JPS6199340A - リードフレームの枚数及び位置決めチエック機構 - Google Patents

リードフレームの枚数及び位置決めチエック機構

Info

Publication number
JPS6199340A
JPS6199340A JP59221000A JP22100084A JPS6199340A JP S6199340 A JPS6199340 A JP S6199340A JP 59221000 A JP59221000 A JP 59221000A JP 22100084 A JP22100084 A JP 22100084A JP S6199340 A JPS6199340 A JP S6199340A
Authority
JP
Japan
Prior art keywords
lead frame
checker
mold
pins
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59221000A
Other languages
English (en)
Japanese (ja)
Other versions
JPH043105B2 (de
Inventor
Yutaka Kaida
海田　裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59221000A priority Critical patent/JPS6199340A/ja
Publication of JPS6199340A publication Critical patent/JPS6199340A/ja
Publication of JPH043105B2 publication Critical patent/JPH043105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59221000A 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構 Granted JPS6199340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59221000A JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59221000A JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Publications (2)

Publication Number Publication Date
JPS6199340A true JPS6199340A (ja) 1986-05-17
JPH043105B2 JPH043105B2 (de) 1992-01-22

Family

ID=16759898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59221000A Granted JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Country Status (1)

Country Link
JP (1) JPS6199340A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136237A (ja) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd フレ−ムセツト確認装置
US5123823A (en) * 1990-02-01 1992-06-23 Mitsubishi Denki Kabushiki Kaisha Molding device for sealing semiconductor element with resin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167639A (en) * 1981-04-08 1982-10-15 Toshiba Corp Feeder for lead frame in molding device for resin sealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167639A (en) * 1981-04-08 1982-10-15 Toshiba Corp Feeder for lead frame in molding device for resin sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136237A (ja) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd フレ−ムセツト確認装置
US5123823A (en) * 1990-02-01 1992-06-23 Mitsubishi Denki Kabushiki Kaisha Molding device for sealing semiconductor element with resin

Also Published As

Publication number Publication date
JPH043105B2 (de) 1992-01-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees