JPS62133742A - パツケ−ジ - Google Patents

パツケ−ジ

Info

Publication number
JPS62133742A
JPS62133742A JP60273369A JP27336985A JPS62133742A JP S62133742 A JPS62133742 A JP S62133742A JP 60273369 A JP60273369 A JP 60273369A JP 27336985 A JP27336985 A JP 27336985A JP S62133742 A JPS62133742 A JP S62133742A
Authority
JP
Japan
Prior art keywords
electronic component
wiring board
silicone resin
package
ultraviolet curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60273369A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0516667B2 (2
Inventor
Yukio Yamaguchi
幸雄 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60273369A priority Critical patent/JPS62133742A/ja
Priority to US06/900,532 priority patent/US4709301A/en
Priority to EP86112244A priority patent/EP0214621B1/en
Priority to DE86112244T priority patent/DE3688164T2/de
Publication of JPS62133742A publication Critical patent/JPS62133742A/ja
Publication of JPH0516667B2 publication Critical patent/JPH0516667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60273369A 1985-09-05 1985-12-06 パツケ−ジ Granted JPS62133742A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60273369A JPS62133742A (ja) 1985-12-06 1985-12-06 パツケ−ジ
US06/900,532 US4709301A (en) 1985-09-05 1986-08-26 Package
EP86112244A EP0214621B1 (en) 1985-09-05 1986-09-04 A package comprising a substrate and at least one electronic component
DE86112244T DE3688164T2 (de) 1985-09-05 1986-09-04 Packung mit einem Substrat und mindestens einem elektronischen Bauelement.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273369A JPS62133742A (ja) 1985-12-06 1985-12-06 パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62133742A true JPS62133742A (ja) 1987-06-16
JPH0516667B2 JPH0516667B2 (2) 1993-03-05

Family

ID=17526940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273369A Granted JPS62133742A (ja) 1985-09-05 1985-12-06 パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS62133742A (2)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Also Published As

Publication number Publication date
JPH0516667B2 (2) 1993-03-05

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