JPS6231972Y2 - - Google Patents
Info
- Publication number
- JPS6231972Y2 JPS6231972Y2 JP1979176256U JP17625679U JPS6231972Y2 JP S6231972 Y2 JPS6231972 Y2 JP S6231972Y2 JP 1979176256 U JP1979176256 U JP 1979176256U JP 17625679 U JP17625679 U JP 17625679U JP S6231972 Y2 JPS6231972 Y2 JP S6231972Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- wafer
- back plate
- flexible
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案はシリコンウエハその他のウエハを主と
してイオン注入処理に備えて背面から支承する真
空室内におけるバツクプレート装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a back plate device in a vacuum chamber for supporting silicon wafers and other wafers from the back side primarily in preparation for ion implantation processing.
本願出願人は、先にこの種装置として、例えば
第１図示のようにシリコンウエハその他のウエハ
ａを背面から支承するバツクプレートｂの前面
に、該ウエハａに対向させて内部に水その他の冷
却液ｃを充填する柔軟容器ｄを備える式のものを
提案したが、このものでは該容器ｄ内はその前面
に減圧を作用されるため、その内部の該冷却液は
混入する気泡或はその蒸気によりその上方に気体
部分ｅを生じ、かくて該冷却液ｃは該ウエハａの
全面に作用し得ず冷却能力が低下し勝ちとなる不
都合を伴う。 The applicant of the present application has previously developed an apparatus of this type, for example, as shown in FIG. We have proposed a type that includes a flexible container d that is filled with liquid c, but in this type, a reduced pressure is applied to the inside of the container d, so that the cooling liquid inside the container d is free from entrained air bubbles or its vapor. As a result, a gas portion e is generated above the wafer a, and thus the cooling liquid c cannot act on the entire surface of the wafer a, resulting in a disadvantage that the cooling capacity tends to decrease.
本考案はかゝる不都合のない装置を得ることを
その目的としたもので、シリコンウエハその他の
ウエハ１をその背面から支承するバツクプレート
２の前面に、該ウエハ１に対向させて前面が可撓
性薄膜で構成され内部に水その他の冷却液３を収
容する柔軟容器４を備える式のものにおいて、該
容器４の上方にこれと連通する密閉型のリザーブ
タンク５を備えることを特徴とする。 The purpose of the present invention is to obtain a device free of such inconveniences, and the front surface of the back plate 2, which supports a silicon wafer or other wafer 1 from its back surface, is provided with a front surface facing the wafer 1. A type equipped with a flexible container 4 made of a flexible thin film and containing water or other cooling liquid 3 therein, characterized in that a closed type reserve tank 5 is provided above the container 4 and in communication with the container. .
該容器４は例えば第３図に明示するようにバツ
クプレート２内から少しく前面に突出する円胴状
をなし、その前面を弗素樹脂その他の可撓性薄膜
４ａで構成して該前面を柔軟性とし、この部分に
おいて該ウエハ１と密着されるようにした。該ウ
エハ１はその後面の保護板６で保持されると共に
その前面の支持枠７で後方に押圧されるものと
し、更に該容器４内には冷媒を循環する冷却管８
を備えるもので、これらの点は先に提案したもの
と特に異らない。 The container 4 has a cylindrical shape that projects slightly to the front from within the back plate 2, as clearly shown in FIG. The wafer 1 was made to be in close contact with the wafer 1 at this portion. The wafer 1 is held by a protection plate 6 on the rear side and pressed backward by a support frame 7 on the front side, and a cooling pipe 8 for circulating a coolant is provided in the container 4.
These points are not particularly different from those proposed earlier.
本考案によれば、前記したようにその上方に密
閉型のリザーブタンク５を備えるもので、該タン
ク５は例えば第２図乃至第４図示のように該プレ
ート１の上部背面に円胴状に用意され、その上面
に気密に閉じる栓５ａを施すもので、該容器４内
に生ずる気体は該タンク５内に移行してその上方
に気体部分５ｂが作られ、かくて該容器４はその
内部に冷却液３が常に充満して冷却能力の低下を
生じないようにした。 According to the present invention, as described above, a closed type reserve tank 5 is provided above the plate 1, and the tank 5 has a cylindrical shape on the upper back surface of the plate 1 as shown in FIGS. 2 to 4, for example. The gas produced in the container 4 moves into the tank 5 and a gas portion 5b is created above it, and the container 4 is provided with a stopper 5a that closes airtightly on its upper surface. The cooling liquid 3 is always filled with the cooling liquid 3 to prevent the cooling capacity from decreasing.
この状態は例えば第４図に略同時に示される。 This state is shown approximately simultaneously in FIG. 4, for example.
このように本考案によるときは真空室内に設置
されるため、柔軟容器４の前面に減圧が作用さ
れ、該柔軟容器４が脹らんで該柔軟容器４内に気
体部分を生じても、この気体は直ちにリザーブタ
ンク５内に移行してその上部に気体部分を作るか
ら、柔軟容器４内は常に冷却液３で充満され、冷
却能力の低下がない効果を有する。 As described above, since the present invention is installed in a vacuum chamber, even if a reduced pressure is applied to the front surface of the flexible container 4 and the flexible container 4 inflates and a gas portion is generated inside the flexible container 4, this gas will not be removed. Since the liquid immediately moves into the reserve tank 5 and creates a gaseous portion in the upper part thereof, the inside of the flexible container 4 is always filled with the cooling liquid 3, which has the effect that the cooling capacity is not reduced.
さらに本考案によるときは、ウエハ１は柔軟容
器４にその可撓性薄膜４ａの部分で接触するの
で、密着度が良好となり、したがつてウエハ１の
冷却効率が良好となる効果を有する。 Further, according to the present invention, since the wafer 1 contacts the flexible container 4 through the flexible thin film 4a, the degree of adhesion is good, and therefore the cooling efficiency of the wafer 1 is improved.
第１図は従来例の説明線図、第２図は本案装置
の１例の正面図、第３図はその−線截断面
図、第４図はその作動を説明する線図である。
１……ウエハ、２……バツクプレート、３……
冷却液、４……柔軟容器、４ａ……可撓性薄膜、
５……リザーブタンク。
FIG. 1 is an explanatory diagram of a conventional example, FIG. 2 is a front view of an example of the present device, FIG. 3 is a cross-sectional view taken along the line 1, and FIG. 4 is a diagram illustrating its operation. 1...Wafer, 2...Back plate, 3...
Coolant, 4...Flexible container, 4a...Flexible thin film,
5... Reserve tank.
Claims (1)
ら支承するバツクプレート２の前面に、該ウエハ
１に対向させて前面が可撓性薄膜４ａで構成され
内部に水その他の冷却液３を収容する柔軟容器４
を備え、該容器４の上方にこれと連通する密閉型
のリザーブタンク５を備えることを特徴とする真
空室内におけるバツクプレート装置。 On the front surface of a back plate 2 that supports a silicon wafer or other wafer 1 from its back surface, a flexible container 4 is provided opposite to the wafer 1, the front surface of which is composed of a flexible thin film 4a, and which contains water or other cooling liquid 3.
A back plate device in a vacuum chamber, characterized in that it is equipped with a closed type reserve tank 5 above the container 4 and in communication with the container 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979176256U JPS6231972Y2 (en) | 1979-12-21 | 1979-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979176256U JPS6231972Y2 (en) | 1979-12-21 | 1979-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694038U JPS5694038U (en) | 1981-07-25 |
| JPS6231972Y2 true JPS6231972Y2 (en) | 1987-08-15 |
Family
ID=29686897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979176256U Expired JPS6231972Y2 (en) | 1979-12-21 | 1979-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6231972Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727765B2 (en) * | 1985-11-11 | 1995-03-29 | 日新電機株式会社 | Wafer holding device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027898U (en) * | 1973-07-06 | 1975-03-31 | ||
| JPS5841722Y2 (en) * | 1977-12-05 | 1983-09-20 | 日本真空技術株式会社 | Back plate device for ion implantation |
-
1979
- 1979-12-21 JP JP1979176256U patent/JPS6231972Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5694038U (en) | 1981-07-25 |
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