JPS61129834A - 光照射型熱処理装置 - Google Patents

光照射型熱処理装置

Info

Publication number
JPS61129834A
JPS61129834A JP59252723A JP25272384A JPS61129834A JP S61129834 A JPS61129834 A JP S61129834A JP 59252723 A JP59252723 A JP 59252723A JP 25272384 A JP25272384 A JP 25272384A JP S61129834 A JPS61129834 A JP S61129834A
Authority
JP
Japan
Prior art keywords
chamber
wafer
heat treatment
intermediate member
treatment apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59252723A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234164B2 (2
Inventor
Tsutomu Takeuchi
勉 武内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP59252723A priority Critical patent/JPS61129834A/ja
Publication of JPS61129834A publication Critical patent/JPS61129834A/ja
Publication of JPH0234164B2 publication Critical patent/JPH0234164B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
JP59252723A 1984-11-28 1984-11-28 光照射型熱処理装置 Granted JPS61129834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59252723A JPS61129834A (ja) 1984-11-28 1984-11-28 光照射型熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59252723A JPS61129834A (ja) 1984-11-28 1984-11-28 光照射型熱処理装置

Publications (2)

Publication Number Publication Date
JPS61129834A true JPS61129834A (ja) 1986-06-17
JPH0234164B2 JPH0234164B2 (2) 1990-08-01

Family

ID=17241365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59252723A Granted JPS61129834A (ja) 1984-11-28 1984-11-28 光照射型熱処理装置

Country Status (1)

Country Link
JP (1) JPS61129834A (2)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237927U (2) * 1985-08-27 1987-03-06
DE4407377A1 (de) * 1994-03-05 1995-09-07 Ast Elektronik Gmbh Modifizierte Reaktorkammer und verbessertes Spülverfahren für Schnellheizsysteme
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6067931A (en) * 1996-11-04 2000-05-30 General Electric Company Thermal processor for semiconductor wafers
WO2001029902A3 (de) * 1999-10-20 2002-11-07 Siemens Ag Vorrichtung und verfahren zum temperieren mehrerer prozessiergüter
WO2001029901A3 (de) * 1999-10-20 2002-11-07 Siemens Ag Vorrichtung und verfahren zum temperieren mindestens eines prozessierguts
JP2007519232A (ja) * 2003-12-19 2007-07-12 マトソン テクノロジー カナダ インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
JP2013030772A (ja) * 2003-12-19 2013-02-07 Mattson Technology Canada Inc 工作物の熱誘起運動を抑制する機器及び装置
EP3690962A1 (de) * 2019-01-31 2020-08-05 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Anordnung, vorrichtung und verfahren zum wärmebehandeln eines mehrschichtkörpers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139363A (en) * 1976-05-17 1977-11-21 Hitachi Ltd Heat treatment method for wafers
JPS5756510U (2) * 1980-09-17 1982-04-02
JPS5832409A (ja) * 1981-08-20 1983-02-25 Seiko Epson Corp 単結晶Ｓｉ膜育成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139363A (en) * 1976-05-17 1977-11-21 Hitachi Ltd Heat treatment method for wafers
JPS5756510U (2) * 1980-09-17 1982-04-02
JPS5832409A (ja) * 1981-08-20 1983-02-25 Seiko Epson Corp 単結晶Ｓｉ膜育成装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237927U (2) * 1985-08-27 1987-03-06
DE4407377A1 (de) * 1994-03-05 1995-09-07 Ast Elektronik Gmbh Modifizierte Reaktorkammer und verbessertes Spülverfahren für Schnellheizsysteme
US5580830A (en) * 1994-03-05 1996-12-03 Ast Elekronik Modified reaction chamber and improved gas flushing method in rapid thermal processing apparatus
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6067931A (en) * 1996-11-04 2000-05-30 General Electric Company Thermal processor for semiconductor wafers
EP0840359A3 (en) * 1996-11-04 2002-04-03 General Electric Company Thermal processor for semiconductor wafers
WO2001029902A3 (de) * 1999-10-20 2002-11-07 Siemens Ag Vorrichtung und verfahren zum temperieren mehrerer prozessiergüter
WO2001029901A3 (de) * 1999-10-20 2002-11-07 Siemens Ag Vorrichtung und verfahren zum temperieren mindestens eines prozessierguts
US6703589B1 (en) 1999-10-20 2004-03-09 Shell Solar Gmbh Device and method for tempering at least one process good
US6787485B1 (en) 1999-10-20 2004-09-07 Shell Solar Gmbh Appliance and method for tempering a plurality of process items by absorption of electromagnetic radiation generated by plural sources of the radiation
JP2007519232A (ja) * 2003-12-19 2007-07-12 マトソン テクノロジー カナダ インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
JP2013030772A (ja) * 2003-12-19 2013-02-07 Mattson Technology Canada Inc 工作物の熱誘起運動を抑制する機器及び装置
EP3690962A1 (de) * 2019-01-31 2020-08-05 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Anordnung, vorrichtung und verfahren zum wärmebehandeln eines mehrschichtkörpers
EP3918643A4 (en) * 2019-01-31 2022-05-25 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Arrangement, device, and method for heat treating a multilayer body
US12490543B2 (en) 2019-01-31 2025-12-02 Cnbm Research Institute For Advanced Glass Materials Group Co., Ltd. Arrangement, device, and method for heat treating a multilayer body

Also Published As

Publication number Publication date
JPH0234164B2 (2) 1990-08-01

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