JPS6159660B2 - - Google Patents
Info
- Publication number
- JPS6159660B2 JPS6159660B2 JP54019799A JP1979979A JPS6159660B2 JP S6159660 B2 JPS6159660 B2 JP S6159660B2 JP 54019799 A JP54019799 A JP 54019799A JP 1979979 A JP1979979 A JP 1979979A JP S6159660 B2 JPS6159660 B2 JP S6159660B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wiring board
- main surface
- lead
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979979A JPS55113351A (en) | 1979-02-23 | 1979-02-23 | Integrated circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979979A JPS55113351A (en) | 1979-02-23 | 1979-02-23 | Integrated circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55113351A JPS55113351A (en) | 1980-09-01 |
| JPS6159660B2 true JPS6159660B2 (lt) | 1986-12-17 |
Family
ID=12009387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979979A Granted JPS55113351A (en) | 1979-02-23 | 1979-02-23 | Integrated circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55113351A (lt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158438A (ja) * | 2005-11-30 | 2007-06-21 | Daihen Corp | インピーダンス変換器 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57153457A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Semiconductor mounting apparatus |
| DE3611658A1 (de) * | 1985-04-05 | 1986-10-16 | Omron Tateisi Electronics Co., Kyoto | Elektronikbauteilaufbau |
| JPS629640A (ja) * | 1985-07-08 | 1987-01-17 | Nec Corp | 半導体部品の実装構造 |
| US9554488B2 (en) * | 2014-04-18 | 2017-01-24 | Raytheon Company | Method to align surface mount packages for thermal enhancement |
| CN113539995B (zh) * | 2021-07-16 | 2024-04-12 | 威星国际半导体(深圳)有限公司 | 一种高导热率碳化硅器件封装结构及方法 |
-
1979
- 1979-02-23 JP JP1979979A patent/JPS55113351A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158438A (ja) * | 2005-11-30 | 2007-06-21 | Daihen Corp | インピーダンス変換器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55113351A (en) | 1980-09-01 |
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