JPS6252994A - Method for forming curved circuit board - Google Patents
Method for forming curved circuit boardInfo
- Publication number
- JPS6252994A JPS6252994A JP19285385A JP19285385A JPS6252994A JP S6252994 A JPS6252994 A JP S6252994A JP 19285385 A JP19285385 A JP 19285385A JP 19285385 A JP19285385 A JP 19285385A JP S6252994 A JPS6252994 A JP S6252994A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- curved
- board
- substrate
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［発明の技術分野］ この発明は曲面回路基体の形成力法に関する。[Detailed description of the invention] [Technical field of invention] This invention relates to a forming force method for curved circuit substrates.
［従来技術とその問題点］
曲や折曲等の曲面を有する曲面笛体、曲面プリント基板
等にスクリーン印刷による曲面回路を形成する際には各
種の困難が伴なう、このため、従来から、曲面回路を形
成するために、メタルコアのような変形町滝な基板上に
導体を作成し、これをエツチングで回路パターンを形成
した後に所定形状に加工したり、あるいは曲面上にスパ
ッタリングや真空蒸着で導体を作成した後に回路パター
ンな形成していたが、このような従来法では材質が限定
されたり、高価な装着を必要とし、製作費が高価になる
とともに、使用範囲が限定されるなどの欠へかあった。[Prior art and its problems] Various difficulties arise when forming curved circuits by screen printing on curved flute bodies with curved or bent surfaces, curved printed circuit boards, etc. In order to form a curved circuit, a conductor is created on a deformed substrate such as a metal core, which is etched to form a circuit pattern and then processed into a predetermined shape, or sputtered or vacuum evaporated onto the curved surface. The circuit pattern was formed after the conductor was created using conventional methods, but this method limited the materials available, required expensive mounting, increased manufacturing costs, and limited the scope of use. There was something missing.
［発明の目的］
易かつ確実に形成できるとともに、高価な装ぬこも必要
としないので、簡便かつ低価格で曲面回路基体が形成で
きるようにした曲面回路基体の形成方法を提供しようと
するものである。[Objective of the Invention] It is an object of the present invention to provide a method for forming a curved circuit board that can be easily and reliably formed and does not require an expensive mounting plate, so that the curved circuit board can be formed easily and at a low cost. be.
「発明の要点］
この発明は上述した目的を達成するために、基板上に絶
縁性被膜、導電性ペーストを順次被覆して回路基体を形
成した後に、これらを液中に浸して基板より回路基体を
、ｕｌｌｔＬ、この剥離した回路基体を加熱プレスによ
り塑性変形して所定の曲面を形成し、これを曲面基体等
に接着するようにした点を要旨としたものである。[Summary of the Invention] In order to achieve the above-mentioned object, this invention forms a circuit board by sequentially coating an insulating film and a conductive paste on a board, and then immersing them in a liquid to form a circuit board from the board. The gist is that the peeled circuit board is plastically deformed by hot pressing to form a predetermined curved surface, and this is bonded to a curved board or the like.
以下、この発明を図面に示す実施例により説明する０図
中１は上板状のガラス板よりなる基板金
で、このｆ板ｌの上面の筒面に例えばフェノール樹脂を
ベースとし、たペースト状の絶縁性皮膜２を被覆して基
体ベースを形成する。そして、第１図に示すように、上
記絶縁性皮膜２が常温又は高温で硬化が半ば進んだ状態
で、この絶縁性皮膜２の上面にこれと同系樹脂をベース
とした導゛−に性ペースト３（導電性物質としては例え
ばＡｕ、Ａｇ等）によりスクリーン印刷を行って所定の
回路パターンを形成し、これらを完全に硬化させて、基
板１上に、絶縁性被膜２、導電性ペースト３よりなる回
路基体４を形成する。そして、第２図に示すように上記
被膜２、導電性ペースト３が完全に硬化した後に、基板
１とこれに付着している回路基体４を容器５内の液６中
（この液は水あるいは溶剤でもよい）に浸すと１回路基
体４が基板ｌより剥離して遊離し、この遊離した回路基
体４を液６申より取出して十分に乾燥させると、厚さが
数１０ｇｍ〜１１００ルｍ程度のフレキシブルな薄板状
の回路基体４が形成される。このようにして形成された
回路基体４を第３図に示すような所定曲面状の加圧面を
有する加熱プレス７により加熱プレスして塑性変形させ
て、所定曲面を有する回路基体４を形成する。そして、
第４図に示すように、所定の曲面が形成された回路基体
４を接着剤８により曲面筐体または曲面基板等よりなる
曲面基体９の所定個所に接着すると、曲面基体９の上＋
ｆｆｉにこれの曲面に対応して所定の回路基体４よりな
る導電パターンを確実に形成することができるなお、回
路基体４を加熱プレス７により塑性変形させる際には曲
面基体９の所定形状に応じて加工することは勿論であり
、また、曲面基体９の代りに曲面プリント基板等にも適
用できる。Hereinafter, this invention will be explained with reference to the embodiments shown in the drawings. In the drawings, reference numeral 1 indicates a metal substrate made of an upper plate-like glass plate, and on the cylindrical surface of the upper surface of this f plate l, a paste based on, for example, phenol resin is applied. A substrate base is formed by covering the substrate with an insulating film 2 . As shown in FIG. 1, while the insulating film 2 is halfway cured at room temperature or high temperature, a highly conductive paste based on the same type of resin is applied to the upper surface of the insulating film 2. 3 (as a conductive material, for example, Au, Ag, etc.) is screen printed to form a predetermined circuit pattern, and after completely curing these, an insulating coating 2 and a conductive paste 3 are coated on the substrate 1. A circuit board 4 is formed. As shown in FIG. 2, after the coating 2 and the conductive paste 3 are completely cured, the substrate 1 and the circuit board 4 attached thereto are placed in a liquid 6 in a container 5 (this liquid may be water or When immersed in a solution (which may also be a solvent), the circuit board 4 is separated from the board L and released, and when the released circuit board 4 is taken out from the solution and dried thoroughly, it has a thickness of about 10 gm to 1100 lm. A flexible thin plate-like circuit board 4 is formed. The circuit board 4 thus formed is heated and pressed by a hot press 7 having a pressing surface of a predetermined curved shape as shown in FIG. 3 to plastically deform it, thereby forming the circuit board 4 having a predetermined curved surface. and,
As shown in FIG. 4, when a circuit board 4 on which a predetermined curved surface is formed is adhered to a predetermined location of a curved base 9 made of a curved casing or a curved board with an adhesive 8, the upper surface of the curved base 9 is
A conductive pattern made of a predetermined circuit board 4 can be reliably formed on the ffi in accordance with the curved surface of the circuit board 4. Note that when the circuit board 4 is plastically deformed by the hot press 7, the conductive pattern is Of course, the present invention can also be applied to a curved printed circuit board instead of the curved substrate 9.
また、上記実施例では基板ｌとしてガラス板を使用した
が、これに限らず、絶縁性成［２と剥離しやすい材料、
例えば鏡面仕上げのステンレス板等でも差支えないし、
また、上記被膜２、導電性ペースト３は互いに密着性の
優れた材料が好ましい。In addition, although a glass plate was used as the substrate l in the above embodiment, it is not limited to this.
For example, a stainless steel plate with a mirror finish can be used.
Furthermore, the coating 2 and the conductive paste 3 are preferably made of materials that have excellent adhesion to each other.
［発明の効果］
この発明は以上詳細に説明したように、基板上に絶縁性
被膜、導電性ペースト、を順次被膜して回路基体を形成
した後に、これらを液中に浸して基板より回路基体を剥
離し、この剥離した回路基体を加熱プレスにより塑性変
形して所定の曲面を形成し、これを曲面基体に接着する
ようにしたので、任意の曲面回路基体が容易かつ確実に
形成できるとともに、高価な装置も必要としないので、
筒便かつ低価格の曲面回路基体が形成できる。[Effects of the Invention] As described above in detail, the present invention is to form a circuit board by sequentially coating an insulating film and a conductive paste on a substrate, and then immersing them in a liquid to form a circuit board from the board. The peeled circuit board is plastically deformed by hot pressing to form a predetermined curved surface, and this is bonded to the curved board, so any curved circuit board can be easily and reliably formed. Doesn't require expensive equipment,
A convenient and low-cost curved circuit board can be formed.
第１図ないし第４図はこの発明の一実施例の各工程を順
次説明するための各説明図である。
ｌ・・・・・・基板、２・・・・・・絶縁性皮膜、３・
・・・・・導電性ペースト、４・・・・・・回路基体、
５・・・・・・容器、６・・・・・・液、７・・・・・
・加熱プレス、８・・・・・・接着剤、９・・・・・・
曲面基体。
特許出願人 カシオ計算機株式会社
フジ電子株式会社
第３図
第４図1 to 4 are explanatory diagrams for sequentially explaining each step of an embodiment of the present invention. l...Substrate, 2...Insulating film, 3.
... Conductive paste, 4 ... Circuit substrate,
5...container, 6...liquid, 7...
・Heating press, 8...Adhesive, 9...
Curved base. Patent applicant Casio Computer Co., Ltd. Fuji Electronics Co., Ltd. Figure 3 Figure 4
Claims (1)
後に、この絶縁性皮膜上に導電性ペーストにより所定の
回路パターンを形成し、上記被皮、導電性ペーストによ
り所定の回路基体を構成し、この回路基体が硬化した後
にこれらを液中に浸して基板と回路基体を剥離させ、剥
離した回路基体を加熱プレスにより塑性変形させて任意
の所定曲面を有する回路基体を形成し、この所定曲面の
回路基体を接着剤により曲面基体の所定個所に接着する
ようにしたことを特徴とする曲面回路基体の形成方法。After forming a substrate base by coating an insulating film on a substrate, a predetermined circuit pattern is formed on this insulating film using a conductive paste, and a predetermined circuit substrate is formed by the above-mentioned coating and conductive paste. After the circuit board is cured, the board and the circuit board are separated by immersing them in a liquid, and the separated circuit board is plastically deformed by heat pressing to form a circuit board having an arbitrary predetermined curved surface. 1. A method for forming a curved circuit board, characterized in that the circuit board is adhered to a predetermined location of a curved board using an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19285385A JPH06101618B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19285385A JPH06101618B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6252994A true JPS6252994A (en) | 1987-03-07 |
| JPH06101618B2 JPH06101618B2 (en) | 1994-12-12 |
Family
ID=16298057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19285385A Expired - Lifetime JPH06101618B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06101618B2 (en) |
-
1985
- 1985-08-31 JP JP19285385A patent/JPH06101618B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06101618B2 (en) | 1994-12-12 |
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