JPS61500577A - 半導体パツド領域保護構造 - Google Patents

半導体パツド領域保護構造

Info

Publication number
JPS61500577A
JPS61500577A JP60500097A JP50009784A JPS61500577A JP S61500577 A JPS61500577 A JP S61500577A JP 60500097 A JP60500097 A JP 60500097A JP 50009784 A JP50009784 A JP 50009784A JP S61500577 A JPS61500577 A JP S61500577A
Authority
JP
Japan
Prior art keywords
dielectric layer
layer
pad
pad area
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60500097A
Other languages
English (en)
Japanese (ja)
Inventor
ホーメン，ジエームズ・オー
ワーム，マーク・エイ
Original Assignee
ハネウエル・インコ−ポレ−テツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ハネウエル・インコ−ポレ−テツド filed Critical ハネウエル・インコ−ポレ−テツド
Publication of JPS61500577A publication Critical patent/JPS61500577A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Developing Agents For Electrophotography (AREA)
JP60500097A 1983-12-05 1984-12-03 半導体パツド領域保護構造 Pending JPS61500577A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55778083A 1983-12-05 1983-12-05
US557780 1995-11-13

Publications (1)

Publication Number Publication Date
JPS61500577A true JPS61500577A (ja) 1986-03-27

Family

ID=24226846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60500097A Pending JPS61500577A (ja) 1983-12-05 1984-12-03 半導体パツド領域保護構造

Country Status (3)

Country Link
EP (1) EP0163731A4 (fr)
JP (1) JPS61500577A (fr)
WO (1) WO1985002715A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339871A3 (fr) * 1988-04-29 1990-12-27 Advanced Micro Devices, Inc. Point de connexion résistant à la corrosion et procédé de fabrication
NL8902695A (nl) * 1989-11-01 1991-06-03 Philips Nv Interconnectiestructuur.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5256536A (en) * 1975-10-29 1977-05-10 Xerox Corp Non humidityysensitive electrophotography carrier material made of ferrite and method of producing
JPS58123552A (ja) * 1982-01-19 1983-07-22 Hitachi Metals Ltd 電子写真現像用キヤリア
JPS58145625A (ja) * 1982-02-12 1983-08-30 Tdk Corp 磁性キヤリヤ粒子

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3445727A (en) * 1967-05-15 1969-05-20 Raytheon Co Semiconductor contact and interconnection structure
US3617818A (en) * 1968-12-31 1971-11-02 Texas Instruments Inc Corrosion-resistent multimetal lead contact for semiconductor devices
US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips
US4091407A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4229248A (en) * 1979-04-06 1980-10-21 Intel Magnetics, Inc. Process for forming bonding pads on magnetic bubble devices
US4472239A (en) * 1981-10-09 1984-09-18 Honeywell, Inc. Method of making semiconductor device
US4478077A (en) * 1982-09-30 1984-10-23 Honeywell Inc. Flow sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5256536A (en) * 1975-10-29 1977-05-10 Xerox Corp Non humidityysensitive electrophotography carrier material made of ferrite and method of producing
JPS58123552A (ja) * 1982-01-19 1983-07-22 Hitachi Metals Ltd 電子写真現像用キヤリア
JPS58145625A (ja) * 1982-02-12 1983-08-30 Tdk Corp 磁性キヤリヤ粒子

Also Published As

Publication number Publication date
EP0163731A1 (fr) 1985-12-11
EP0163731A4 (fr) 1987-10-05
WO1985002715A1 (fr) 1985-06-20

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