JPS6194351U - - Google Patents

Info

Publication number
JPS6194351U
JPS6194351U JP1984180387U JP18038784U JPS6194351U JP S6194351 U JPS6194351 U JP S6194351U JP 1984180387 U JP1984180387 U JP 1984180387U JP 18038784 U JP18038784 U JP 18038784U JP S6194351 U JPS6194351 U JP S6194351U
Authority
JP
Japan
Prior art keywords
array type
plastic
type package
cap
grid array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984180387U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984180387U priority Critical patent/JPS6194351U/ja
Publication of JPS6194351U publication Critical patent/JPS6194351U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案のプラスチツク製ピングリツ
ドアレイ型パツケージの一実施例を示す断面図、
第２図は同じく他の実施例を示す断面図、第３図
は第１図に示すパツケージの一部切欠斜視図、第
４図ａ，ｂ，ｃは金属環の形状を示す平面図であ
る。 １１，１１′，１１″、…高耐熱性銅張積層板
、１２…ＩＣチツプ収納用凹部、１３…ＩＣチツ
プ、１４…ダイパツト、１５…ボンデイング端子
、１６…スルホールめつき穴、１７…導体回路、
１８…ランド、１９…銅箔部分、２０…リードピ
ン、２１…半田づけ、２２…金属環、２３…キヤ
ツプ、２４…クリーム半田、２５…金属ワイヤ、
２６…ポツテイング樹脂、２７…プリプレグ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体用プラスチツク製ピンクリツドアレ
    イ型パツケージにおけるＩＣチツプ収納用凹部の
    周囲に金属環を形成し、該金属環にキヤツプを半
    田接合したことを特徴とするプラスチツク製ピン
    グリツドアレイ型パツケージ。 (2) キヤツプが金属製であることを特徴とする
    実用新案登録請求の範囲第１項記載のプラスチツ
    ク製ピングリツドアレイ型パツケージ。 (3) キヤツプがメタライズ加工したプラスチツ
    ク製であることを特徴とする実用新案登録請求の
    範囲第１項記載のプラスチツク製ピングリツドア
    レイ型パツケージ。 (4) キヤツプが銅張プラスチツク板であること
    を特徴とする実用新案登録請求の範囲第１項記載
    のプラスチツク製ピングリツドアレイ型パツケー
    ジ。
JP1984180387U 1984-11-27 1984-11-27 Pending JPS6194351U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984180387U JPS6194351U (ja) 1984-11-27 1984-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984180387U JPS6194351U (ja) 1984-11-27 1984-11-27

Publications (1)

Publication Number Publication Date
JPS6194351U true JPS6194351U (ja) 1986-06-18

Family

ID=30737943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984180387U Pending JPS6194351U (ja) 1984-11-27 1984-11-27

Country Status (1)

Country Link
JP (1) JPS6194351U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129447A (ja) * 1983-01-14 1984-07-25 Nec Corp 樹脂製キヤツプを有する半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129447A (ja) * 1983-01-14 1984-07-25 Nec Corp 樹脂製キヤツプを有する半導体装置

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