JPS6418748U

JPS6418748U -

Info

Publication number: JPS6418748U
Application number: JP1987114425U
Authority: JP
Priority date: 1987-07-24
Filing date: 1987-07-24
Publication date: 1989-01-30

Description

[Brief explanation of the drawing]

第１図ａは本考案の一実施例に係る第１の半片
リードフレームの平面図、同図ｂは同図ａのＡ―
Ａ断面図、同図ｃは側面図である。第２図ａ，ｂ
，ｃはそれぞれ、第１図の半片リードフレームに
組合わされる第２の半片リードフレームの平面図
、Ａ―Ａ断面図、側面図である。第３図ａは第１
図と第２図の半片リードフレームを組立せて一体
のリードフレーム構体とした平面図、同図ｂは同
図ａのＡ―Ａ断面図、同図ｃは側面図である。第
４図は第３図の組合せ構体の樹脂封止を説明する
ための断面図、第５図ａ，ｂはそれぞれ従来のリ
ードフレーム構体を形成する半片リードフレーム
の一方および他方を示す平面図、第６図は従来の
半片リードフレームの組合せ構体を示す平面図、
第７図は本考案の他の実施例に係る半片リードフ
レームの平面図、第８図は第７図の半片リードフ
レームを２枚組合せた組合せ構体の平面図である
。１，２，１１，１２，２１，４１，８２，８３
……ガイド、３，１３，２２，４２，８４……連
結部、４，１４，２３，４３，８５……リード部
、５，１５，２４，４４，８６……タイバー、６
，１６，２５，８７……ペレツト用アイランド、
７，１７，４５，８８……ワイヤ用アイランド、
８，１８，９，１９，９０，９１……曲げ部、３
０，７１……発光素子、５０，７３……受光素子
、７５，７６，７７，７８……位置決め用穴、２
７，４７……凹状切欠き、２８，４８……カギ状
突起、２９，４９……カギ状切欠き、８０……上
金型、８１……下金型。 FIG. 1a is a plan view of a first half-piece lead frame according to an embodiment of the present invention, and FIG.
A is a sectional view, and c is a side view. Figure 2 a, b
, c are a plan view, an AA sectional view, and a side view, respectively, of a second half lead frame combined with the half lead frame of FIG. 1. Figure 3a is the first
FIG. 2 is a plan view of an integrated lead frame structure obtained by assembling the half-piece lead frames shown in FIG. 2 and FIG. 2, FIG. FIG. 4 is a sectional view for explaining resin sealing of the combined structure of FIG. 3, and FIGS. 5a and 5b are plan views showing one and the other half of the lead frame half forming the conventional lead frame structure, respectively. FIG. 6 is a plan view showing a conventional combination structure of half-piece lead frames;
FIG. 7 is a plan view of a half-piece lead frame according to another embodiment of the present invention, and FIG. 8 is a plan view of a combination structure in which two half-piece lead frames of FIG. 7 are combined. 1, 2, 11, 12, 21, 41, 82, 83
... Guide, 3, 13, 22, 42, 84 ... Connection section, 4, 14, 23, 43, 85 ... Lead section, 5, 15, 24, 44, 86 ... Tie bar, 6
, 16, 25, 87... island for pellets,
7, 17, 45, 88...Wire island,
8, 18, 9, 19, 90, 91...Bending portion, 3
0,71...Light emitting element, 50,73...Light receiving element, 75,76,77,78...Positioning hole, 2
7, 47... Concave notch, 28, 48... Key-shaped projection, 29, 49... Key-shaped notch, 80... Upper mold, 81... Lower mold.

Claims

[Scope of utility model registration request]

It has a lead part arranged and supported between two parallel elongated plate-shaped guides, an island for mounting a semiconductor pellet is provided at the tip of one of the lead parts, and the lead part Prepares a first half lead frame which is stepped by 1/2 of the board thickness in the board thickness direction, and a second half lead frame having the same structure as this first half lead frame, and further After mounting the semiconductor pellets, which will become a transmitting and receiving pair, on the island with a large step, the first and second semiconductor pellets are mounted.
1. A lead frame structure for a semiconductor device, comprising half lead frames stacked one on top of the other in a symmetrical arrangement with their respective lead parts on the same surface.