JPS6142878U - Mounting structure of semiconductor device for watch - Google Patents
Mounting structure of semiconductor device for watchInfo
- Publication number
- JPS6142878U JPS6142878U JP1985114666U JP11466685U JPS6142878U JP S6142878 U JPS6142878 U JP S6142878U JP 1985114666 U JP1985114666 U JP 1985114666U JP 11466685 U JP11466685 U JP 11466685U JP S6142878 U JPS6142878 U JP S6142878U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- watch
- mounting structure
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Electric Clocks (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の一実施例を示し、第１図は断面図、第２
図はＩＣチップと耐熱性プリント基板間のボンデイング
後の距離１と剥離強度の関係を示すグラフである。
１・・・耐熱性プリント基板、２・・・ＩＣチップ、２
ａ・・・半田バンプ、３・・・エポキシ樹脂。The drawings show one embodiment of the present invention, with FIG. 1 being a sectional view and FIG.
The figure is a graph showing the relationship between the distance 1 after bonding between the IC chip and the heat-resistant printed circuit board and the peel strength. 1... Heat-resistant printed circuit board, 2... IC chip, 2
a...Solder bump, 3...Epoxy resin.
Claims (1)
膨張係数を有する耐熱性プリント基板に該ＩＣチップが
フエイスダウンボンデイングされ、且つ、少くともＩＣ
チップ表面及び側面が樹脂蕃一ルドされている小型の時
計用半導体装置の実装構造において、前記ＩＣチップの
半田バンプの大きさを該ＩＣチップの大きさに応じて形
成することにより、該ＩＣチップの大きさと前記耐熱性
プリント基板と前記ＩＣチップとの間隔をチップ面積が
１〜４ｍｍ２のＩＣのとき６０μｍ以上に設定し、チッ
プ面積が４〜３ｍ ｍ”のＩＣのとき８０μｍ以上に設
定し、チップ面積が１６〜３５ｍｍ２のＩＣのとき１２
０μｍ以上に設定配置したことを特徴とする小型の時計
用半導体装置の実装構造。The IC chip is face-down bonded to a heat-resistant printed circuit board having a coefficient of thermal expansion twice or more that of the IC chip by normal glue flow processing, and at least
In the mounting structure of a small watch semiconductor device in which the chip surface and side surfaces are covered with resin, the size of the solder bumps of the IC chip is formed according to the size of the IC chip. and the distance between the heat-resistant printed circuit board and the IC chip are set to 60 μm or more for an IC with a chip area of 1 to 4 mm, and set to 80 μm or more for an IC with a chip area of 4 to 3 mm, 12 for an IC with a chip area of 16 to 35 mm2
A mounting structure for a small semiconductor device for a watch, characterized by a set arrangement of 0 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985114666U JPS6142878U (en) | 1985-07-26 | 1985-07-26 | Mounting structure of semiconductor device for watch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985114666U JPS6142878U (en) | 1985-07-26 | 1985-07-26 | Mounting structure of semiconductor device for watch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6142878U true JPS6142878U (en) | 1986-03-19 |
Family
ID=30673677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985114666U Pending JPS6142878U (en) | 1985-07-26 | 1985-07-26 | Mounting structure of semiconductor device for watch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142878U (en) |
-
1985
- 1985-07-26 JP JP1985114666U patent/JPS6142878U/en active Pending
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