JPS6142429B2 - - Google Patents

Info

Publication number
JPS6142429B2
JPS6142429B2 JP56186321A JP18632181A JPS6142429B2 JP S6142429 B2 JPS6142429 B2 JP S6142429B2 JP 56186321 A JP56186321 A JP 56186321A JP 18632181 A JP18632181 A JP 18632181A JP S6142429 B2 JPS6142429 B2 JP S6142429B2
Authority
JP
Japan
Prior art keywords
semiconductor element
inorganic material
semiconductor
organic
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56186321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5886750A (ja
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56186321A priority Critical patent/JPS5886750A/ja
Publication of JPS5886750A publication Critical patent/JPS5886750A/ja
Publication of JPS6142429B2 publication Critical patent/JPS6142429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP56186321A 1981-11-19 1981-11-19 半導体装置 Granted JPS5886750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56186321A JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56186321A JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS5886750A JPS5886750A (ja) 1983-05-24
JPS6142429B2 true JPS6142429B2 (2) 1986-09-20

Family

ID=16186283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56186321A Granted JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS5886750A (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPH0831988A (ja) * 1994-07-20 1996-02-02 Nec Corp テープキャリアパッケージの封止構造
JP6227914B2 (ja) * 2012-12-18 2017-11-08 花王株式会社 アルキレンオキシドの反応選択率を改善する方法

Also Published As

Publication number Publication date
JPS5886750A (ja) 1983-05-24

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