JPS61166533U - - Google Patents
Info
- Publication number
- JPS61166533U JPS61166533U JP4974885U JP4974885U JPS61166533U JP S61166533 U JPS61166533 U JP S61166533U JP 4974885 U JP4974885 U JP 4974885U JP 4974885 U JP4974885 U JP 4974885U JP S61166533 U JPS61166533 U JP S61166533U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- photocoupler
- light emitting
- light receiving
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例によるモールド金型
を示す概略断面図、第２図は一般のＤＩＰ６ピン
型フオトカプラーの外観図、第３図は対向型フオ
トカプラーの断面図、第４図は反射型フオトカプ
ラーの断面図、第５図は反射型フオトカプラーの
組立工程においてフレームに発光素子、受光素子
を搭載した状態を示す図、第６図は対向型フオト
カプラーの金線のボンデイング状態を示す図、第
７図は対向型フオトカプラーにおいて半導体素子
へのワイヤーの接触が発生した状態を示す図、第
８図は本考案に係るモールド金型の矯正ピンにて
ワイヤーループを矯正した状態を示す図である。
１１……キヤビテイブロツク、１２……ワイヤ
ーループ矯正用ピン、１３……ピン固定板。
Fig. 1 is a schematic sectional view showing a mold according to an embodiment of the present invention, Fig. 2 is an external view of a general DIP 6-pin photocoupler, Fig. 3 is a sectional view of an opposed type photocoupler, and Fig. 4 is a cross-sectional view of the reflective photocoupler, Figure 5 is a diagram showing the state in which the light emitting element and light receiving element are mounted on the frame during the assembly process of the reflective type photocoupler, and Figure 6 is the bonding state of the gold wire of the opposing type photocoupler. 7 is a diagram showing a state in which a wire comes into contact with a semiconductor element in a facing type photocoupler, and FIG. 8 is a diagram showing a state in which a wire loop is corrected using a straightening pin of a mold according to the present invention. FIG. 11... Cavity block, 12... Wire loop correction pin, 13... Pin fixing plate.
Claims (1)
フオトカプラーの樹脂封止用モールド金型におい
て、前記発光素子、受光素子のワイヤーボンドの
ループ位置にそのワイヤーループを矯正可能なワ
イヤーループ矯正用ピンを具備してなることを特
徴とする半導体樹脂封止用モールド金型。 A mold for resin sealing of a photocoupler having a combination of a semiconductor light emitting element and a semiconductor light receiving element, comprising a wire loop correction pin capable of correcting the wire loop at a wire bond loop position of the light emitting element and the light receiving element. A mold for semiconductor resin encapsulation, which is characterized by the following characteristics:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4974885U JPS61166533U (en) | 1985-04-03 | 1985-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4974885U JPS61166533U (en) | 1985-04-03 | 1985-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61166533U true JPS61166533U (en) | 1986-10-16 |
Family
ID=30567230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4974885U Pending JPS61166533U (en) | 1985-04-03 | 1985-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166533U (en) |
-
1985
- 1985-04-03 JP JP4974885U patent/JPS61166533U/ja active Pending