JPS62154656U - - Google Patents
Info
- Publication number
- JPS62154656U JPS62154656U JP4108886U JP4108886U JPS62154656U JP S62154656 U JPS62154656 U JP S62154656U JP 4108886 U JP4108886 U JP 4108886U JP 4108886 U JP4108886 U JP 4108886U JP S62154656 U JPS62154656 U JP S62154656U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- flat semiconductor
- cooling body
- insulating plate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
Description
第１図は本考案の実施例の平形半導体素子スタ
ツクの部分正面図、第２図は従来の平形半導体素
子スタツクの部分正面図である。 １：平形半導体素子、２：端子板、４：焼結ア
ルミナ絶縁板、５：冷却体、６：絶縁座、７：ク
ランプ、８：モリブデン当板。
ツクの部分正面図、第２図は従来の平形半導体素
子スタツクの部分正面図である。 １：平形半導体素子、２：端子板、４：焼結ア
ルミナ絶縁板、５：冷却体、６：絶縁座、７：ク
ランプ、８：モリブデン当板。
Claims (1)
- 平形半導体素子を、モリブデンの当板を両面に
当接した焼結アルミナ絶縁板を介して冷却体に圧
接して形成したことを特徴とする平形半導体素子
スタツク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4108886U JPH0519962Y2 (ja) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4108886U JPH0519962Y2 (ja) | 1986-03-20 | 1986-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154656U true JPS62154656U (ja) | 1987-10-01 |
| JPH0519962Y2 JPH0519962Y2 (ja) | 1993-05-25 |
Family
ID=30855765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4108886U Expired - Lifetime JPH0519962Y2 (ja) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519962Y2 (ja) |
-
1986
- 1986-03-20 JP JP4108886U patent/JPH0519962Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519962Y2 (ja) | 1993-05-25 |
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