JPS6127258U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6127258U
JPS6127258U JP1984108507U JP10850784U JPS6127258U JP S6127258 U JPS6127258 U JP S6127258U JP 1984108507 U JP1984108507 U JP 1984108507U JP 10850784 U JP10850784 U JP 10850784U JP S6127258 U JPS6127258 U JP S6127258U
Authority
JP
Japan
Prior art keywords
package body
semiconductor device
semiconductor equipment
abstract
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984108507U
Other languages
English (en)
Inventor
信義 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1984108507U priority Critical patent/JPS6127258U/ja
Publication of JPS6127258U publication Critical patent/JPS6127258U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ， ｂ． ｃはそれそれ本考案の一実施例の断
面図、平面図、正面図である。 第２図ａ，反は従来の半導体装置の側面図、平面図、正
面図である。 １，１１・・・・・・パッケージ本体、２・・・・・・
リードピン、．３ａ，４ａ・・・胃凸起、３ｂ．４ｂ・
・・五凹み。

Claims (1)

    【実用新案登録請求の範囲】
  1. 内部に半導体チップを内蔵したパッケージ本体と、この
    パッケージ本体の両側部から外部へ引き出されかつ下方
    へ曲げられた多数のリードピンとを備えた半導体装置に
    おいて、前記パッケージ本体の上面および下面にそれぞ
    れ、他のパッケージ本体と重ねるときに嵌合する凸起お
    よび凹みが設けられていることを特徴とする半導体装置
    。
JP1984108507U 1984-07-18 1984-07-18 半導体装置 Pending JPS6127258U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984108507U JPS6127258U (ja) 1984-07-18 1984-07-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984108507U JPS6127258U (ja) 1984-07-18 1984-07-18 半導体装置

Publications (1)

Publication Number Publication Date
JPS6127258U true JPS6127258U (ja) 1986-02-18

Family

ID=30667692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984108507U Pending JPS6127258U (ja) 1984-07-18 1984-07-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS6127258U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766364A (ja) * 1993-08-25 1995-03-10 Nec Corp 半導体装置の実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766364A (ja) * 1993-08-25 1995-03-10 Nec Corp 半導体装置の実装構造

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