JPS6420743U - - Google Patents

Info

Publication number
JPS6420743U
JPS6420743U JP1987113828U JP11382887U JPS6420743U JP S6420743 U JPS6420743 U JP S6420743U JP 1987113828 U JP1987113828 U JP 1987113828U JP 11382887 U JP11382887 U JP 11382887U JP S6420743 U JPS6420743 U JP S6420743U
Authority
JP
Japan
Prior art keywords
lead
support plate
guide
resin
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987113828U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0741165Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987113828U priority Critical patent/JPH0741165Y2/ja
Publication of JPS6420743U publication Critical patent/JPS6420743U/ja
Application granted granted Critical
Publication of JPH0741165Y2 publication Critical patent/JPH0741165Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987113828U 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム Expired - Lifetime JPH0741165Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987113828U JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987113828U JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Publications (2)

Publication Number Publication Date
JPS6420743U true JPS6420743U (2) 1989-02-01
JPH0741165Y2 JPH0741165Y2 (ja) 1995-09-20

Family

ID=31354016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987113828U Expired - Lifetime JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Country Status (1)

Country Link
JP (1) JPH0741165Y2 (2)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0741165Y2 (ja) 1995-09-20

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