JPS62259812A - 基材への樹脂の含浸方法 - Google Patents

基材への樹脂の含浸方法

Info

Publication number
JPS62259812A
JPS62259812A JP10403986A JP10403986A JPS62259812A JP S62259812 A JPS62259812 A JP S62259812A JP 10403986 A JP10403986 A JP 10403986A JP 10403986 A JP10403986 A JP 10403986A JP S62259812 A JPS62259812 A JP S62259812A
Authority
JP
Japan
Prior art keywords
base material
bubble
resin
impregnating
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10403986A
Other languages
English (en)
Japanese (ja)
Other versions
JPH042405B2 (2
Inventor
Takayuki Ban
隆行 伴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10403986A priority Critical patent/JPS62259812A/ja
Publication of JPS62259812A publication Critical patent/JPS62259812A/ja
Publication of JPH042405B2 publication Critical patent/JPH042405B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
JP10403986A 1986-05-07 1986-05-07 基材への樹脂の含浸方法 Granted JPS62259812A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10403986A JPS62259812A (ja) 1986-05-07 1986-05-07 基材への樹脂の含浸方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10403986A JPS62259812A (ja) 1986-05-07 1986-05-07 基材への樹脂の含浸方法

Publications (2)

Publication Number Publication Date
JPS62259812A true JPS62259812A (ja) 1987-11-12
JPH042405B2 JPH042405B2 (2) 1992-01-17

Family

ID=14370080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10403986A Granted JPS62259812A (ja) 1986-05-07 1986-05-07 基材への樹脂の含浸方法

Country Status (1)

Country Link
JP (1) JPS62259812A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113071022A (zh) * 2021-03-20 2021-07-06 惠州市纵胜电子材料有限公司 一种热固性树脂浸胶系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5695625A (en) * 1979-12-28 1981-08-03 Hitachi Chem Co Ltd Varnish immersing device for laminated substrate plate
JPS60112374U (ja) * 1983-12-28 1985-07-30 川崎製鉄株式会社 金属ストリツプのコ−テイング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5695625A (en) * 1979-12-28 1981-08-03 Hitachi Chem Co Ltd Varnish immersing device for laminated substrate plate
JPS60112374U (ja) * 1983-12-28 1985-07-30 川崎製鉄株式会社 金属ストリツプのコ−テイング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113071022A (zh) * 2021-03-20 2021-07-06 惠州市纵胜电子材料有限公司 一种热固性树脂浸胶系统
CN113071022B (zh) * 2021-03-20 2021-11-19 惠州市纵胜电子材料有限公司 一种热固性树脂浸胶系统

Also Published As

Publication number Publication date
JPH042405B2 (2) 1992-01-17

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