JPS6156420A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPS6156420A
JPS6156420A JP59159047A JP15904784A JPS6156420A JP S6156420 A JPS6156420 A JP S6156420A JP 59159047 A JP59159047 A JP 59159047A JP 15904784 A JP15904784 A JP 15904784A JP S6156420 A JPS6156420 A JP S6156420A
Authority
JP
Japan
Prior art keywords
strip
resin
section
filaments
small cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59159047A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254665B2 (2
Inventor
Takaaki Yokoyama
隆昭 横山
Yoshiharu Tada
多田　吉晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59159047A priority Critical patent/JPS6156420A/ja
Publication of JPS6156420A publication Critical patent/JPS6156420A/ja
Publication of JPH0254665B2 publication Critical patent/JPH0254665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59159047A 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法 Granted JPS6156420A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59159047A JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59159047A JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP1086912A Division JPH0249445A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086911A Division JPH0249444A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086910A Division JPH01315147A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086909A Division JPH01309338A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6156420A true JPS6156420A (ja) 1986-03-22
JPH0254665B2 JPH0254665B2 (2) 1990-11-22

Family

ID=15685065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59159047A Granted JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6156420A (2)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148954A (ja) * 1984-08-15 1986-03-10 Nec Kansai Ltd 半導体装置の製造方法
JPS62180957U (2) * 1986-05-06 1987-11-17
JPS63291446A (ja) * 1987-05-25 1988-11-29 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
JPS6420743U (2) * 1987-07-27 1989-02-01
JPS6442825A (en) * 1987-08-10 1989-02-15 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPS6441145U (2) * 1987-09-08 1989-03-13
EP0545487A3 (en) * 1991-12-05 1994-06-08 Cons Ric Microelettronica Semiconductor device encapsulated in resin and electrically insulated having improved insulation characteristics and related manufacturing process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148954A (ja) * 1984-08-15 1986-03-10 Nec Kansai Ltd 半導体装置の製造方法
JPS62180957U (2) * 1986-05-06 1987-11-17
JPS63291446A (ja) * 1987-05-25 1988-11-29 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
JPS6420743U (2) * 1987-07-27 1989-02-01
JPS6442825A (en) * 1987-08-10 1989-02-15 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPS6441145U (2) * 1987-09-08 1989-03-13
EP0545487A3 (en) * 1991-12-05 1994-06-08 Cons Ric Microelettronica Semiconductor device encapsulated in resin and electrically insulated having improved insulation characteristics and related manufacturing process
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink

Also Published As

Publication number Publication date
JPH0254665B2 (2) 1990-11-22

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Legal Events

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