrease p'II.
錯化剤としてのジグリコールlJ基は、ジグリコール酸
またはジグリコール酸の可溶性塩によって供給され、通
常o、i−コ・j mol / Lの範囲の濃度が用い
られる。シトラコン酸基の場合は、シトラコン酸または
シトラコン酸の可溶性塩に〔実施例〕
以下1本発明による無電解めっき浴の特徴を実施例によ
シ説明するが、本発明はその要旨を越えない限シ以下の
実施例に限定されるものではない。Diglycol lJ groups as complexing agents are provided by diglycolic acid or soluble salts of diglycolic acid, and concentrations in the range o,i-coj mol/L are usually used. In the case of a citraconic acid group, citraconic acid or a soluble salt of citraconic acid is used. The present invention is not limited to the following examples.
実施例/
束し■製アテイテイプ用ポリイミドフィルム基板に下記
のめつき浴組成及びめっき条件にてOo −Ni−P膜
を形成した。Example/ An Oo-Ni-P film was formed on a polyimide film substrate for attaching manufactured by Bunshishi (1) under the following plating bath composition and plating conditions.
めっき浴組成
4A酸コバルト : 0−Ot mo1/ l−硫
酸ニッケル : 0.0ダ
次亜リン酸ナトリウム 二 〇、−〇
硫酸アンモニクム 二〇、j O
ジグリコール酸 : 0.! 0
めっき条件
めっき浴のpH: ?A(室温にてNH,OHでpH調
節)めっき浴の温度:♂O℃
めりき時間 :膜厚に応じ/j秒〜10分こうして
得られたコバルト−ニッケルーリン膜の磁気特性t−明
らかにする丸め振動試料戯磁力計(束英工業製VBM−
JB ’)による測定結果を次表に示す。Plating bath composition 4A Cobalt acid: 0-Ot mo1/l-Nickel sulfate: 0.0 da Sodium hypophosphite 20, -0 Ammonium sulfate 20, j O Diglycolic acid: 0. ! 0 Plating conditions pH of plating bath: ? A (pH adjusted with NH and OH at room temperature) Temperature of plating bath: ♂O℃ Plating time: Depending on film thickness / j seconds to 10 minutes Magnetic properties of the cobalt-nickel-phosphorus film thus obtained Rounded vibrating sample play magnetometer (VBM-
The measurement results obtained by JB') are shown in the following table.
膜厚が増加するに従って保磁力はlSケ00θから2り
OOθまで低下した。角形比は膜厚の増加と共にθ、!
6から0..2 /まで低下した。As the film thickness increased, the coercive force decreased from lS 00θ to 2OOθ. As the film thickness increases, the squareness ratio becomes θ,!
6 to 0. .. It decreased to 2/.
めつきγiの安定性は浮遊物の発止、沈殿主成もなく極
めて良好であった。The stability of plating γi was extremely good, with no floating matter and no precipitates.
比収岡/
実施列/と同様にしてコバルト−ニッケルーリン膜のめ
つきを行なったが、めっき浴として下記の組成を吊込た
□
めっき浴組成
硫酸コバルト :0.06m01/L硫酸ニツケル
二〇、θグ
次亜リン酸ナトリウム 二〇−2
硫酸アンモニウム二〇、!
酒石酸ナトリウム二〇、!
メッキ開始後約り分波に浴分解が発生したためメッキを
中止した。またメッキ開始!分後に/・3μm厚さの膜
が得られたため磁気特性t−粁価した。A cobalt-nickel-phosphorous film was plated in the same manner as Hiyoka/Execution row/, but the plating bath had the following composition: □ Plating bath composition Cobalt sulfate: 0.06m01/L nickel sulfate
20, θg Sodium hypophosphite 20-2 Ammonium sulfate 20,! Sodium tartrate 20! Plating was discontinued because bath decomposition occurred shortly after plating started. Plating has started again! After a few minutes, a film with a thickness of 3 μm was obtained, and the magnetic properties were evaluated as t-value.
保磁力(0θ) : /30
飽和磁化(emu/cc) : t 20角形比
二〇、コダ
に下記のめつき浴組成及びめっき条件にてCo −Ni
−p膜を形成した。Coercive force (0θ): /30 Saturation magnetization (emu/cc): t Decocagonal ratio
20. Co-Ni was applied to Koda using the following plating bath composition and plating conditions.
-p film was formed.
めっき浴組成
硫酸コバルト =θθ6m01/L
硫酸ニッケル : OO4を
次亜リン酸ナトリウム 二 〇・λθ
硫酸アンモニウム: O,jθ
シトラコン酸 二〇、SO
めっき条件
めっき浴のpH: タ・O(室温にてN残OHでpH調
節)めっき浴の温度:ro℃
めっき時間 :膜厚に応じ!分〜λθ分こうして得
られたコバルト−ニッケルーリン膜の磁気特性を明らか
にするため振動試料型磁力計(東英工業HVSM−is
)を用いて面内方向にl0KOθの磁場をかけた時の測
定結果を次表に示す。Plating bath composition Cobalt sulfate = θθ6m01/L Nickel sulfate: OO4 is replaced with sodium hypophosphite 20・λθ Ammonium sulfate: O, jθ Citraconic acid 20, SO Plating conditions Plating bath pH: TA・O (N residual at room temperature) (pH adjusted with OH) Plating bath temperature: ro℃ Plating time: Depending on the film thickness! min to λθ min To clarify the magnetic properties of the cobalt-nickel-phosphorus film thus obtained, a vibrating sample magnetometer (Toei Kogyo HVSM-is) was used.
) is used to apply a magnetic field of l0KOθ in the in-plane direction, and the measurement results are shown in the following table.
膜厚を/〜ダμmまで変化させたがその保磁力は1i4
tooθと一定であシ、高保磁力を有していた。Although the film thickness was changed to / ~ da μm, the coercive force was 1i4
It had a constant value of too θ and had a high coercive force.
めっき浴の安定性は浮遊物の発生、沈殿生成もなく極め
て良好であった。The stability of the plating bath was extremely good with no floating matter or precipitate formation.
比較例コ
実施例と同様にしてコバルト−ニッケルーリン膜のめっ
きを行なったが、めっき浴として下記の組成を用いた。Comparative Example A cobalt-nickel-phosphorous film was plated in the same manner as in Example, but the following composition was used as the plating bath.
めっき浴組成
硫酸コバルト : 0.06 mob /L硫酸ニッ
ケル :o、o4を
次亜リン酸ナトリウム 二 〇、−
硫酸アンモニウム:OJ
酒石酸ナトリウム:0.!
メッキ開始後約2分後に浴分解が発生したためメッキを
中止した。またメッキ開始!分後に/・3μm厚さの膜
が得らnたため磁気特性を評価した。Plating bath composition Cobalt sulfate: 0.06 mob/L Nickel sulfate: o, o4, sodium hypophosphite 20, - Ammonium sulfate: OJ Sodium tartrate: 0. ! Approximately 2 minutes after the start of plating, bath decomposition occurred, so plating was stopped. Plating has started again! After a few minutes, a film with a thickness of 3 μm was obtained, so the magnetic properties were evaluated.
保磁力(0θ) =/3゜
飽和磁化(emu7cc) : 420角形比
:0.2グ
〔発明の効果〕
本発明によれば、コバルトイオンおよびニッケルイオン
、これら金属イオンの還元剤、pHれ、かつ良好な磁気
特性を有する磁性膜が得られる。Coercive force (0θ) = /3° Saturation magnetization (emu7cc): 420 square ratio
:0.2g [Effects of the Invention] According to the present invention, a magnetic film having cobalt ions, nickel ions, a reducing agent for these metal ions, a pH value, and good magnetic properties can be obtained.
出蝕人 三菱化成工業株式会社 代理人 弁理士 長谷用 − (はか7名)Candidate Mitsubishi Chemical Industries, Ltd. Agent Patent Attorney Hase - (7 people)
Claims (1)
オンの還元剤、pH緩衝剤およびpH調節剤を含む水溶
液に前記金属イオンの錯化剤としてジグリコール酸基又
はシトラコン酸基を含有してなることを特徴とする無電
解めっき浴。(1) An aqueous solution containing cobalt ions, nickel ions, a reducing agent for these metal ions, a pH buffer, and a pH adjuster contains a diglycolic acid group or a citraconic acid group as a complexing agent for the metal ions. Characteristic electroless plating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163784A JPS6112875A (en) | 1984-06-26 | 1984-06-26 | Electroless plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163784A JPS6112875A (en) | 1984-06-26 | 1984-06-26 | Electroless plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6112875A true JPS6112875A (en) | 1986-01-21 |
Family
ID=15062708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13163784A Pending JPS6112875A (en) | 1984-06-26 | 1984-06-26 | Electroless plating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112875A (en) |
-
1984
- 1984-06-26 JP JP13163784A patent/JPS6112875A/en active Pending
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