JPS61220398A - 多層印刷配線板 - Google Patents
多層印刷配線板Info
- Publication number
- JPS61220398A JPS61220398A JP6056685A JP6056685A JPS61220398A JP S61220398 A JPS61220398 A JP S61220398A JP 6056685 A JP6056685 A JP 6056685A JP 6056685 A JP6056685 A JP 6056685A JP S61220398 A JPS61220398 A JP S61220398A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- grid lines
- pattern
- intersections
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6056685A JPS61220398A (ja) | 1985-03-27 | 1985-03-27 | 多層印刷配線板 |
| CA000501578A CA1237820A (en) | 1985-03-20 | 1986-02-11 | Multilayer printed circuit board |
| US06/828,717 US4636919A (en) | 1985-03-20 | 1986-02-12 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6056685A JPS61220398A (ja) | 1985-03-27 | 1985-03-27 | 多層印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61220398A true JPS61220398A (ja) | 1986-09-30 |
| JPH0535596B2 JPH0535596B2 (2) | 1993-05-26 |
Family
ID=13145938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6056685A Granted JPS61220398A (ja) | 1985-03-20 | 1985-03-27 | 多層印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61220398A (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6846993B2 (en) | 2001-10-12 | 2005-01-25 | Nec Corporation | Multilayer printed wiring board and its manufacturing method |
-
1985
- 1985-03-27 JP JP6056685A patent/JPS61220398A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6846993B2 (en) | 2001-10-12 | 2005-01-25 | Nec Corporation | Multilayer printed wiring board and its manufacturing method |
| US7290333B2 (en) | 2001-10-12 | 2007-11-06 | Nec Corporation | Manufacturing method of a multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0535596B2 (2) | 1993-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |