JPS62160543U - - Google Patents

Info

Publication number
JPS62160543U
JPS62160543U JP1986048044U JP4804486U JPS62160543U JP S62160543 U JPS62160543 U JP S62160543U JP 1986048044 U JP1986048044 U JP 1986048044U JP 4804486 U JP4804486 U JP 4804486U JP S62160543 U JPS62160543 U JP S62160543U
Authority
JP
Japan
Prior art keywords
flip chip
circuit board
mounting structure
cap
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986048044U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986048044U priority Critical patent/JPS62160543U/ja
Publication of JPS62160543U publication Critical patent/JPS62160543U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図はそれぞれ本考案の一実施
例の断面図、第３図は従来装置の一例の断面図で
ある。 〈符号の説明〉、１……半導体素子、２……バ
ンプ、３……コネクタ、４……配線、５……回路
基板、６……押えバネ、７，７２……キヤツプ、
７１，７３……リード、８……ハンダ、９……孔
、４１……ランド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子上に形成したバンプ電極と回路基板
    上の電極との間に、樹脂材中に金属細線等の導体
    を含有し所定方向にのみ導通する樹脂コネクタを
    挾み、それらを押圧して電気的に接続するフリツ
    プチツプの実装構造において、上記半導体素子と
    樹脂コネクタとを覆う形状のキヤツプによつて上
    記半導体素子を背面から上記回路基板側に押圧し
    ながら上記キヤツプの端部を上記回路基板にハン
    ダ付けして固定したことを特徴とするフリツプチ
    ツプの実装構造。
JP1986048044U 1986-04-02 1986-04-02 Pending JPS62160543U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986048044U JPS62160543U (ja) 1986-04-02 1986-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986048044U JPS62160543U (ja) 1986-04-02 1986-04-02

Publications (1)

Publication Number Publication Date
JPS62160543U true JPS62160543U (ja) 1987-10-13

Family

ID=30869211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986048044U Pending JPS62160543U (ja) 1986-04-02 1986-04-02

Country Status (1)

Country Link
JP (1) JPS62160543U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232854A (ja) * 1988-07-22 1990-02-02 Canon Inc 記録素子ユニット並びにそれを用いた記録素子駆動ユニット、インクジェットユニット、インクジェット駆動ユニット及びインクジェット装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232854A (ja) * 1988-07-22 1990-02-02 Canon Inc 記録素子ユニット並びにそれを用いた記録素子駆動ユニット、インクジェットユニット、インクジェット駆動ユニット及びインクジェット装置

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