JPS62172731A - エツチング方法 - Google Patents
エツチング方法Info
- Publication number
- JPS62172731A JPS62172731A JP61014152A JP1415286A JPS62172731A JP S62172731 A JPS62172731 A JP S62172731A JP 61014152 A JP61014152 A JP 61014152A JP 1415286 A JP1415286 A JP 1415286A JP S62172731 A JPS62172731 A JP S62172731A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- conductive layer
- type conductive
- power source
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Pressure Sensors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61014152A JPS62172731A (ja) | 1986-01-24 | 1986-01-24 | エツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61014152A JPS62172731A (ja) | 1986-01-24 | 1986-01-24 | エツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62172731A true JPS62172731A (ja) | 1987-07-29 |
| JPH0528898B2 JPH0528898B2 (th) | 1993-04-27 |
Family
ID=11853176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61014152A Granted JPS62172731A (ja) | 1986-01-24 | 1986-01-24 | エツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62172731A (th) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290524A (ja) * | 1989-01-30 | 1990-11-30 | Dresser Ind Inc | 半導体ウエーハ及びその形成法とトランスジューサ及びその製法 |
| US7749868B2 (en) | 2005-05-18 | 2010-07-06 | Panasonic Electric Works Co., Ltd. | Process of forming a curved profile on a semiconductor substrate |
| US8313632B2 (en) | 2005-05-18 | 2012-11-20 | Panasonic Corporation | Process of making an optical lens |
-
1986
- 1986-01-24 JP JP61014152A patent/JPS62172731A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290524A (ja) * | 1989-01-30 | 1990-11-30 | Dresser Ind Inc | 半導体ウエーハ及びその形成法とトランスジューサ及びその製法 |
| US7749868B2 (en) | 2005-05-18 | 2010-07-06 | Panasonic Electric Works Co., Ltd. | Process of forming a curved profile on a semiconductor substrate |
| US8313632B2 (en) | 2005-05-18 | 2012-11-20 | Panasonic Corporation | Process of making an optical lens |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528898B2 (th) | 1993-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3858150A (en) | Polycrystalline silicon pressure sensor | |
| JP2582229B2 (ja) | シリコンダイアグラムおよびシリコン圧力センサーの製造方法 | |
| US3853650A (en) | Stress sensor diaphragms over recessed substrates | |
| JPS6197572A (ja) | 半導体加速度センサの製造方法 | |
| EP0050136A1 (en) | Silicon pressure sensor | |
| JP3506932B2 (ja) | 半導体圧力センサ及びその製造方法 | |
| US3820401A (en) | Piezoresistive bridge transducer | |
| JPH0496227A (ja) | エッチング方法 | |
| EP0504956A2 (en) | Selective electrochemical etching | |
| JP4148547B2 (ja) | 半導体装置の製造方法 | |
| US4930347A (en) | Solid state microanemometer with improved sensitivity and response time | |
| JP3508547B2 (ja) | Siウエハのエッチング方法 | |
| CN108981982A (zh) | 一种mems压力传感器及其制作方法 | |
| JPH0528898B2 (th) | ||
| JPH0779167B2 (ja) | 集積化半導体圧力センサ | |
| JP2000022168A (ja) | 半導体加速度センサ及びその製造方法 | |
| JPS6261374A (ja) | シリコンダイアフラムの形成方法 | |
| JPH0230188A (ja) | 半導体圧力センサの製造方法 | |
| JPS5913377A (ja) | 半導体圧力変換素子の受圧ダイヤフラム形成方法 | |
| JPH01145873A (ja) | 半導体圧力センサの製造方法 | |
| JPS6037177A (ja) | 半導体圧力センサ | |
| JP3460584B2 (ja) | Siダイヤフラムとその製造方法 | |
| JPS6267880A (ja) | 半導体装置の製造方法 | |
| JPH0645617A (ja) | 単結晶薄膜部材の製造方法 | |
| JPH0573276B2 (th) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
| EXPY | Cancellation because of completion of term |