JPS61138247U - - Google Patents

Info

Publication number
JPS61138247U
JPS61138247U JP1984159557U JP15955784U JPS61138247U JP S61138247 U JPS61138247 U JP S61138247U JP 1984159557 U JP1984159557 U JP 1984159557U JP 15955784 U JP15955784 U JP 15955784U JP S61138247 U JPS61138247 U JP S61138247U
Authority
JP
Japan
Prior art keywords
view
wire
field
microscope
wire bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984159557U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984159557U priority Critical patent/JPS61138247U/ja
Publication of JPS61138247U publication Critical patent/JPS61138247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1984159557U 1984-10-22 1984-10-22 Pending JPS61138247U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984159557U JPS61138247U (mo) 1984-10-22 1984-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984159557U JPS61138247U (mo) 1984-10-22 1984-10-22

Publications (1)

Publication Number Publication Date
JPS61138247U true JPS61138247U (mo) 1986-08-27

Family

ID=30717509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984159557U Pending JPS61138247U (mo) 1984-10-22 1984-10-22

Country Status (1)

Country Link
JP (1) JPS61138247U (mo)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5027475A (mo) * 1973-07-09 1975-03-20
JPS5071268A (mo) * 1973-10-25 1975-06-13
JPS519374A (ja) * 1974-07-12 1976-01-26 Hitachi Ltd Kakudaigazooryoshita bondeinguhoho

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5027475A (mo) * 1973-07-09 1975-03-20
JPS5071268A (mo) * 1973-10-25 1975-06-13
JPS519374A (ja) * 1974-07-12 1976-01-26 Hitachi Ltd Kakudaigazooryoshita bondeinguhoho

Similar Documents

Publication Publication Date Title
US5465899A (en) Method and apparatus for fine pitch wire bonding using a shaved capillary
US5445306A (en) Wedge wire bonding tool tip
JPS61125062A (ja) ピン取付け方法およびピン取付け装置
US4958762A (en) Ultrasonic wire bonder
US6405357B1 (en) Method for positioning bond pads in a semiconductor die
JPS61138247U (mo)
JPH0216013B2 (mo)
JPS6175132U (mo)
US5929465A (en) Non-quadrilateral light emitting devices of compound semiconductor
JPS6355537U (mo)
JP2987549B2 (ja) 電力用半導体装置
JP2954109B2 (ja) 半導体装置及びその製造方法
JPS6153737A (ja) 電子装置の組立法及び組立装置
JP2765124B2 (ja) リードフレーム
JP2659286B2 (ja) 半導体装置のワイヤボンディング方法
JPS61173138U (mo)
JPS5814606Y2 (ja) 半導体装置
JPS59211240A (ja) 半導体装置のワイヤボンデイング方法
Carts Nd: YAG bonds semiconductor leads
JPS58178528A (ja) ボンデイング装置
JPS63182546U (mo)
JPH04119641A (ja) Ｔａｂ　ｉｃの製造方法
JPS63102388A (ja) 半導体レーザー装置用パツケージ
JPH02215139A (ja) 半導体装置の製造方法
JPH06334100A (ja) 半導体装置及びそのリードフレーム