JPS61186165A - フラツクスの塗布方法 - Google Patents

フラツクスの塗布方法

Info

Publication number
JPS61186165A
JPS61186165A JP2558085A JP2558085A JPS61186165A JP S61186165 A JPS61186165 A JP S61186165A JP 2558085 A JP2558085 A JP 2558085A JP 2558085 A JP2558085 A JP 2558085A JP S61186165 A JPS61186165 A JP S61186165A
Authority
JP
Japan
Prior art keywords
flux
wiring board
board
powder
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2558085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0551392B2 (2
Inventor
Shozo Ishizawa
石沢　昭三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sankyo Koki KK
Original Assignee
Sankyo Koki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Koki KK filed Critical Sankyo Koki KK
Priority to JP2558085A priority Critical patent/JPS61186165A/ja
Publication of JPS61186165A publication Critical patent/JPS61186165A/ja
Publication of JPH0551392B2 publication Critical patent/JPH0551392B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2558085A 1985-02-13 1985-02-13 フラツクスの塗布方法 Granted JPS61186165A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2558085A JPS61186165A (ja) 1985-02-13 1985-02-13 フラツクスの塗布方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2558085A JPS61186165A (ja) 1985-02-13 1985-02-13 フラツクスの塗布方法

Publications (2)

Publication Number Publication Date
JPS61186165A true JPS61186165A (ja) 1986-08-19
JPH0551392B2 JPH0551392B2 (2) 1993-08-02

Family

ID=12169855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2558085A Granted JPS61186165A (ja) 1985-02-13 1985-02-13 フラツクスの塗布方法

Country Status (1)

Country Link
JP (1) JPS61186165A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368192A (ja) * 1988-04-06 1991-03-25 American Teleph & Telegr Co <Att> 融剤の基板への塗布方法およびその装置
JPH0376658U (2) * 1989-11-22 1991-07-31
JPH0459171A (ja) * 1990-06-28 1992-02-26 Nec Corp 噴霧式フラックス塗布装置
JPH0494157U (2) * 1991-01-09 1992-08-14
CN106825836A (zh) * 2015-10-22 2017-06-13 千住金属工业株式会社 焊剂回收装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147777U (2) * 1979-04-09 1980-10-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147777U (2) * 1979-04-09 1980-10-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368192A (ja) * 1988-04-06 1991-03-25 American Teleph & Telegr Co <Att> 融剤の基板への塗布方法およびその装置
JPH0376658U (2) * 1989-11-22 1991-07-31
JPH0459171A (ja) * 1990-06-28 1992-02-26 Nec Corp 噴霧式フラックス塗布装置
JPH0494157U (2) * 1991-01-09 1992-08-14
CN106825836A (zh) * 2015-10-22 2017-06-13 千住金属工业株式会社 焊剂回收装置

Also Published As

Publication number Publication date
JPH0551392B2 (2) 1993-08-02

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