JPS6232595U - - Google Patents
Info
- Publication number
- JPS6232595U JPS6232595U JP12470485U JP12470485U JPS6232595U JP S6232595 U JPS6232595 U JP S6232595U JP 12470485 U JP12470485 U JP 12470485U JP 12470485 U JP12470485 U JP 12470485U JP S6232595 U JPS6232595 U JP S6232595U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- plate
- electronic component
- mechanically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す要部正面図、
第２図は第１図中―線階段断面図である。
１は電子部品、２は回路基板、３はケース、４
は放熱板、５は放熱フイン、６は絶縁シート、７
は伝熱板、８は取付ねじ、１０は固定ねじである
。
FIG. 1 is a front view of main parts showing an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the stairs taken along the line in FIG. 1. 1 is an electronic component, 2 is a circuit board, 3 is a case, 4
is a heat dissipation plate, 5 is a heat dissipation fin, 6 is an insulating sheet, 7
8 is a heat exchanger plate, 8 is a mounting screw, and 10 is a fixing screw.
Claims (1)
熱板を機械的かつ熱的に結合する装置であつて、
電子部品の放熱フインよりも十分に面積の大きな
細長形状の金属板により形成され放熱フインの全
面に密着して配設される伝熱板と、伝熱板と放熱
板との間を絶縁する絶縁シートとが放熱フインと
放熱板との間に介装され、伝熱板と放熱板とが絶
縁性を有した成型品の固定ねじを用いて伝熱板の
周部であつて放熱フインから離れた位置で機械的
に結合され、電子部品の放熱フインと伝熱板とが
金属製の取付ねじにより機械的かつ熱的に結合さ
れて成る電子部品の放熱装置。 A device for mechanically and thermally coupling a heat sink to a heat sink of an electronic component equipped with heat sinks,
A heat transfer plate formed of an elongated metal plate with a sufficiently larger area than the heat dissipation fins of electronic components and placed in close contact with the entire surface of the heat dissipation fins, and insulation that insulates between the heat transfer plate and the heat dissipation plate. A sheet is interposed between the heat dissipation fin and the heat dissipation plate, and the heat exchange plate and the heat dissipation plate are attached to the periphery of the heat exchange plate and separated from the heat dissipation fin using fixing screws made of insulating molded products. A heat dissipation device for an electronic component, in which a heat dissipation fin of the electronic component and a heat transfer plate are mechanically and thermally coupled by metal mounting screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12470485U JPS6232595U (en) | 1985-08-14 | 1985-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12470485U JPS6232595U (en) | 1985-08-14 | 1985-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6232595U true JPS6232595U (en) | 1987-02-26 |
Family
ID=31016964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12470485U Pending JPS6232595U (en) | 1985-08-14 | 1985-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232595U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371850U (en) * | 1989-11-14 | 1991-07-19 |
-
1985
- 1985-08-14 JP JP12470485U patent/JPS6232595U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371850U (en) * | 1989-11-14 | 1991-07-19 |
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