JPS6199340A - リードフレームの枚数及び位置決めチエック機構 - Google Patents

リードフレームの枚数及び位置決めチエック機構

Info

Publication number
JPS6199340A
JPS6199340A JP59221000A JP22100084A JPS6199340A JP S6199340 A JPS6199340 A JP S6199340A JP 59221000 A JP59221000 A JP 59221000A JP 22100084 A JP22100084 A JP 22100084A JP S6199340 A JPS6199340 A JP S6199340A
Authority
JP
Japan
Prior art keywords
lead frame
checker
mold
pins
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59221000A
Other languages
English (en)
Japanese (ja)
Other versions
JPH043105B2 (pl
Inventor
Yutaka Kaida
海田　裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59221000A priority Critical patent/JPS6199340A/ja
Publication of JPS6199340A publication Critical patent/JPS6199340A/ja
Publication of JPH043105B2 publication Critical patent/JPH043105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59221000A 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構 Granted JPS6199340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59221000A JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59221000A JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Publications (2)

Publication Number Publication Date
JPS6199340A true JPS6199340A (ja) 1986-05-17
JPH043105B2 JPH043105B2 (pl) 1992-01-22

Family

ID=16759898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59221000A Granted JPS6199340A (ja) 1984-10-19 1984-10-19 リードフレームの枚数及び位置決めチエック機構

Country Status (1)

Country Link
JP (1) JPS6199340A (pl)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136237A (ja) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd フレ−ムセツト確認装置
US5123823A (en) * 1990-02-01 1992-06-23 Mitsubishi Denki Kabushiki Kaisha Molding device for sealing semiconductor element with resin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167639A (en) * 1981-04-08 1982-10-15 Toshiba Corp Feeder for lead frame in molding device for resin sealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167639A (en) * 1981-04-08 1982-10-15 Toshiba Corp Feeder for lead frame in molding device for resin sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136237A (ja) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd フレ−ムセツト確認装置
US5123823A (en) * 1990-02-01 1992-06-23 Mitsubishi Denki Kabushiki Kaisha Molding device for sealing semiconductor element with resin

Also Published As

Publication number Publication date
JPH043105B2 (pl) 1992-01-22

Similar Documents

Publication Publication Date Title
US3902615A (en) Automatic wafer loading and pre-alignment system
JP2585024B2 (ja) 被試験ボードの取り付け装置
US5824185A (en) Wafer ring supply and return device
CN111747112A (zh) 磁吸式工件抓取精准定位装置
KR20200068964A (ko) 비히클 유지 보수용 승강 장치
US4628594A (en) Electronic circuit element insertion apparatus
US6062795A (en) Wafer ring feeding apparatus
JPS6199340A (ja) リードフレームの枚数及び位置決めチエック機構
TW201622606A (zh) 拉鏈用拉頭的加壓裝置
JPH0792190A (ja) プリント基板の検査装置
CN119218719A (zh) 一种振动马达测试自动上下料设备
JPH06127507A (ja) 被挿入物挿入装置
DE19823938C1 (de) Verfahren und Vorrichtung zum linearen Positionieren und zur Lageerkennung eines Substrates
KR19980062568U (ko) 반도체 디바이스 테스트용 핸들러 시스템의 트레이 캐쳐
JPH06236910A (ja) 検査装置
JP4483818B2 (ja) ワーク移し替え方法、ワーク移し替え装置及びワーク移し替えシステム
KR100251507B1 (ko) Bga 반도체패키지용 솔더볼범핑시스템
JPH02250737A (ja) 流れ生産路における車体位置決め装置
JPH0829499A (ja) 回路基板の検査装置
JPS62149152A (ja) ウエ−ハ移替装置
CN218695262U (zh) 篮子定位装置
TWI915926B (zh) 測試處理機
TWI915927B (zh) 穿梭機送料器以及包括其的測試處理機
CN214691597U (zh) 检测设备
JPH07111395A (ja) Ｉｃデバイスの移載装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees