JPS5886750A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5886750A
JPS5886750A JP56186321A JP18632181A JPS5886750A JP S5886750 A JPS5886750 A JP S5886750A JP 56186321 A JP56186321 A JP 56186321A JP 18632181 A JP18632181 A JP 18632181A JP S5886750 A JPS5886750 A JP S5886750A
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
organic
film
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56186321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142429B2 (2
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56186321A priority Critical patent/JPS5886750A/ja
Publication of JPS5886750A publication Critical patent/JPS5886750A/ja
Publication of JPS6142429B2 publication Critical patent/JPS6142429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP56186321A 1981-11-19 1981-11-19 半導体装置 Granted JPS5886750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56186321A JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56186321A JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS5886750A true JPS5886750A (ja) 1983-05-24
JPS6142429B2 JPS6142429B2 (2) 1986-09-20

Family

ID=16186283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56186321A Granted JPS5886750A (ja) 1981-11-19 1981-11-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS5886750A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPH0831988A (ja) * 1994-07-20 1996-02-02 Nec Corp テープキャリアパッケージの封止構造
JP2014139289A (ja) * 2012-12-18 2014-07-31 Kao Corp アルキレンオキシドの反応選択率を改善する方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPH0831988A (ja) * 1994-07-20 1996-02-02 Nec Corp テープキャリアパッケージの封止構造
JP2014139289A (ja) * 2012-12-18 2014-07-31 Kao Corp アルキレンオキシドの反応選択率を改善する方法

Also Published As

Publication number Publication date
JPS6142429B2 (2) 1986-09-20

Similar Documents

Publication Publication Date Title
US4486945A (en) Method of manufacturing semiconductor device with plated bump
US5057900A (en) Electronic device and a manufacturing method for the same
US8642408B2 (en) Semiconductor device
US6396153B2 (en) Circuit chip package and fabrication method
KR20030003696A (ko) 전자장치 패키칭
JPS62145758A (ja) パラジウムを用いる銅製ボンデイングパツドの酸化防止法
JPS5940560A (ja) 多層回路装置
US5205036A (en) Method of manufacturing a semiconductor device with selective coating on lead frame
JPH02146747A (ja) 半導体装置
JPS5886750A (ja) 半導体装置
JPH02253628A (ja) 半導体装置の製造方法
JPH06169051A (ja) リードフレームとその製造方法並びに半導体パッケージ
JPH03101234A (ja) 半導体装置の製造方法
JP2002339079A (ja) めっき用ウェハ治具
JP2612468B2 (ja) 電子部品搭載用基板
JPS5940550A (ja) 半導体装置
JP3032692B2 (ja) 三次元実装モジュール及びその製造方法
JPS58166748A (ja) 半導体装置
JPS62205650A (ja) 半導体装置用基板
JPS61225839A (ja) バンプ電極の形成方法
JPH11214591A (ja) 半導体装置
JPS60186030A (ja) ボンデイング方法
JPH0563130A (ja) リードフレームとその製造方法並びに半導体パツケージ
JPH01227460A (ja) 電子部品用パッケージ
JPS60262434A (ja) 半導体装置