JPS6251972B2 - - Google Patents

Info

Publication number
JPS6251972B2
JPS6251972B2 JP60002275A JP227585A JPS6251972B2 JP S6251972 B2 JPS6251972 B2 JP S6251972B2 JP 60002275 A JP60002275 A JP 60002275A JP 227585 A JP227585 A JP 227585A JP S6251972 B2 JPS6251972 B2 JP S6251972B2
Authority
JP
Japan
Prior art keywords
circuit boards
weight
composition
parts
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60002275A
Other languages
English (en)
Other versions
JPS60219223A (ja
Inventor
Nyuueru Cherisu Reroi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS60219223A publication Critical patent/JPS60219223A/ja
Publication of JPS6251972B2 publication Critical patent/JPS6251972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】
〔産業上の利用分野〕 本発明は、少くとも６個の末端エポキシ基を有
するエポキシ化された非線状ノボラツクを含む組
成物に係る。 本発明の組成物は、優れた貯蔵寿命、硬化時の
高温特性、及び銅に対する良好な付着性を有し、
プリント回路板用マトリツクス材料として特に適
している。 〔従来技術〕 回路板は、ラジオ、テレビ、電気器具及び種々
の電気装置の如き分野の電気産業に於て広範囲に
用いられている。回路板を形成するために広く用
いられている技術は、織られたフアイバガラス・
シートに樹脂組成物を含浸させそして上記樹脂を
含浸されたフアイバガラス・シートの片側又は両
側に銅シートを積層化する方法である。次に、上
記銅シート中に電気回路をエツチングして、回路
板を形成し、使用時に上記回路板に電気接続体を
ろう付けすることができる。 回路板を形成するためにフアイバガラスに含浸
される種々の樹脂が従来提案されている。例え
ば、ポリイミド樹脂がその様な目的に用いられて
いる。ポリイミド樹脂を用いた場合には、高温に
対する優れた耐性、低い熱膨張、及び高い電気抵
抗を含む良好な電気特性を有する良質の回路板が
得られる。しかしながら、ポリイミド樹脂から形
成された回路板は、エポキシ樹脂を含浸されたフ
アイバガラス・シートから形成された回路板に比
べて、相対的に高価である。エポキシ樹脂を含浸
されたフアイバガラス・シートの回路板は、ポリ
イミド樹脂を用いて形成された回路板よりも相当
に安価であるが、ポリイミド樹脂を含浸されたフ
アイバガラス・シートの回路板に比べて、高温に
対する耐性が特に高くなく、より低い電気特性及
びより高い熱膨張を有している。更に、他の型の
樹脂系もこの目的のために提案されている。例え
ば、或る種のエポキシ樹脂と或る種の特定のビス
マレイミド材料との組合せが米国特許第4294877
号及び第4294743号の明細書に於て提案されてい
る。 樹脂組成物は、望ましくは、硬化時に、比較的
高いガラス転移温度及び高温に対する優れた耐性
を示すべきである。従つて、集積回路板用マトリ
ツクス材料として適当である組成物は、硬化時の
比較的高いガラス転移温度、低沸点溶媒中に於け
る可溶性及び安定性、フアイバガラス・シートへ
の付着性、低い熱膨張、並びに高い電気抵抗等の
多くの多様な特性を有していなければならない。 〔発明が解決しようとする問題点〕 本発明の目的は、低沸点溶媒中に於て極めて高
い安定性を示し、更に高温に対して極めて優れた
耐性を有し、硬化時に極めて低い熱膨張特性を有
する組成物を提供することである。 〔問題点を解決するための手段〕 本発明は、低沸点溶媒中に於て極めて高い安定
性を示し、更に高温に対して極めて優れた耐性を
有し、硬化時に極めて低い熱膨張特性を有する組
成物を提供する。 本発明の組成物は、(A)約25乃至30重量部の、約
350乃至約450エポキシ当量を有するビスフエノー
ル―Ａの四臭素化ジグリシジン・エーテルと、(B)
約10乃至約15重量部の、約600乃至約700エポキシ
当量を有するビスフエノール―Ａの四臭素化ジグ
リシジン・エーテルと、(C)約55乃至約65重量部
の、少くとも６個の末端エポキシ基を有する少く
とも１つのエポキシ化された非線状ノボラツクと
を含む。上記量は、上記組成物中の上記(A)、(B)及
び(C)の全重量に基づいている。 本発明の上記組成物は、硬化剤とともに繊維性
基板に含浸されて、製品を形成する。 〔実施例〕 本発明に於て用いられるエポキシ化ノボラツク
は、非線状（例えば、高度の枝分れを有する）で
なければならず、少くとも約６個の、好ましくは
約８個の末端エポキシ基を含んでいなければなら
ない。エポキシ化ノボラツク重合体は、一般に入
手可能であり、周知の方法により、多核２価フエ
ノールの熱可塑性フエノール―アルデヒドをハロ
ーエポキシ・アルカンを反応させることによつて
形成することができる。 多核２価フエノールは次式を有することができ
る。 上記式に於て、Arはナフチレン、好ましくは
フエニレンの如き２価の芳香族炭化水素であり、
相互に同一の又は異なるＡ及びA1は好ましくは
１乃至４個の炭素原子を有するアルキル基；弗
素、塩素、臭素及び沃素のハロゲン原子；又は好
ましくは１乃至４個の炭素原子を有するアルコキ
シ基であり、ｘ及びｙは置換基により置換えるこ
とができる芳香族の基（Ar）に於ける水素原子
の数に対応する０乃至最大値の整数であり、R1
はジヒドロオキシジフエニルに於ける如き隣接す
る炭素原子間の結合標であり、又は例えば、
〔発明の効果〕
本発明により、低沸点溶媒中に於て極めて高い
安定性を示し、更に高温に対して極めて優れた耐
性を有し、硬化時に極めて低い熱膨張特性を有す
る組成物が得られる。

Claims (1)

  1. 【特許請求の範囲】 １ 25乃至30重量部の、350乃至450エポキシ当量
    を有するビスフエノール―Ａの四臭素化ジグリシ
    ジル・エーテルと、 10乃至15重量部の、600乃至750エポキシ当量を
    有するビスフエノール―Ａの四臭素化ジグリシジ
    ル・エーテルと、 55乃至65重量部の、少くとも６個の末端エポキ
    シ基を有する少くとも１つのエポキシ化された非
    線状ノボラツクとを有む組成物。
JP60002275A 1984-04-16 1985-01-11 組成物 Granted JPS60219223A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US600619 1984-04-16
US06/600,619 US4550128A (en) 1984-04-16 1984-04-16 Epoxy composition

Publications (2)

Publication Number Publication Date
JPS60219223A JPS60219223A (ja) 1985-11-01
JPS6251972B2 true JPS6251972B2 (ja) 1987-11-02

Family

ID=24404330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60002275A Granted JPS60219223A (ja) 1984-04-16 1985-01-11 組成物

Country Status (4)

Country Link
US (1) US4550128A (ja)
EP (1) EP0158915B1 (ja)
JP (1) JPS60219223A (ja)
DE (1) DE3571831D1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590539A (en) * 1985-05-15 1986-05-20 Westinghouse Electric Corp. Polyaramid laminate
IT1190399B (it) * 1985-10-04 1988-02-16 Zambon Spa Processo per la preparazione di composti carbonilici otticamente attivi
US4690836A (en) * 1985-10-23 1987-09-01 International Business Machines Corp. Process for the production of void-free prepreg sheets
JPS62273226A (ja) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd 無電解メッキ用光硬化性レジスト樹脂組成物
EP0264705A3 (en) * 1986-10-10 1990-10-31 The Dow Chemical Company Blends of relatively low molecular weight epoxy resins and relatively high molecular weight epoxy or phenoxy resins and cured products therefrom
JPS641753A (en) * 1987-06-24 1989-01-06 Matsushita Electric Works Ltd Epoxy resin composition for glass-epoxy laminate
FR2633932B1 (fr) * 1988-07-05 1992-02-21 Europ Composants Electron Matiere thermodurcissable a base de resine epoxyde
DE3829662A1 (de) * 1988-09-01 1990-03-15 Basf Ag Epoxidharzmischungen fuer faserverbundwerkstoffe
EP0375980A3 (en) * 1988-12-29 1991-10-30 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
US5041470A (en) * 1989-03-03 1991-08-20 International Business Machines Corporation Flame retardant photocurable adhesive for wires and circuit boards
US5061779A (en) * 1989-03-14 1991-10-29 International Business Machines Corporation Liquid epoxy polymer composition and use thereof based on cycloaliphatic amine cured difunctional/polyfunctional resin blends
DE3915823A1 (de) * 1989-05-16 1990-11-22 Ruetgerswerke Ag Verfahren zur herstellung von verbundwerkstoffen
JPH0819213B2 (ja) * 1990-07-09 1996-02-28 三菱電機株式会社 エポキシ樹脂組成物および銅張積層板
US5510818A (en) * 1991-01-31 1996-04-23 Canon Kabushiki Kaisha Transfer-molding resin composition for use to manufacture ink jet recording head, and ink jet recording head manufactured by using the same
JP3106407B2 (ja) * 1991-02-06 2000-11-06 油化シエルエポキシ株式会社 電気積層板用エポキシ樹脂組成物
US5120339A (en) * 1991-04-04 1992-06-09 International Business Machines Corporation Method for fabricating a low thermal expansion coefficient glass fiber-reinforced polymer matrix composite substrate and composite substrate
JPH0597948A (ja) * 1991-10-09 1993-04-20 Sumitomo Chem Co Ltd 多価フエノール、それから誘導されるエポキシ樹脂及びエポキシ樹脂組成物
US5582872A (en) * 1994-03-28 1996-12-10 Current Inc. Electrostatic dissipative laminate and method for making
US5754088A (en) 1994-11-17 1998-05-19 International Business Machines Corporation Planar transformer and method of manufacture
KR20010012177A (ko) * 1997-05-02 2001-02-15 아이솔라 라미네이트 시스템스 코포레이션 회로판용의 압출된 코어 적층체
US6858378B1 (en) * 2002-04-17 2005-02-22 Sandia National Laboratories Photoimageable composition
KR100995678B1 (ko) * 2008-09-01 2010-11-22 주식회사 코오롱 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물
CN102695744A (zh) 2009-11-06 2012-09-26 陶氏环球技术有限责任公司 用于电层合体的存储稳定的环氧树脂组合物
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1643309U (de) * 1952-02-11 1952-09-04 Loewe Opta Ag Schallplattengeraet mit mitteln zur inbetriebnahme von schallplatten verschiedener laufgeschwindigkeit.
US3016362A (en) * 1957-09-05 1962-01-09 Pittsburgh Plate Glass Co Blend of a halogenated aromatic polyglycidyl ether and an aliphatic polyglycidyl ether
US3058946A (en) * 1958-08-05 1962-10-16 Michigan Chem Corp Plastic product comprising cured mixture of a brominated polyepoxide and a non-halogenated polyepoxide
NL260277A (ja) * 1960-01-20
US3086888A (en) * 1961-03-27 1963-04-23 Ite Circuit Breaker Ltd Composition, and method for insulating electrical conductors, and coated electrical conductors
US3268619A (en) * 1962-10-12 1966-08-23 Michigan Chem Corp Flame retardant epoxy resins
US3378434A (en) * 1964-06-18 1968-04-16 Westinghouse Electric Corp Fire-resistant paper-base epoxy resin laminates
US4101693A (en) * 1971-08-05 1978-07-18 General Electric Company Method of preparing epoxy-glass prepregs
US3983056A (en) * 1973-09-27 1976-09-28 Dai Nippon Toryo Co., Ltd. Aqueous epoxy resin paint composition
US3957716A (en) * 1973-10-01 1976-05-18 Hercules Incorporated Sized carbon fibers
US3888942A (en) * 1973-12-13 1975-06-10 Gen Electric Resinous compositions and laminates made therefrom
AT336284B (de) * 1974-05-01 1977-04-25 Western Electric Co Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften
US4009223A (en) * 1974-05-08 1977-02-22 Westinghouse Electric Corporation Thin film electrostatic epoxy coating powder
US4040993A (en) * 1976-02-25 1977-08-09 Westinghouse Electric Corporation Low dissipation factor electrostatic epoxy wire coating powder
US4169187A (en) * 1977-04-01 1979-09-25 E. I. Du Pont De Nemours And Company Powder coating composition of a mixture of epoxy resins
US4251426A (en) * 1979-02-06 1981-02-17 E. I. Du Pont De Nemours And Company Epoxy resin powder primer compositions
DE3109803A1 (de) * 1981-03-13 1982-09-30 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Epoxy-imid-zusammensetzungen
US4474929A (en) * 1983-09-30 1984-10-02 The Dow Chemical Company Polyglycidyl ethers of branched novolacs

Also Published As

Publication number Publication date
EP0158915B1 (en) 1989-07-26
DE3571831D1 (en) 1989-08-31
US4550128A (en) 1985-10-29
EP0158915A2 (en) 1985-10-23
EP0158915A3 (en) 1986-10-08
JPS60219223A (ja) 1985-11-01

Similar Documents

Publication Publication Date Title
KR101811914B1 (ko) 열경화성 에폭시수지 조성물 및 그 용도
US6534179B2 (en) Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
US5160783A (en) Epoxy resin-impregnated glass cloth sheet having adhesive layer
EP0158915B1 (en) Epoxy composition and application thereof
JP4277123B2 (ja) 印刷配線板用樹脂組成物、プリプレグ、積層板、及びこれを用いたプリント配線板
KR100632169B1 (ko) 다층 인쇄 회로 기판용 층간 절연 접착제
JPS59210946A (ja) 耐炎性積層板
US4759978A (en) Epoxy resin composition
GB2056470A (en) Process for preparing imide type prepolymers
JP2007308640A (ja) 積層板用樹脂組成物、有機基材プリプレグ、金属張積層板およびプリント配線板
KR0139001B1 (ko) 방향족 디아민 경화제를 포함하는 에폭시 수지 조성물
WO2024139302A1 (zh) 树脂组合物及其应用
JP3809273B2 (ja) エポキシ樹脂組成物
JP2004059777A (ja) 難燃性接着剤組成物及びフレキシブル銅張積層板とその関連製品
JP4346045B2 (ja) 金属張り積層板の製造方法
JPH0959346A (ja) 積層板用エポキシ樹脂組成物
US4597996A (en) Process of laminating with an epoxy composition
EP0556421A1 (en) Curable resin compositions
WO1992022422A1 (en) Shape retaining flexible electrical circuit
JP2711149B2 (ja) 耐熱難燃性エポキシ樹脂組成物
JPH0717729B2 (ja) エポキシ樹脂組成物を含浸してなる電気電子機器積層板用基材
JPS60260618A (ja) 難燃性エポキシ樹脂組成物
JPH0470328B2 (ja)
JPH04224820A (ja) エポキシ樹脂組成物
JPH03110145A (ja) 積層板の製造方法