JPS6163046A - 半導体装置のリ−ド端子折曲げ装置 - Google Patents

半導体装置のリ−ド端子折曲げ装置

Info

Publication number
JPS6163046A
JPS6163046A JP59185760A JP18576084A JPS6163046A JP S6163046 A JPS6163046 A JP S6163046A JP 59185760 A JP59185760 A JP 59185760A JP 18576084 A JP18576084 A JP 18576084A JP S6163046 A JPS6163046 A JP S6163046A
Authority
JP
Japan
Prior art keywords
rolls
bending
sides
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59185760A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228262B2 (cs
Inventor
Kaoru Ishihara
薫 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59185760A priority Critical patent/JPS6163046A/ja
Publication of JPS6163046A publication Critical patent/JPS6163046A/ja
Publication of JPH0228262B2 publication Critical patent/JPH0228262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59185760A 1984-09-03 1984-09-03 半導体装置のリ−ド端子折曲げ装置 Granted JPS6163046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59185760A JPS6163046A (ja) 1984-09-03 1984-09-03 半導体装置のリ−ド端子折曲げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59185760A JPS6163046A (ja) 1984-09-03 1984-09-03 半導体装置のリ−ド端子折曲げ装置

Publications (2)

Publication Number Publication Date
JPS6163046A true JPS6163046A (ja) 1986-04-01
JPH0228262B2 JPH0228262B2 (cs) 1990-06-22

Family

ID=16176387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59185760A Granted JPS6163046A (ja) 1984-09-03 1984-09-03 半導体装置のリ−ド端子折曲げ装置

Country Status (1)

Country Link
JP (1) JPS6163046A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150229092A1 (en) * 2010-10-14 2015-08-13 Dowa Metaltech Co., Ltd. Female terminal and method for fabricating female terminal

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069656U (ja) * 1991-11-26 1994-02-08 株式会社ダイケン 消火器ポール
JPH069657U (ja) * 1991-12-13 1994-02-08 株式会社ダイケン 消火器ポール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150229092A1 (en) * 2010-10-14 2015-08-13 Dowa Metaltech Co., Ltd. Female terminal and method for fabricating female terminal
US9698554B2 (en) * 2010-10-14 2017-07-04 Dowa Metaltech Co., Ltd. Female terminal fabricating method

Also Published As

Publication number Publication date
JPH0228262B2 (cs) 1990-06-22

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