JPS62201937U - - Google Patents

Info

Publication number
JPS62201937U
JPS62201937U JP1986090515U JP9051586U JPS62201937U JP S62201937 U JPS62201937 U JP S62201937U JP 1986090515 U JP1986090515 U JP 1986090515U JP 9051586 U JP9051586 U JP 9051586U JP S62201937 U JPS62201937 U JP S62201937U
Authority
JP
Japan
Prior art keywords
pad
wafer
pedestal
metal foil
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986090515U
Other languages
Japanese (ja)
Other versions
JPH0449814Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986090515U priority Critical patent/JPH0449814Y2/ja
Publication of JPS62201937U publication Critical patent/JPS62201937U/ja
Application granted granted Critical
Publication of JPH0449814Y2 publication Critical patent/JPH0449814Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本案装置の1例の平面図、第2図はそ
の―線截断面図、第3図はその要部の拡大し
た截断側面図、第4図はそのパツド部分の平面図
である。 1…ウエハ、3…冷却手段、4…台座、5…パ
ツド、5a…金属箔、5b…各個所、5c…各中
間部。
Fig. 1 is a plan view of an example of the proposed device, Fig. 2 is a cross-sectional view taken along the line, Fig. 3 is an enlarged cross-sectional side view of its main parts, and Fig. 4 is a plan view of its pad portion. . DESCRIPTION OF SYMBOLS 1...Wafer, 3...Cooling means, 4...Pedestal, 5...Pad, 5a...Metal foil, 5b...Each part, 5c...Each intermediate part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] イオン注入その他の真空処理を施されるウエハ
を、冷却管その他の冷却手段を有する台座上に、
中間のパツドを介して当接して支承させる式のも
のにおいて、該パツドをアルミニウムその他の金
属箔の1枚或は積層する複数枚で構成させ、これ
を適宜間隔の複数個所において、ろう付、接着そ
の他により該台座側に結着させると共にその各中
間部を略山形に上方に隆起させて成るウエハの支
承装置。
The wafer to be subjected to ion implantation or other vacuum processing is placed on a pedestal equipped with cooling tubes or other cooling means.
In the case of a type in which the pads are abutted and supported through an intermediate pad, the pad is composed of one sheet or a plurality of laminated sheets of aluminum or other metal foil, which are brazed or bonded at multiple locations at appropriate intervals. A wafer support device, which is attached to the pedestal side by other means, and each intermediate portion thereof is raised upward in a substantially chevron shape.
JP1986090515U 1986-06-16 1986-06-16 Expired JPH0449814Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986090515U JPH0449814Y2 (en) 1986-06-16 1986-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986090515U JPH0449814Y2 (en) 1986-06-16 1986-06-16

Publications (2)

Publication Number Publication Date
JPS62201937U true JPS62201937U (en) 1987-12-23
JPH0449814Y2 JPH0449814Y2 (en) 1992-11-24

Family

ID=30950454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986090515U Expired JPH0449814Y2 (en) 1986-06-16 1986-06-16

Country Status (1)

Country Link
JP (1) JPH0449814Y2 (en)

Also Published As

Publication number Publication date
JPH0449814Y2 (en) 1992-11-24

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