JPS6183033U - - Google Patents
Info
- Publication number
- JPS6183033U JPS6183033U JP16814384U JP16814384U JPS6183033U JP S6183033 U JPS6183033 U JP S6183033U JP 16814384 U JP16814384 U JP 16814384U JP 16814384 U JP16814384 U JP 16814384U JP S6183033 U JPS6183033 U JP S6183033U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- constant temperature
- processing solution
- chamber
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本考案の装置を示す一部切欠き概略側
面図、第２図は従来の装置を示す概略側面図であ
る。
１′，１０…エツチング処理装置、１，１３…
エツチング処理槽、１２…凹所、２，１４…恒温
槽、３，１５…処理液、１６…循環経路、４，１
７…温度制御装置、７，１９…吐出ポンプ、１８
…送り出し管、２０…バルブ、２１…戻り管、２
２…冷却管、２３…加熱装置、２４…温度センサ
ー、２６…コントローラ。
FIG. 1 is a partially cutaway schematic side view showing the device of the present invention, and FIG. 2 is a schematic side view showing a conventional device. 1', 10... Etching processing device, 1, 13...
Etching treatment tank, 12... recess, 2, 14... constant temperature bath, 3, 15... processing liquid, 16... circulation path, 4, 1
7...Temperature control device, 7, 19...Discharge pump, 18
...Delivery pipe, 20...Valve, 21...Return pipe, 2
2...Cooling pipe, 23...Heating device, 24...Temperature sensor, 26...Controller.
Claims (1)
ツチング処理槽と１つの恒温槽との間を、該恒温
槽内の処理液をエツチング処理槽の各々に送り出
し、且つ前記各エツチング処理槽から前記恒温槽
内に処理液を戻すようにする１つの循環経路にて
接続する一方、前記恒温槽には、その内部の処理
液の温度を一定に保持するための温度制御装置を
備えて成る電子部品のエツチング処理装置。 A connection between a plurality of etching tanks for etching electronic components and one constant temperature bath is provided, in which the processing solution in the constant temperature bath is sent to each of the etching baths, and the process liquid is transferred from each of the etching tanks to the constant temperature bath. The temperature chamber is connected by one circulation path to return the processing solution to the etching chamber, and the thermostatic chamber is equipped with a temperature control device to maintain the temperature of the processing solution inside at a constant temperature. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168143U JPH0217477Y2 (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168143U JPH0217477Y2 (en) | 1984-11-06 | 1984-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183033U true JPS6183033U (en) | 1986-06-02 |
| JPH0217477Y2 JPH0217477Y2 (en) | 1990-05-16 |
Family
ID=30725923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168143U Expired JPH0217477Y2 (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217477Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123730A (en) * | 1982-01-18 | 1983-07-23 | Toshiba Corp | Semiconductor wafer etching device |
| JPS5943523A (en) * | 1982-09-03 | 1984-03-10 | Yamagata Nippon Denki Kk | Chemical liquid feeding method in semiconductor etching process |
-
1984
- 1984-11-06 JP JP1984168143U patent/JPH0217477Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123730A (en) * | 1982-01-18 | 1983-07-23 | Toshiba Corp | Semiconductor wafer etching device |
| JPS5943523A (en) * | 1982-09-03 | 1984-03-10 | Yamagata Nippon Denki Kk | Chemical liquid feeding method in semiconductor etching process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217477Y2 (en) | 1990-05-16 |